Sony CMT-M373NT / HCD-M373 Service Manual ▷ View online
HCD-M373
MICRO HI-FI COMPONENT SYSTEM
SPECIFICATIONS
HCD-M373 is the Amplifier, CD player, MD
deck, Tape player and Tuner section in
CMT-M373NT.
deck, Tape player and Tuner section in
CMT-M373NT.
Model Name Using Similar Mechanism
HCD-M333
CD Mechanism Type
CDM55A-30BBD61B
Base Unit Type
BU-30BBD61B
Optical Pick-up Type
A-MAX. 3
Model Name Using Similar Mechanism
HCD-CP505
MD Mechanism Type
MDM-7S2D
Optical Pick-up Type
KMS-262E
Model Name Using Similar Mechanism
HCD-M333
Tape Transport Mechanism Type
CMAL1Z-236A
CD
Section
MD
Section
Tape deck
Section
9-877-510-01
2004C1678-1
© 2004.03
Ver 1.0 2004.03
SERVICE MANUAL
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
Amplifier section
DIN power output (rated): 20 + 20 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
25 + 25 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Music power output (reference):
45 + 45 W
Inputs
ANALOG IN:
ANALOG IN:
Sensitivity 250 mV,
impedance 47 kilohms
impedance 47 kilohms
DIGITAL OPTICAL IN (supported sampling
frequencies: 32 kHz, 44.1 kHz and 48 kHz)
Outputs
PHONES (stereo minijack):
frequencies: 32 kHz, 44.1 kHz and 48 kHz)
Outputs
PHONES (stereo minijack):
accepts headphones with
an impedance of 8 ohms or
more
an impedance of 8 ohms or
more
SPEAKER:
accepts impedance of 6 to
16 ohms
16 ohms
CD player section
Laser
Semiconductor laser
(CD:
λ=780 nm)
Emission duration:
continuous
continuous
Frequency response
2 Hz – 20 kHz
MD deck section
System
Minidisc digital audio
system
system
Laser
Semiconductor laser
(
(
λ=780 nm)
Emission duration:
continuous
continuous
Sampling frequency
44.1 kHz
Frequency response
5 Hz – 20 kHz
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
60 – 10,000 Hz (
±3 dB),
using Sony TYPE I
cassettes
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
(50 kHz step)
Aerial
FM lead aerial
Aerial terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 9 kHz)
Aerial
AM loop aerial, external
aerial terminal
aerial terminal
Intermediate frequency
450 kHz
General
Power requirements
230 V AC, 50/60 Hz
Power consumption
65 W
0.3 W or less (in Power
Saving mode)
0.3 W or less (in Power
Saving mode)
US and foreign pafents lisensed from Dolby
Labaratories.
Labaratories.
— Continued on next page —
AEP Model
UK Model
2
HCD-M373
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
FOR CD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
FOR MD
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
checking it for adjustment. It is feared that you will lose your sight.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
The following caution label is located inside the apparatus.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Mass
Amplifier/Tuner/Tape/MD/CD section:
Amplifier/Tuner/Tape/MD/CD section:
Approx. 5.6 kg
Design and specifications are subject to change
without notice.
without notice.
Amplifier/Tuner/Tape/MD/CD section:
Approx. 160
× 217 × 345
mm
Dimensions (w/h/d) incl. projecting parts and controls
3
HCD-M373
1. SERVICING NOTE
························································ 10
2. GENERAL
········································································ 14
3. DISASSEMBLY
······························································ 16
3-1.
Top Panel Section ······················································· 17
3-2.
Cassette Mechanism Deck ········································· 18
3-3.
Front Panel Section ···················································· 18
3-4.
PANEL Board, HP Board, LED Board ······················ 19
3-5.
Back Panel Section ····················································· 20
3-6.
MAIN Board ······························································ 20
3-7.
MD Mechanism Deck (MDM-7S2D) ························ 21
3-8.
DIGITAL Board ························································· 21
3-9.
