DOWNLOAD Sony CHC-TB10 / CHC-TB20 / HCD-TB20 Service Manual ↓ Size: 12.26 MB | Pages: 70 in PDF or view online for FREE

Model
CHC-TB10 CHC-TB20 HCD-TB20
Pages
70
Size
12.26 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
chc-tb10-chc-tb20-hcd-tb20.pdf
Date

Sony CHC-TB10 / CHC-TB20 / HCD-TB20 Service Manual ▷ View online

25
HCD-TB20
Record Level Adjustment
Procedure:
INTRODUCTION
When set to the test mode performed in 
Tape Speed Adjustment
,
when the tape is rewound after recording, the “REC memory mode”
which rewinds only the recorded portion and playback is set.
This “REC memory mode” is convenient for performing this
adjustment. During recording, the input signal FUNCTION will
automatically switch to MD.
(After recording, turn the  m/M  knob without stopping will
return to the position where recording was started.)
1.
Press  FUNCTION  button to select MD. (This step is not
necessary if the above test mode has already been set.)
2.
Insert a tape into deck, press the  REC PAUSE/START  button,
and then press the  Y  button to start recording.
3.
Mode: Record
4.
Mode: Playback
5.
Confirm playback the signal recorded in step 2 become
adjustment level as follows.
If these levels do not satisfy adjustment level, adjust the RV652
(L-CH) and RV602 (R-CH) on the TC board to repeat steps 3
and 4.
Adjustment level:
CN322 playback level: 47.2 to 53.0 mV (–24.3 to –23.3 dB)
AF OSC
MD IN
315Hz 50 mV (–23.8 dB)
blank tape
CS-123
set
attenuator
600 
recorded
position
level meter
set
MAIN board
CN322
Pin 
5
 or TP42 (L-CH)
Pin 
9
 or TP46 (R-ch)
CD SECTION
Note :
1. CD Block is basically designed to operate without adjustment.
Therefore, check each item in order given.
2. Use YEDS-18 (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10M
 impedance.
4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.
S-Curve Check
Procedure :
1. Connect an oscilloscope to TP (FE1).
2. Connect between IC103 Pin qj TP (FEI) and TP (DVC) (1.65 V)
by lead wire.
3. Turn the power on.
4. Load a disc (YEDS-18) and actuate the focus search. (In
consequence of open and close the disc tray, actuate the focus
search)
5. Confirm that the oscilloscope waveform (S-curve) is
symmetrical between A and B. And confirm peak to peak level
within 2 ± 0.5 Vp-p.
6. After check, remove the lead wire connected in step 2.
Note :
• Try to measure several times to make sure than the ratio
of A : B or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the
brightness to obtain best waveform.
RF Level Check
Procedure :
1. Connect an oscilloscope CH1 to TP (RFDC) and CH2 to TP
(RFAC).
2. Turn Power switch on.
3. Load a disc (YEDS-18) and playback the number five track.
4. Confirm that oscilloscope waveform is clear and check if RF
signal level is correct or not.
BD board
oscilloscope
TP(FE1)
TP(DVC)
symmetry
S-curve waveform
within 2 
±
0.5Vp-p
A
B
TP(RFDC)
BD board
oscilloscope
TP(DVC)
TP(RFAC)
TP(DVC)
CH1 CH2
26
HCD-TB20
Note: Clear RF signal waveform means that the shape “ ‡ ” can be
clearly distinguished at the center of the waveform.
E-F Balance (1 Track jump) Check
Procedure :
1. Connect an oscilloscope to TP (TE1) and TP (DVC).
2. Turn the power on.
3. Load a disc (YEDS-18) and playback the number nine track.
4. Press the  BX  button. (Becomes the 1 track jump mode.)
5. Confirm that the level B and A (DC voltage) on the oscilloscope
waveform.
6. Adjust RV101 on the BD board so that the center of waveform
becomes the same voltage of DVC. (i.e.  A=0V)
Adjustment Location:
[BD BOARD] (Conductor Side)
RF signal waveform
VOLT/DIV : 200mV
TIME/DIV : 500ns
level : 0.65 
±
0.15Vp-p (RFDC)
1.1 
±
0.4Vp-p (RFAC)
TP(TE1)
TP(DVC)
BD board
oscilloscope
level=1.0 
±
0.5Vp-p
symmetry
A (DC voltage)
center of
waveform
B
DVC
1 track jump waveform
TP (TE1)
TP
(RFAC)
TP
(RFDC)
TP (FE1)
IC101
IC103
RV101
TP (DVC)
1
15
30
1
20
21
40
60
80
41
61
16
TP
(FEI)
27
HCD-TB20
SECTION 7
DIAGRAMS
7-1. Circuit Boards Location
AMP board
MAIN board 
TRANS board
TC board
PANEL board
DISPLAY board
FRONT INPUT board
VOL board
VOL SEL board
SUB POWER board 
MOTOR board
DRIVER board
TRAY SENSOR board
DISK SENSOR board
BD board
IN OUT SW board
28
HCD-TB20
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
2
: nonflammable resistor.
1
: fusible resistor.
C
: panel designation.
For printed wiring boards.
Note:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
a
: Through hole.
: Pattern from the side which enables seeing.
A
: B+ Line.
B
: B– Line.
H
: adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
: Impossible to measure
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
E
: PB
a
: REC
J
: CD (Analog)
c
: CD (Digital)
• Abbreviation
MX
: Mexican model
KR
: Korea model
Note: The components identified by mark 
0
 or dotted line
with mark 
0
 are critical for safety.
Replace only with part number specified.
• Indication of transistor
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
B
These are omitted.
C
E
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