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AEP Model

UK Model

E Model

Australian Model

2005E05-1

© 2005.05

CX-JT8 is the tumer, amplifier, cassette deck
and CD player section in JAX-T8 and JAX-PK8.

FM tuning range

87.5 MHz to 108 MHz

FM 

usable sensitivity (IHF)

16.8 dBf

FM 

antenna terminal

75 ohms  (unbalanced)

AM tuning 

range

531 kHz  to 1602  kHz

AM 

usable sensitivity

350 

µV/m

AM 

antenna

Loop antenna

Power 

output

Front:
Rated: 144 W + 144  W  (6 ohms,
T.H.D. 

1 %, 1 kHz/DIN 45500)

Reference: 

180 W + 180 W (6 ohms,

T.H.D. 

10 %, 1 kHz/DIN 45324)

MUSIC 

POWER: 320 W + 320 W

125 

W +  55 W (6 ohms, T .H.D.

10 

%, 1 kHz/DIN AUDIO)

Total 

har monic  distortion

0.08  % (90 W, 1 kHz, 6 ohms, DIN

 

AUDIO)

Input

MD (VIDEO): 1.5 V

Outputs

SPEAKERS: 6 ohms or  more

PHONES: 

32 ohms or  more

Track 

format

4 tracks, 2 channels stereo

Frequency 

response

50 Hz  – 8 kHz

Recording 

system

AC bias

Heads

Deck A: playback x 1

Deck 

B: recording/playback x  1,

erase 

x 1

Laser

Semiconductor laser

(

λ = 780 nm)

Emission duration:
continuous

D/A converter

1 bit dual

Signal-to-noise ratio

85  dB (1 kHz, 0 dB)

Harmonic distortion

0.05 % (1 kHz, 0 dB)

Power requirements

230 V AC, 50/60 Hz

Power consumption

210 W

Power consumption

With ECO mode on: 0.25 W

  in standby mode

With ECO mode off: 24 W

Dimensions (W x  H x D)

280 x 328 x 437 mm

Weight

10.3 kg

Specifications and external appearance are subject to 
change without notice. 

COPYRIGHT
Check copyright laws relevant to recordings from discs, 
or tape for the country  where  the unit  is to be used.

Licensed by BBE Sound, Inc. under USP4638258, 5510752
and 5736897.

(AEP, UK, CIS, E, SP, AUS) 

280 x 328 x 446 mm (E51)

• Abbreviation

AUS : Australian model
E51 : Chilean and Peruvian models
SP : Singapore model

Model Name Using Similar Mechanism

NEW

CD

CD Mechanism Type

CDM74F-K6BD71A

Section

Base Unit Name

BU-K6BD71A

Optical Block Name

KSM-213DCP

Optical Pick-up Name

KSS-213D

Tape deck

Model Name Using Similar Mechanism

NEW

Section

Tape Transport Mechanism Type

CWM43RR23

2

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.

0

0

CLASS 1 LASER PRODUCT

LUOKAN 1 LASER LAITE

KLASS 1 LASER APPARA

T

This appliance is classified
as a CLASS 1 LASER
product.

This label is located on the
rear exterior.

3

................................................

4

Location of Controls .......................................................

7

3-1. Disassembly Flow ...........................................................

9

3-2. Case (SIDE-L/R) ............................................................. 10
3-3. Case (Top) ....................................................................... 10
3-4. Tray Panel ........................................................................ 11
3-5. CD Mechanism Deck (CDM74F-K6BD71A) ................ 11
3-6. Front Panel Section ......................................................... 12
3-7. Mechanical Deck ............................................................. 12
3-8. Rear Cabinet Section ...................................................... 13
3-9. Main Board ...................................................................... 13
3-10. Power Board .................................................................... 14
3-11. Transformer Board .......................................................... 14
3-12 Table Assy ....................................................................... 15
3-13. Motor (TB) Board ........................................................... 15
3-14. Motor (LD) Board ........................................................... 16
3-15. Base Unit (BU-K6BD71A) ............................................. 16
3-16. Motor Gear Assy (Sled) (M701), BD Board .................. 17
3-17. Optical Pick-up (KSS-213D) .......................................... 17

.............................................................. 18

CD Section ...................................................................... 21

