Sony CHC-TB10 / CHC-TB20 / HCD-TB20 Service Manual ▷ View online
HCD-TB20
AEP Model
UK Model
E Model
SERVICE MANUAL
COMPACT HiFi COMPONENT SYSTEM
— Continued on next page —
SPECIFICATIONS
Ver 1.1 2002. 10
This set is the tuner, deck, CD and amplifier
section in CHC-TB20.
section in CHC-TB20.
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM63E
Base Unit Type
BU-30BD60C
Optical Pick-up Type
A-MAX.3
Model Name Using Similar Mechanism
NEW
Tape Transport Mechanism Type
CMAL1Z222A
CD
SECTION
TAPE DECK
SECTION
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-873-613-02
2002J1600-1
© 2002.10
Amplifier section
European models
DIN power output (Rated):45 + 45 watts
DIN power output (Rated):45 + 45 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (Reference):
60 + 60 watts
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Music power output (Reference):
120 + 120 watts
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Other models
Measured at AC 120/220/240 V, 50/60 Hz:
DIN power output (Rated):40 + 40 watts
Measured at AC 120/220/240 V, 50/60 Hz:
DIN power output (Rated):40 + 40 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (Reference):
50 + 50 watts
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Inputs
MD (VIDEO) IN (phono jacks):
MD (VIDEO) IN (phono jacks):
voltage 450 mV (250
mV), impedance 47
kilohms
mV), impedance 47
kilohms
Outputs
PHONES (stereo minijack):
PHONES (stereo minijack):
accepts headphones of
8 ohms or more.
8 ohms or more.
SPEAKER:
accepts impedance of 6 to
16 ohms.
16 ohms.
CD player section
System
Compact disc and digital
audio system
audio system
Laser
Semiconductor laser
(
(
λ=795 nm)
Emission duration:
continuous
continuous
Frequency response
2 Hz – 20 kHz (
±0.5 dB)
CD DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength
(Square optical connector jack, rear panel)
Wavelength
660 nm
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I
cassettes
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
(50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
2
HCD-TB20
General
Power requirements
European models:
European models:
230 V AC, 50/60 Hz
Mexican model:
120 V AC, 60 Hz
Korean model:
220 V AC, 60 Hz
Other models:
120 V, 220 V, 230 –
240 V AC, 50/60 Hz
Adjustable with voltage
selector
240 V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
European models:
European models:
120 watts
0.5 watts (at the Power
Saving Mode)
0.5 watts (at the Power
Saving Mode)
Other models:
100 watts
Dimensions (w/h/d) incl. projecting parts and controls
Approx. 215
× 285 ×
386 mm
Mass
Approx. 7.7 kg
Design and specifications are subject to change
without notice.
without notice.
AM tuner section
Tuning range
European models:
European models:
531 – 1,602 kHz
(with the interval set at
9 kHz)
(with the interval set at
9 kHz)
Pan-American models:
531 – 1,710 kHz
(with the interval set at
9 kHz)
530 – 1,710 kHz
(with the interval set at
10 kHz)
(with the interval set at
9 kHz)
530 – 1,710 kHz
(with the interval set at
10 kHz)
Other models:
531 – 1,602 kHz
(with the interval set at
9 kHz)
530 – 1,710 kHz
(with the interval set at
10 kHz)
(with the interval set at
9 kHz)
530 – 1,710 kHz
(with the interval set at
10 kHz)
Antenna
AM loop antenna
External antenna terminals
External antenna terminals
Intermediate frequency
450 kHz
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Power Voltage
Incdication
AC: 120 V 60 Hz
AC: 230 V 50/60 Hz
AC: 120, 220,
230 – 240 V 50/60 Hz
AC: 220 V 60 Hz
Model
Mexican model
AEP, UK models
E model
Korea model
Power Voltage
Indicator
Indicator
3
HCD-TB20
TABLE OF CONTENTS
1. SERVICING NOTES
······················································· 4
2. GENERAL
·········································································· 6
3. DISASSEMBLY
································································ 8
3-1. Side Panel ····································································· 9
3-2. Top Panel ······································································ 9
3-3. Cassette Mechanism ··················································· 10
3-4. Front Panel ·································································· 10
3-5. PANEL Board ····························································· 11
3-6. DISPLAY Board ························································· 12
3-7. VOL Board ································································· 13
3-8. Back Panel ·································································· 13
3-9. MAIN Board ······························································· 14
3-10. AMP Board, Power Transformer ································ 14
3-11. CD Mechanism Deck (CDM63E) ······························ 15
3-12. CD Base Unit (BU-30 (60) Assy) ······························· 16
3-13. DRIVER Board ··························································· 17
3-14. Fitting Base (Stabilizer) Assy, Tray Assy ··················· 17
3-15. TRAY SENSOR Board ··············································· 18
3-16. Slider (Loading), Gear (Slider) ··································· 18
3-17. Stocker Assy ······························································· 19
3-18. DISC SENSOR Board ················································ 19
3-19. IN OUT SW Board ····················································· 20
3-20. Motor Assy (M721), MOTOR Bard ··························· 21
3-2. Top Panel ······································································ 9
3-3. Cassette Mechanism ··················································· 10
3-4. Front Panel ·································································· 10
