Panasonic TX-LR32C10 Service Manual ▷ View online
TX-LR32C10
5
1.3.
KM02 Chasis Block Diagram
BT
→ Divide
A
LCD P
A
NEL
IPK
Point Dip
Inspection
<V
isual check>
*V
oltage check
* LED Check Inverter (Blue LED)
<F
ACT
-TEST>
*ANALOG TUNE
*VCXO ADJ
*LOCAL
OSD
*A
V_SW CHECK
*A
V1/A
V2/A
V3---CVBS
*A
V3---S(YC)
*MONIT
OR-OUT
*A
V1/A
V2---Component
*PC
*HDMI1
*HDMI2
*CEC_(HDMI1/HDMI2)
*Backlight
*SD Card
*Software & EEPROM version
check by self check (1 set only)
IP-PCB: 32” IPS ONL
Y
(Inverter & Power)
TNP4G455
P-PCB: 37” ONL
Y
(Power)
TNP4G454
BT
→ Divide
In coming check
W
riting
Assembly
A-PCB
TNP4G460
(Degital main)
V
-PCB
(LED)
TNP
A4834
PEAKS NOR Flash
(W
riting IC)
256Mbit
IC8554
Sum : only ef
fective area
Add : 0 ~ 1FFFFFF
EEPROM W
riting (On board)
*GENX
• EEPROM (8k) x 1
IC1
101
*PEAKS
• EEPROM (16k) x 1
IC8601
<W
rite Protect command>
*GENX : Protect OFF = 70,88,00
Protect ON = 70,88,f
f
*PEAKS : Protect OFF = 70,8B,00
Protect ON = 70,8B,f
f
K-PCB
(Control)
TNP
A4901
BT
Inspection
FOR TNP4G455
ONL
Y
*Adjust the frequency to 56 ± 1kHz by using VR7851
*Check to the output : J102 or
TP7871
*Check to the Over V
oltage protection
*Check to the
Arc protection
Inspection
LED CA
T
EYES,REMOCON RECEIVER
TX-LR32C10
6
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-
effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the
incidence of component damage caused by electro static discharge (ESD).
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-
effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the
incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminium foil to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices (otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
sufficient to damage an ES device).
TX-LR32C10
7
3 About Lead Free Solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead Solder and PbF will refer to Lead Free Solder.
The Lead Free Solder (PbF) used in our manufacturing process and discussed below is (Sn+Ag+Cu).
Those are Tin (Sn), Silver (Ag) and Copper (Cu), although other types are available.
In the information below, Pb will refer to Lead Solder and PbF will refer to Lead Free Solder.
The Lead Free Solder (PbF) used in our manufacturing process and discussed below is (Sn+Ag+Cu).
Those are Tin (Sn), Silver (Ag) and Copper (Cu), although other types are available.
This model uses PbF in its manufacture due to environmental conservation issues. For service and repair work, we would suggest
the use of PbF as well, although Pb may be used.
the use of PbF as well, although Pb may be used.
PCBs manufactured using lead-free will have the “PbF within a leaf Symbol” stamped on their back.
Caution
• PbF has a higher melting point than that of standard solder. Typically the melting point is 50 ~ 70
°F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20
°F (370 ± 10°C).
• PbF will tend to splash when heated too high (about 1100
°F or 600°C).
If you must use Pb solder, please completely remove all of the PbF on the pins or solder area before applying Pb. If this is not
practical, be sure to heat the PbF until it melts, before applying Pb.
practical, be sure to heat the PbF until it melts, before applying Pb.
• After applying PbF to double layered boards, please check the component side for excess solder which may flow onto the
opposite side (see Figure 2).
Figure 2
Suggested PbF
There are several kinds of PbF available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu
(tin, copper) and Sn+Zn+Bi (tin, zinc, bismuth) solders can also be used.
There are several kinds of PbF available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu
(tin, copper) and Sn+Zn+Bi (tin, zinc, bismuth) solders can also be used.
Figure 3
TX-LR32C10
8
4 Power LED Blinking Timing
1. Subject
Information of LED Flashing timing.
2. Contents
When an abonormality has occurred in the unit, the protection circuit operates and resets to standby mode. At this time, the
defective block can be identified by the number of blinking of the Power LED on the front panel of the unit as follow:
defective block can be identified by the number of blinking of the Power LED on the front panel of the unit as follow:
Blinking times
Contents
1
Lamp short circuit protection
Lamp open protection
Arc protection
Lamp open protection
Arc protection
2
Cooling fan SOS = incomplete connection - no function mode.
3
P board 30V / 18V / 9V decreased / short circuit detection.
4
DTV12V decreased / short circuit , main convertor stop detection.
5
Sub 5V decreased / short circuit detection.
6
Sub 5V decreased / short circuit detection. (same as 5 times LED blinking)
7
Sub 3.3V decreased / short circuit detection.
8
Sub 5V decreased / short circuit detection. (same as 5 times LED blinking)
9
Audio amp SOS.
10
HQ1 incomplete connection, no function mode.
13
When peaks communication error SOS.
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