Holder Assy ································································ 22
3-10. BD (MD) Board ························································· 22
3-11. Motor Section ····························································· 23
3-12. Over Write Head (HR901) ········································· 23
3-13. Mini Disc Device (KMS-262E) ································· 24
3-14. POWER Board, Tuner (FM/AM) ······························· 24
3-15. REG Board, AMP Board ············································ 25
3-16. TRANS Board ···························································· 25
3-17. CD Mechanism Deck (CDM55A-30BBD61B) ········· 26
3-18. Cam (CDM55) ··························································· 26
3-19. Base Unit (BU-30BBD61B) ······································ 27
3-20. Optical Pick-Up (BU-30B Assy) ································ 27
3-11. Motor Section ····························································· 23
3-12. Over Write Head (HR901) ········································· 23
3-13. Mini Disc Device (KMS-262E) ································· 24
3-14. POWER Board, Tuner (FM/AM) ······························· 24
3-15. REG Board, AMP Board ············································ 25
3-16. TRANS Board ···························································· 25
3-17. CD Mechanism Deck (CDM55A-30BBD61B) ········· 26
3-18. Cam (CDM55) ··························································· 26
3-19. Base Unit (BU-30BBD61B) ······································ 27
3-20. Optical Pick-Up (BU-30B Assy) ································ 27
4. TEST MODE
···································································· 28
5. ELECTRICAL ADJUSTMENTS
TAPE SECTION ·································································· 33
CD SECTION ······································································ 35
MD SECTION ····································································· 36
CD SECTION ······································································ 35
MD SECTION ····································································· 36
6. DIAGRAMS
6-1.
Circuit Boards Location ············································· 47
6-2.
Block Diagrams
– CD Section – ··························································· 48
– MD Section – ·························································· 49
– USB Section – ························································· 50
– MAIN Section – ······················································ 51
– CD Section – ··························································· 48
– MD Section – ·························································· 49
– USB Section – ························································· 50
– MAIN Section – ······················································ 51
TABLE OF CONTENTS
6-3.
Printed Wiring Board – BD (CD) Board – ················· 52
6-4.
Schematic Diagram – BD (CD) Board – ··················· 53
6-5.
Printed Wiring Board – BD (MD) Board – ················ 54
6-6.
Schematic Diagram – BD (MD) Board (1/2) – ·········· 55
6-7.
Schematic Diagram – BD (MD) Board (2/2) – ·········· 56
6-8.
Printed Wiring Board – DIGITAL Board – ················ 57
6-9.
Schematic Diagram – DIGITAL Board (1/2) – ·········· 58
6-10. Schematic Diagram – DIGITAL Board (2/2) – ·········· 59
6-11. Printed Wiring Board – TC Board – ·························· 60
6-12. Schematic Diagram – TC Board – ····························· 61
6-13. Printed Wiring Board – MAIN Section – ··················· 62
6-14. Schematic Diagram – MAIN Section (1/2) – ············· 63
6-15. Schematic Diagram – MAIN Section (2/2) – ············· 64
6-16. Printed Wiring Board – HP Board – ·························· 65
6-17. Schematic Diagram – HP Board – ····························· 66
6-18. Printed Wiring Board – PANEL Section – ················· 67
6-19. Schematic Diagram – PANEL Section – ···················· 68
6-20. Printed Wiring Board
6-11. Printed Wiring Board – TC Board – ·························· 60
6-12. Schematic Diagram – TC Board – ····························· 61
6-13. Printed Wiring Board – MAIN Section – ··················· 62
6-14. Schematic Diagram – MAIN Section (1/2) – ············· 63
6-15. Schematic Diagram – MAIN Section (2/2) – ············· 64
6-16. Printed Wiring Board – HP Board – ·························· 65
6-17. Schematic Diagram – HP Board – ····························· 66
6-18. Printed Wiring Board – PANEL Section – ················· 67
6-19. Schematic Diagram – PANEL Section – ···················· 68
6-20. Printed Wiring Board
– REG Board / TRANS Board – ································ 69
6-21. Schematic Diagram – REG Board / TRANS Board – 70
6-22. Printed Wiring Board – AMP Board – ······················· 71
6-23. Schematic Diagram – AMP Board – ·························· 72
6-24. Printed Wiring Board – POWER Board – ·················· 73
6-25. Schematic Diagram – POWER Board – ···················· 74
6-26. IC Pin Function Description ······································ 84
6-22. Printed Wiring Board – AMP Board – ······················· 71
6-23. Schematic Diagram – AMP Board – ·························· 72
6-24. Printed Wiring Board – POWER Board – ·················· 73
6-25. Schematic Diagram – POWER Board – ···················· 74
6-26. IC Pin Function Description ······································ 84
7. EXPLODED VIEWS
7-1.