3-5. PANEL Board ····························································· 11
3-6. DISPLAY Board ························································· 12
3-7. VOL Board ································································· 13
3-8. Back Panel ·································································· 13
3-9. MAIN Board ······························································· 14
3-10. AMP Board, Power Transformer ································ 14
3-11. CD Mechanism Deck (CDM63E) ······························ 15
3-12. CD Base Unit (BU-30 (60) Assy) ······························· 16
3-13. DRIVER Board ··························································· 17
3-14. Fitting Base (Stabilizer) Assy, Tray Assy ··················· 17
3-15. TRAY SENSOR Board ··············································· 18
3-16. Slider (Loading), Gear (Slider) ··································· 18
3-17. Stocker Assy ······························································· 19
3-18. DISC SENSOR Board ················································ 19
3-19. IN OUT SW Board ····················································· 20
3-20. Motor Assy (M721), MOTOR Bard ··························· 21
4. TEST MODE
···································································· 22
5. MECHANICAL ADJUSTMENTS
····························· 23
6. ELECTRICAL ADJUSTMENTS
······························· 23
7. DIAGRAMS
······································································ 27
7-1. Circuit Boards Location ·············································· 27
7-2. Block Diagrams ·························································· 29
7-3. Schematic Diagram BD Section ································ 32
7-4. Printed Wiring Board BD Section ····························· 33
7-5. Schematic Diagram DRIVER Section ······················· 34
7-6. Printed Wiring Board DRIVER Section ···················· 35
7-7. Schematic Diagram MAIN Section (1/3) ·················· 36
7-8. Schematic Diagram MAIN Section (2/3) ·················· 37
7-9. Schematic Diagram MAIN Section (3/3) ·················· 38
7-10. Printed Wiring Board MAIN Section ························ 39
7-11. Schematic Diagram DECK Section ··························· 40
7-12. Printed Wiring Board DECK Section ························ 41
7-13. Schematic Diagram AMP Section ····························· 42
7-14. Printed Wiring Board AMP Section ·························· 43
7-15. Schematic Diagram PANEL Section ························· 44
7-16. Printed Wiring Board PANEL Section ······················ 45
7-17. Schematic Diagram TRANS Section ························· 46
7-18. Printed Wiring Board TRANS Section ······················ 47
7-19. Schematic Diagram POWER Section ························ 48
7-20. Printed Wiring Board POWER Section ····················· 49
7-21. IC Pin Function Description ······································· 50
7-22. IC Block Diagrams ····················································· 52
7-2. Block Diagrams ·························································· 29
7-3. Schematic Diagram BD Section ································ 32
7-4. Printed Wiring Board BD Section ····························· 33
7-5. Schematic Diagram DRIVER Section ······················· 34
7-6. Printed Wiring Board DRIVER Section ···················· 35
7-7. Schematic Diagram MAIN Section (1/3) ·················· 36
7-8. Schematic Diagram MAIN Section (2/3) ·················· 37
7-9. Schematic Diagram MAIN Section (3/3) ·················· 38
7-10. Printed Wiring Board MAIN Section ························ 39
7-11. Schematic Diagram DECK Section ··························· 40
7-12. Printed Wiring Board DECK Section ························ 41
7-13. Schematic Diagram AMP Section ····························· 42
7-14. Printed Wiring Board AMP Section ·························· 43
7-15. Schematic Diagram PANEL Section ························· 44
7-16. Printed Wiring Board PANEL Section ······················ 45
7-17. Schematic Diagram TRANS Section ························· 46
7-18. Printed Wiring Board TRANS Section ······················ 47
7-19. Schematic Diagram POWER Section ························ 48
7-20. Printed Wiring Board POWER Section ····················· 49
7-21. IC Pin Function Description ······································· 50
7-22. IC Block Diagrams ····················································· 52
8. EXPLODED VIEWS
······················································ 50
8-1. Side Panel, Back Panel Section ·································· 54
8-2. Front Panel Section ····················································· 55
8-3. Chassis Section ··························································· 56
8-4. CD Mechanism Deck Section -1 ································ 57
8-5. CD Mechanism Deck Section -2 ································ 58
8-6. Base Unit Section (BU-30) ········································· 59
8-2. Front Panel Section ····················································· 55
8-3. Chassis Section ··························································· 56
8-4. CD Mechanism Deck Section -1 ································ 57
8-5. CD Mechanism Deck Section -2 ································ 58
8-6. Base Unit Section (BU-30) ········································· 59
9. ELECTRICAL PARTS LIST
······································· 60
4
HCD-TB20
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SECTION 1
SERVICING NOTES
This caution
label is
located inside
the unit.
label is
located inside
the unit.
