DOWNLOAD Sony CDP-CE275 / CDP-CE375 Service Manual ↓ Size: 2.95 MB | Pages: 41 in PDF or view online for FREE

Model
CDP-CE275 CDP-CE375
Pages
41
Size
2.95 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
cdp-ce275-cdp-ce375.pdf
Date

Sony CDP-CE275 / CDP-CE375 Service Manual ▷ View online

13
CDP-CE275/CE375
Ver 1.1  2001.07
Note:
1. CD Block is basically designed to operate without adjustment. There-
fore, check each item in order given.
2. Use PATD-012 disc (4-225-203-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10M
 impedance.
4. Clean the object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
S Curve Check
Connection:
Procedure:
1.
Set the test disc (PATD-012). Disc chucking operation is
complete, then press the 
[POWER]
 button to turn the power
off.
2.
Connect an oscilloscope to test point TP (FE1) and TP (VC)
on the BD board.
3.
Connect between test point TP (ADJ) on the MAIN board and
GND by lead wire.
4.
Press the  
[POWER]
 button to turn the power on and enter the
ADJ mode.
Then playback the number two track automatically, press the
x
button to stop the playback.
5.
Press the  
[CHECK]
 button actuate the focus search. (actuate
the focus search when disc table is moving in and out)
6.
Check the oscilloscope waveform (S-curve) is symmetrical
between A and B. And confirm peak to peak level within 2 ± 1
Vp-p.
S-curve waveform
Note:
 • Try to measure several times to make sure than the ratio of A : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the
brightness to obtain best waveform.
Checking Location: BD board
RFDC Level Check
Connection:
+
BD board
TP (FE1)
TP (VC)
oscilloscope
A
B
symmetry
within 2 
±
 1 Vp-p
+
BD board
TP (RFDC)
TP (VC)
oscilloscope
VOLT/DIV: 200 mV
TIME/DIV: 500 ns 
level: 1.15 
±
 0.35 Vp-p
VC
Procedure:
1.
Set the test disc (PATD-012). Disc chucking operation is
complete, then press the 
[POWER]
 button to turn the power
off.
2.
Connect an oscilloscope to test point TP (RFDC) and TP (VC)
on the BD board.
3.
Connect between test point TP (ADJ) on the MAIN board and
GND by lead wire.
4.
Press the  
[POWER]
 button to turn the power on and enter the
ADJ mode, then playback the number two track automatically.
5.
Confirm that oscilloscope waveform is clear and check the level
of between RFDC top and VC is correct or not.
Note:
A clear RFDC signal waveform means that the shape “
” can be
clearly distinguished at the center of the waveform.
       RFDC signal waveform
Checking Location: BD board
RFAC Level Check
Connection:
Procedure:
1.
Set the test disc (PATD-012). Disc chucking operation is
complete, then press the 
[POWER]
 button to turn the power
off.
2.
Connect an oscilloscope to test point TP (RFAC) and TP (VC)
on the BD board.
3.
Connect between test point TP (ADJ) on the MAIN board and
GND by lead wire.
4.
Press the  
[POWER]
 button to turn the power on and enter the
ADJ mode, then playback the number two track automatically.
5.
Confirm that oscilloscope waveform is clear and check RFAC
signal level is correct or not.
Note:
A clear RFAC signal waveform means that the shape “
” can be
clearly distinguished at the center of the waveform.
       RFAC signal waveform
Checking Location: BD board
+
BD board
TP (RFAC)
TP (VC)
oscilloscope
VOLT/DIV: 200 mV
TIME/DIV: 500 ns 
level: 1.35 
±
 0.4 Vp-p
SECTION  5
ELECTRICAL  ADJUSTMENTS
14
CDP-CE275/CE375
Ver 1.1 2001.07
E-F Balance Check
Connection:
Procedure:
1.
Set the test disc (PATD-012). Disc chucking operation is
complete, then press the 
[POWER]
 button to turn the power
off.
2.
Connect an oscilloscpe to test point TP (TE1) and TP (VC) on
the BD board.
3.
Connect between test point TP (ADJ) on the MAIN board and
GND by lead wire.
4.
Press the  
[POWER]
 button to turn the power on and enter the
ADJ mode, then playback the number two track automatically.
5.
Press the 
[TIME]
 button.  (The tracking servo and the sledding
servo are turned OFF)
6.
Check the level B of the oscilliscope waveform and the A (DC
voltage) of the center of the Traverse waveform.
Confirm the following :
A/B x 100 = less than ± 22%
Traverse Waveform
7.
Press the 
[TIME]
 button. (The tracking servo and sledding servo
are turned ON)
Confirm the C (DC voltage) is almost equal to the A (DC
voltage) is step 6.
Traverse Waveform
Checking Location: BD board
+
BD board
TP (TE1)
TP (VC)
oscilloscope
0V
B
level: 1.15 
±
 0.5 Vp-p
Center of 
the waveform
A (DC 
voltage)
0V
Tracking servo
Sled servo
ON
C (DC 
voltage)
Tracking servo
Sled servo
OFF
Checking Location:
– BD BOARD (Conductor Side) –
TP 
(RFDC)
TP
 (FE1)
TP
 (VC)
IC131
IC150
IC101
TP
 (TE1)
TP 
(RFAC)
15
15
CDP-CE275/CE375
SECTION  6
DIAGRAMS
6-1.
NOTE  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC  DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
C
: panel designation.
Note on Printed Wiring Board:
X
: parts extracted from the component side.
Y
: parts extracted from the conductor side.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms
.
• Signal path.
J
: CD PLAY
c
: DIGITAL OUT
A
: B+ Line
B
: B– Line
Note:
The components identi-
fied by mark 
0
 or dotted
line with mark 
0
 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 
0
 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
B
These are omitted.
C
E
Q
• Circuit Boards Location
BD board
JUNCTION board
DISPLAY board
MAIN board
KEY board
POWER SW board
LOADING MOTOR board
HEADPHONE board
SENSOR board
B
These are omitted.
C
E
Q
Ver. 1.2
Abbreviation
AUS
: Australian model
CND : Canadian model
SP
: Singapore model
16
16
CDP-CE275/CE375
6-2.
PRINTED  WIRING  BOARD  – BD Board –
 See page 15 for Circuit Boards Location.
• Semiconductor
Location
Ref. No.
Location
Q131
C-3
Q132
C-3
• Semiconductor
Location
Ref. No.
Location
IC101
C-2
IC131
C-1
IC150
B-1
(Page 20)
M101
(SPINDLE)
M
TP
(VC)
TP
(FE1)
TP
(TE1)
TP (RFDC)
TP (RFAC)
M102
(SLED)
M
S101
(LIMIT)
Ver. 1.2
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