Sony CMT-BX30R / CMT-BX40R / HCD-BX30R / HCD-BX40R Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-BX30R/BX40R
SPECIFICATIONS
COMPACT DISC RECEIVER
9-889-032-02
2008H05-1
©
2008.08
AEP Model
E Model
HCD-BX30R
Mexican Model
HCD-BX30R/BX40R
Ver. 1.1 2008.08
Model Name Using Similar Mechanism
NEW
Base Unit Name
BU-K6BD91UR2-WOD
Optical Pick-up Block Name
KSM-213DCP
• HCD-BX30R is the amplifi er, USB, CD player
and tuner section in CMT-BX30R.
• HCD-BX40R is the amplifi er, USB, CD player
and tuner section in CMT-BX40R.
• “WALKMAN” and “WALKMAN” logo are registered trademarks
of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
• Windows Media is a registered trademark of Microsoft Corporation
in the United States and/or other countries.
of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
• Windows Media is a registered trademark of Microsoft Corporation
in the United States and/or other countries.
European and Russian models:
DIN power output (rated):
18 + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 25 + 25 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference):
38 + 38 watts (6 ohms at 1 kHz, 10%
THD)
18 + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 25 + 25 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference):
38 + 38 watts (6 ohms at 1 kHz, 10%
THD)
Other models:
DIN power output (rated):
18 + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 25 + 25 watts (6 ohms at
1 kHz, 10% THD)
18 + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 25 + 25 watts (6 ohms at
1 kHz, 10% THD)
Inputs:
AUDIO IN (stereo mini jack):
voltage 250 mV, impedance
47 kilohms
voltage 250 mV, impedance
47 kilohms
(USB) port: Type A, maximum
current 500 mA
Outputs:
PHONES (stereo mini jack): accepts
headphones of 8 ohms or more
SPEAKER: accepts impedance of
6 ohms
headphones of 8 ohms or more
SPEAKER: accepts impedance of
6 ohms
USB section
Amplifier section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32 — 320 kbps, VBR
WMA: 32 — 192 kbps, VBR
AAC: 48 — 320 kbps
32 — 320 kbps, VBR
WMA: 32 — 192 kbps, VBR
AAC: 48 — 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
CD player section
System: Compact disc and digital audio
system
Laser Diode Properties
system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6μW
Laser Output*: Less than 44.6μW
*
This output is the value measurement
at a distance of 200mm from the
objective lens surface on the Optical
Pick-up Block with 7mm aperture.
objective lens surface on the Optical
Pick-up Block with 7mm aperture.
Frequency response: 20 Hz — 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section:
Tuning range:
87.5 — 108.0 MHz (50 kHz step)
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range
European and Russian models:
531 — 1,602 kHz (with 9 kHz tuning
interval)
Other models:
530 — 1,710 kHz (with 10 kHz tuning
interval)
531 — 1,710 kHz (with 9 kHz tuning
interval)
531 — 1,602 kHz (with 9 kHz tuning
interval)
Other models:
530 — 1,710 kHz (with 10 kHz tuning
interval)
531 — 1,710 kHz (with 9 kHz tuning
interval)
General
Power requirements
European and Russian models: 230 V
AC, 50/60 Hz
Mexican model: 120 V AC, 60 Hz
Argentine model: 220 V AC, 50/60 Hz
Other models: 120 V, 220 V, 230 −
240 V AC, 50/60 Hz, adjustable with
voltage selector
AC, 50/60 Hz
Mexican model: 120 V AC, 60 Hz
Argentine model: 220 V AC, 50/60 Hz
Other models: 120 V, 220 V, 230 −
240 V AC, 50/60 Hz, adjustable with
voltage selector
Power consumption
European model: 60 watts
Other models: 63 watts
Other models: 63 watts
Dimensions (w/h/d) (excl. speakers):
Approx. 215 × 140 × 298 mm
Mass (excl. speakers): Approx. 3.9 kg
Approx. 215 × 140 × 298 mm
Mass (excl. speakers): Approx. 3.9 kg
change without notice.
Design and specifications are subject to
Antenna: AM loop antenna, external
antenna terminal
Intermediate frequency: 450 kHz
antenna terminal
Intermediate frequency: 450 kHz
Photo: HCD-BX30R
HCD-BX30R/BX40R
2
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Flexible Circuit Board Repairing
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
This appliance is classifi ed as a CLASS
1 LASER product. For Latin American
models only except for the Mexico and
Argentine models, this marking is located
on the bottom exterior. For other models,
this marking is located on the rear exterior.
1 LASER product. For Latin American
models only except for the Mexico and
Argentine models, this marking is located
on the bottom exterior. For other models,
this marking is located on the rear exterior.
1.
SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 5
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 7
3-2. Panel (Side L/R) .............................................................. 8
3-3. Top Panel Block .............................................................. 8
3-4. TOP KEY Board, Panel Top ........................................... 9
3-5. Front Panel Block ........................................................... 9
3-6. Rear Panel Block ............................................................ 10
3-7. D.C.Fan (M901), Tuner (FM/AM), Panel (Rear) ........... 10
3-8. MAIN
3-3. Top Panel Block .............................................................. 8
3-4. TOP KEY Board, Panel Top ........................................... 9
3-5. Front Panel Block ........................................................... 9
3-6. Rear Panel Block ............................................................ 10
3-7. D.C.Fan (M901), Tuner (FM/AM), Panel (Rear) ........... 10
3-8. MAIN
Board
................................................................... 11
3-9. POWER Board Block ..................................................... 11
3-10. AMP Board Block ........................................................... 12
3-11. Loading Mechanism Block ............................................. 12
3-12. Base Unit ......................................................................... 13
3-13. Belt .................................................................................. 13
3-14. OP Base Assy (KSM-213D) ........................................... 14
3-10. AMP Board Block ........................................................... 12
3-11. Loading Mechanism Block ............................................. 12
3-12. Base Unit ......................................................................... 13
3-13. Belt .................................................................................. 13
3-14. OP Base Assy (KSM-213D) ........................................... 14
4.
TEST MODE
............................................................ 15
5.
ELECTRICAL CHECKS
...................................... 17
6. DIAGRAMS
6-1. Block Diagram - CD SERVO Section - .......................... 18
6-2. Block Diagram - MAIN Section - ................................... 19
6-3. Block
6-2. Block Diagram - MAIN Section - ................................... 19
6-3. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................ 20
6-4. Printed Wiring Boards - CD Section - ............................ 22
6-5. Schematic Diagram - CD Section - ................................. 23
6-6. Printed Wiring Board - USB Board - .............................. 24
6-7. Schematic Diagram - USB Board - ................................. 25
6-8. Printed Wiring Boards - MAIN Section - ....................... 26
6-9. Schematic Diagram - MAIN Section (1/3) - ................... 27
6-10. Schematic Diagram - MAIN Section (2/3) - ................... 28
6-11. Schematic Diagram - MAIN Section (3/3) - ................... 29
6-12. Printed Wiring Boards - AMP/HP Boards - .................... 30
6-13. Schematic Diagram - AMP/HP Boards - ........................ 31
6-14. Printed Wiring Boards - PANEL Section - ..................... 32
6-15. Schematic Diagram - PANEL Section - .......................... 33
6-16. Printed Wiring Boards - POWER SUPPLY Section - .... 34
6-17. Schematic Diagram - POWER SUPPLY Section - ......... 35
6-5. Schematic Diagram - CD Section - ................................. 23
6-6. Printed Wiring Board - USB Board - .............................. 24
6-7. Schematic Diagram - USB Board - ................................. 25
6-8. Printed Wiring Boards - MAIN Section - ....................... 26
6-9. Schematic Diagram - MAIN Section (1/3) - ................... 27
6-10. Schematic Diagram - MAIN Section (2/3) - ................... 28
6-11. Schematic Diagram - MAIN Section (3/3) - ................... 29
6-12. Printed Wiring Boards - AMP/HP Boards - .................... 30
6-13. Schematic Diagram - AMP/HP Boards - ........................ 31
6-14. Printed Wiring Boards - PANEL Section - ..................... 32
6-15. Schematic Diagram - PANEL Section - .......................... 33
6-16. Printed Wiring Boards - POWER SUPPLY Section - .... 34
6-17. Schematic Diagram - POWER SUPPLY Section - ......... 35
7.
EXPLODED VIEWS
7-1. Panel
Section
................................................................... 44
7-2. Top Panel Section ........................................................... 45
7-3. Front Panel Section ......................................................... 46
7-4. MAIN Board Section ...................................................... 47
7-5. POWER Board Section ................................................... 48
7-6. Loading Mechanism Section .......................................... 49
7-7. Base Unit Section (BU-K6BD91UR2-WOD) ............... 50
7-3. Front Panel Section ......................................................... 46
7-4. MAIN Board Section ...................................................... 47
7-5. POWER Board Section ................................................... 48
7-6. Loading Mechanism Section .......................................... 49
7-7. Base Unit Section (BU-K6BD91UR2-WOD) ............... 50
8.
ELECTRICAL PARTS LIST
.............................. 51
TABLE OF CONTENTS
HCD-BX30R/BX40R
3
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SECTION 1
SERVICING NOTES
ANTITHEFT UNLOCK MODE
Procedure:
1. Press the [
Procedure:
1. Press the [
?/1
] button to turn the power on.
2. Press the [FUNCTION] button to select “CD”.
3. Press two buttons of [
3. Press two buttons of [
x/
CANCEL] and [
A
] for 5 seconds.
4. The message “UNLOCKED” is displayed on the fl uorescent
indicator tube and the disc tray is unlocked.
Note: When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the [?/1] button.
Model
Part No.
BX30R: AEP model
3-293-466-0[]
BX30R: Russian model
3-295-845-0[]
BX30R: 120V AC area in E, Chilean
and Peruvian models
and Peruvian models
3-295-846-0[]
BX30R: Mexican model
3-295-847-0[]
BX30R: Argentina model
3-295-864-0[]
BX40R: Mexican model
4-107-474-0[]
MODEL IDENTIFICATION
Part No.
– Rear View –
AEP, Russian, Mexican and Argentina models
– Bottom View –
120V AC area in E, Chilean and Peruvian models
Part No.
Ver. 1.1
HCD-BX30R/BX40R
4
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
Note: Please insert a screwdriver after removing the panel (side L).
About disassembly of the panel (side L), please refer to “3-2. Panel (Side L/R)” (page 8).
Open the tray.
Push the boss.
Insert the driver.