6-1. Block Diagram  – CD Section – ..................................... 22
6-2. Block Diagram  – TUNER/TAPE/PANEL Section – ..... 23
6-3. Block Diagram  – AMP/POWER SUPPLY Section – ... 24
6-4. Note for Printed Wiring Boards and

Schematic Diagrams ....................................................... 25

6-5. Printed Wiring Board  – BD Board – ............................. 26
6-6. Schematic Diagram  – BD Board – ................................ 27
6-7. Printed Wiring Boards  – CHANGER Section – ............ 28
6-8. Schematic Diagram  – CHANGER Section – ................ 29
6-9. Schematic Diagram

– MAIN Board (1/4) (Suffix-11) – ................................. 30

6-10. Schematic Diagram

– MAIN Board (2/4) (Suffix-11) – ................................. 31

6-11. Schematic Diagram

– MAIN Board (3/4) (Suffix-11) – ................................. 32

6-12. Schematic Diagram

– MAIN Board (4/4) (Suffix-11) – ................................. 33

6-13. Printed Wiring Board  – MAIN Board (Suffix-11) – ..... 34
6-14. Printed Wiring Board  – MAIN Board (Suffix-13) – ..... 35
6-15. Schematic Diagram

– MAIN Board (1/4) (Suffix-13) – ................................. 36

6-16. Schematic Diagram

– MAIN Board (2/4) (Suffix-13) – ................................. 37

6-17. Schematic Diagram

– MAIN Board (3/4) (Suffix-13) – ................................. 38

6-18. Schematic Diagram

– MAIN Board (4/4) (Suffix-13) – ................................. 39

6-19. Printed Wiring Board  – POWER Board –

(AEP, UK, CIS, E51 models) .......................................... 40

6-20. Printed Wiring Board  – POWER Board –

(E, SP, AUS models) ....................................................... 41

6-21. Schematic Diagram  – POWER Board (1/2) – ............... 42
6-22. Schematic Diagram  – POWER Board (2/2) – ............... 43
6-23. Printed Wiring Boards  – CD BUTTON/

HEADPHONE/MICROPHONE Boards – ..................... 44

6-24. Schematic Diagram  – CD BUTTON/

HEADPHONE/MICROPHONE Boards – ..................... 45

6-25. Printed Wiring Board  – PANEL Board – ...................... 46
6-26. Schematic Diagram  – PANEL Board – ......................... 47
6-27. Printed Wiring Board  – TRANSFORMER Board –

(AEP, UK, CIS, E51 models) .......................................... 48

6-28. Printed Wiring Board  – TRANSFORMER Board –

(E, SP, AUS models) ....................................................... 49

6-29. Schematic Diagram  – TRANSFORMER Board –

(AEP, UK, CIS, E51 models) .......................................... 50

6-30. Schematic Diagram  – TRANSFORMER Board –

(E, SP, AUS models) ....................................................... 51

6-31. IC Pin Function Description ........................................... 55

7-1. Case Section .................................................................... 61
7-2. Front Panel Section-1 ...................................................... 62
7-3. Front Panel Section-2 ...................................................... 63
7-4. Front Panel Section-3 ...................................................... 64
7-5. Front Panel Section-4 ...................................................... 65
7-6. Chassis Section-1 ............................................................ 66
7-7. Chassis Section-2 ............................................................ 67
7-8. CD Mechanism Deck Section-1

(CDM74F-K6BD71A) .................................................... 68

7-9. CD Mechanism Deck Section-2

(CDM74F-K6BD71A) .................................................... 69

7-10. CD Mechanism Deck Section-3

(CDM74F-K6BD71A) .................................................... 70

7-11. Base Unit Section (BU-K6BD71A) ............................... 71

............................... 72

• Abbreviation

AUS : Australian model
E51 : Chilean and Peruvian models
SP

: Singapore model

4

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.

MODEL

PART No.

Chilean and Peruvian models

4-245-109-0

[]

AEP, UK, CIS and Australian models

4-245-109-2

[]

E and Singapore models

4-245-109-7

[]

PART No.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

D324

CN309

IC303

CN312

•

Either type of the MAIN board, Part No. 1-688-080-11 or 1-688-
080-13 is used for Chilean and Peruvian models.

For other models, only one type of the MAIN board, Part No. 1-
688-080-13 is used.

How to identify the type is described below.

D324

Suffix-11

×

Suffix-13

a