Sharp DX-AT50H (serv.man21) Service Manual ▷ View online
DX-AT50
– 5 –
NAMES OF PARTS
DVD player
1. CD Indicator
2. DVD Indicator
3. CD/MP3 Disc Random Play Indicator
4. Disc Repeat or Disc A - B Repeat Indicator
5. DVD Title Indicator
6. Disc Play Indicator
7. Disc Pause Indicator
8. CD/MP3 Disc Track Indicator
9. DVD Chapter Indicator
2. DVD Indicator
3. CD/MP3 Disc Random Play Indicator
4. Disc Repeat or Disc A - B Repeat Indicator
5. DVD Title Indicator
6. Disc Play Indicator
7. Disc Pause Indicator
8. CD/MP3 Disc Track Indicator
9. DVD Chapter Indicator
10. On/Stand-by Button
11. DVD Chapter Skip or CD/MP3 Disc Track Down Button
12. DVD Chapter Skip or CD/MP3 Disc Track Up Button
13. Disc Stop Button
14. Disc Play Button
15. Disc Tray Open/Close Button
16. Disc Tray
17. System Connection Socket (to AV control unit)
18. Audio Output Sockets
19. Coaxial Digital Audio Output Socket
20. Video Output Socket
21. S-video Output Socket
22. Component Video Output Sockets
23. AC Power Lead
11. DVD Chapter Skip or CD/MP3 Disc Track Down Button
12. DVD Chapter Skip or CD/MP3 Disc Track Up Button
13. Disc Stop Button
14. Disc Play Button
15. Disc Tray Open/Close Button
16. Disc Tray
17. System Connection Socket (to AV control unit)
18. Audio Output Sockets
19. Coaxial Digital Audio Output Socket
20. Video Output Socket
21. S-video Output Socket
22. Component Video Output Sockets
23. AC Power Lead
11
10
12 13 14 15
16
17
18
19
20
22
21
1
2
3
4
5
6
7
8
9
MODEL NO. DX-AT50H
DVD PLAYER
230 V ~ 50 Hz 15 W
230 V ~ 50 Hz 15 W
SERIAL NO.
SHARP CORPORATION
MADE IN CHINA
23
Display
Front
<The bottom of the unit>
Back
DX-AT50
– 6 –
This DVD player uses a pickup that emits a laser beam.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep your eyes at least
30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser beam.
30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser beam.
Caution: Use of controls and adjustments, or doing procedures other than those specified herein, may result in hazardous radiation
exposure.
Drive Mecha Assembly
Laser Beam Radiation
Laser Pickup
LASER BEAM SAFETY PRECAUTIONS
Do not look directly at the laser beam coming
from the pickup or allow it to strike against your
skin.
from the pickup or allow it to strike against your
skin.
– 7 –
DX-AT50H
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indicated as
shown.
Top View
Out
In
Bottom View
Input
b. For other ICs, pin 1 and every fifth pin are indicated as
shown.
5
10
Pin 1
c. The 1st pin of every male connector is indicated as
shown.
Pin 1
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible Foil
Connector) cable, be sure to first disconnect the AC cord.
2. FFC (Flexible Foil Connector) cable should be inserted
parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
(1) Prepare the hot-air flat pack-IC desoldering machine, then
(1) Prepare the hot-air flat pack-IC desoldering machine, then
apply hot air to the Flat Pack-IC (about 5 to 6 seconds).
(Fig. S-1-1)
(Fig. S-1-1)
Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while applying the
hot air.
(3) Bottom of the flat pack-IC is fixed with glue to the CBA;
when removing entire flat pack-IC, first apply soldering iron
to center of the flat pack-IC and heat up. Then remove (glue
will be melted). (Fig. S-1-6)
to center of the flat pack-IC and heat up. Then remove (glue
will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using tweezers. (Fig.
S-1-6)
Caution:
1. Do not supply hot air to the chip parts around the flat pack-
1. Do not supply hot air to the chip parts around the flat pack-
IC for over 6 seconds because damage to the chip parts
may occur. Put masking tape around the flat pack-IC to
protect other parts from damage. (Fig. S-1-2)
may occur. Put masking tape around the flat pack-IC to
protect other parts from damage. (Fig. S-1-2)
2. The flat pack-IC on the CBA is affixed with glue, so be careful
not to break or damage the foil of each pin or the solder lands
under the IC when removing it.
under the IC when removing it.
Hot-air
Flat Pack-IC
Desoldering
Machine
Flat Pack-IC
Desoldering
Machine
CBA
Flat Pack-IC
Tweezers
Masking
Tape
Tape
Fig. S-1-2
STANDARD NOTES FOR SERVICING
DX-AT50H
– 8 –
With Soldering Iron:
(1) Using desoldering braid, remove the solder from all pins of
the flat pack-IC. When you use solder flux which is applied
to all pins of the flat pack-IC, you can remove it easily.
(Fig. S-1-3)
to all pins of the flat pack-IC, you can remove it easily.
(Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by one, using
a sharp pin or wire to which solder will not adhere (iron
wire). When heating the pins, use a fine tip soldering iron or
a hot air desoldering machine. (Fig. S-1-4)
wire). When heating the pins, use a fine tip soldering iron or
a hot air desoldering machine. (Fig. S-1-4)
Fine Tip
Soldering Iron
Soldering Iron
Sharp
Pin
Pin
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the CBA;
when removing entire flat pack-IC, first apply soldering iron
to center of the flat pack-IC and heat up. Then remove (glue
will be melted). (Fig. S-1-6)
to center of the flat pack-IC and heat up. Then remove (glue
will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using tweezers.
(Fig. S-1-6)
With Iron Wire:
(1) Using desoldering braid, remove the solder from all pins of
the flat pack-IC. When you use solder flux which is applied
to all pins of the flat pack-IC, you can remove it easily.
(Fig. S-1-3)
to all pins of the flat pack-IC, you can remove it easily.
(Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting point, as
shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering iron or hot
air blower, pull up the wire as the solder melts so as to lift
the IC leads from the CBA contact pads as shown in Fig. S-
1-5.
the IC leads from the CBA contact pads as shown in Fig. S-
1-5.
(4) Bottom of the flat pack-IC is fixed with glue to the CBA;
when removing entire flat pack-IC, first apply soldering iron
to center of the flat pack-IC and heat up.
Then remove (glue will be melted). (Fig. S-1-6)
to center of the flat pack-IC and heat up.
Then remove (glue will be melted). (Fig. S-1-6)
(5) Release the flat pack-IC from the CBA using tweezers.
(Fig. S-1-6)
Note:
When using a soldering iron, care must be taken to ensure
that the flat pack-IC is not being held by glue. When the flat
pack-IC is removed from the CBA, handle it gently because
it may be damaged if force is applied.
that the flat pack-IC is not being held by glue. When the flat
pack-IC is removed from the CBA, handle it gently because
it may be damaged if force is applied.
To Solid
Mounting Point
Mounting Point
Soldering Iron
Iron Wire
or
Hot Air Blower
Fig. S-1-5
Fine Tip
Soldeing Iron
Soldeing Iron
CBA
Flat Pack-IC
Tweezers
Fig. S-1-6
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