Overall Section ··························································· 90
7-2.
Front Panel Section ···················································· 91
7-3.
Chassis Section ·························································· 92
7-4.
MD Mechanism Deck Section-1 (MDM-7S2D) ········ 93
7-5.
MD Mechanism Deck Section-2 (MDM-7S2D) ········ 94
7-6.
CD Mechanism Deck Section
(CDM55A-30BBD61B) ············································· 95
(CDM55A-30BBD61B) ············································· 95
7-7.
Base Unit Section (BU-30BBD61B) ························· 96
8. ELECTRICAL PARTS LIST
······································· 97
4
HCD-M373
This system has a Self-diagnosis display
function to let you know if there is a system
malfunction. The display shows a code made up
of three or five letters and a message alternately
to show you the problem. To solve the problem
refer to the following list. If any problem
persists, consult your nearest Sony dealer.
function to let you know if there is a system
malfunction. The display shows a code made up
of three or five letters and a message alternately
to show you the problem. To solve the problem
refer to the following list. If any problem
persists, consult your nearest Sony dealer.
C11/Protected
The MD is protected against erasure.
c Remove the MD and slide the tab to close the slot
(page 15).
C12/Cannot Copy
You tried to record a CD with a format that the
system does not support, such as a CD-ROM.
system does not support, such as a CD-ROM.
c Remove the disc and turn off the system once,
then turn it on again.
C13/REC Error
Recording could not be performed properly.
c Move the system to a stable place, and start
recording over from the beginning.
The MD is dirty or scratched, or the MD does not
meet the standards.
meet the standards.
c Replace the MD and start recording over from the
beginning.
C13/Read Error
The MD deck cannot read the disc information
properly.
properly.
c Remove the MD once, then insert it again.
C14/TOC Error
The MD deck cannot read the disc information
properly.
properly.
c Replace the MD.
c Erase all the recorded contents of the MD using
the All Erase Function (page 29).
Self-diagnosis display
C41/Cannot Copy
The sound source is a copy of a commercially
available music software or CD-R.
available music software or CD-R.
cThe Serial Copy Management System prevents
making a digital copy (page 64). In addition, you
cannot copy from a CD-R.
cannot copy from a CD-R.
C71/Check OPT-IN
No component is connected to the DIGITAL
OPTICAL IN jack, or you tried to record from th e
digital component which is not connected correctly.
OPTICAL IN jack, or you tried to record from th e
digital component which is not connected correctly.
cConnect the optional digital component correctly
to the DIGITAL OPTICAL IN jack using the
digital optical cable (not supplied) (page 52).
digital optical cable (not supplied) (page 52).
The power of the connected component is not turned
on.
on.
cCheck if the power of the connected digital
component is on. Refer to the operating
instructions supplied with the component.
instructions supplied with the component.
The digital optical cable is disconnected, or the
power of the connected component is turned off
while recording the digital audio from the
component connected to the DIGITAL OPTICAL
IN jack.
power of the connected component is turned off
while recording the digital audio from the
component connected to the DIGITAL OPTICAL
IN jack.
cConnect the digital optical cable, or turn on the
power of the connected component.
E0001/MEMORY NG
The component has internal problem.
cConsult your nearest Sony dealer.
E0101/LASER NG
There is a problem with the laser pickup.
cThe laser pickup may be damaged. Consult your
nearest Sony dealer.
E0201/LOADING NG
There is a problem with loading.
cConsult your nearest Sony dealer.
