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Model
KX-TG8125RU KX-TGA810RU KX-TGA810RUS KX-TGA810RUT
Pages
100
Size
4.18 MB
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PDF
Document
Service Manual
Brand
Device
Telephone / DIGITAL CORDLESS ANSWERING SYSTEM
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kx-tg8125ru-kx-tga810ru-kx-tga810rus-kx-tga810rut.pdf
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Panasonic KX-TG8125RU / KX-TGA810RU / KX-TGA810RUS / KX-TGA810RUT Service Manual ▷ View online

49
KX-TG8125RU/KX-TGA810RU
9.3.
Troubleshooting by Symptom (Handset)
If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester
(*1) or not. 
Note:
(*1) A general repair is possible even if you don’t have the DECT tester because it is for confirming the levels, such as Acoustic
level in detail.
(*2) Refer to Check Point (Handset) (P.49)
9.3.1.
Check Point (Handset)
Please follow the items below when BBIC or EEPROM is replaced.
Note:
After the measuring, suck up the solder of TP.
*: PC Setting (P.64) is required beforehand.
The connections of simulator equipments are as shown in Adjustment Standard (Handset) (P.66).
Items
Check 
Point
Procedure
Check or 
Replace Parts
(A)* 1.8V Supply Adjustment
VDD1
1. Confirm that the voltage between test point VDD1 and GND is 1.8V ± 0.02V.
2. Execute the command “bandgap”, then check the current Value.
3. Adjust the 1.8V voltage of VDD1 executing command “bandgap XX” (XX is the
value).
IC1, Q2, C10
(B)
DC/DC Supply Confir-
mation
VDD3
1. Confirm that the voltage between test point VDD3 and GND is 3.6V ± 0.3V
(Backlight is OFF)/4.2V ± 0.3V (Backlight is ON).
IC1, F1, C1, 
C2, C3, R1, 
Q1, D1, L1, D2
(C) 2.5V Supply Confirma-
tion
VDD2
1. Confirm that the voltage between test point VDD2 and GND is 2.5V ± 0.1V.
IC1, Q3, C4, 
C5
(D)*
BBIC Confirmation
-
1. BBIC Confirmation (Execute the command “getchk”).
2. Confirm the returned checksum value.
Connection of checksum value and program number is shown below.
IC1, X1, C7, 
C6, R19
(E)* EEPROM Confirmation
-
1. EEPROM Confirmation (Execute the command “ChkTGA810XXrevYY.bat”).
XX: country code
YY: revision number
2. Confirm the returned checksum value.
3. The checksum is displayed in the last output line.
Note:
“XX”, “YY”, and “checksum” vary depending on the country version. You can find
them in the batch file, PQZZ- mentioned in JIG and PC (P.64).
IC1, IC3, R40, 
R41, R42, 
Q10, Q11, 
R43, R44, C37
(F) Charge Control Check & 
Charge Current Monitor 
Check
-
1. Apply 3.5V between J3(+) and TP21 with DC power supply and set current limit
to 250mA.
2. Confirm that the current limit LED of DC power supply is ON/OFF.
3. Decrease current limit of DC power supply to 100mA.
4. Confirm that the current limit LED of DC power supply is stable. (Current limiter
is ON.)
(If charge control cannot be confirmed by this procedure, please use battery to hand-
set power supply and try again.)
IC1, Q4, Q5, 
Q9, D6, L4, L5, 
R5, R6, F1, 
R8, D7, D8, R7
50
KX-TG8125RU/KX-TGA810RU
(G)* Charge Detection (OFF) 
Check
-
1. Stop supplying 3.5V to TP20(+) and TP21(-).
2. Execute the command “Backloff” then “charge”.
3. Confirm that the returned value is 00 (hex).
IC1, Q4, Q5, 
Q9, D6, L4, L5, 
R5, R6, F1, 
R8, D7, D8, R7
(H)* Battery Monitor Check
-
1. Apply 2.25V between BATT and GND.
2. Execute the command “readbatt”.
It assumes that the return value is XX.
a) 1E   XX   2C: No need to adjust
b) XX: 18 ~ 1D: Need to adjust
XX: 2D ~ 32: Need to adjust
Write AD value of 2.25V to FLASH.
ex) read data: XX = 1C, write data: YY = 1C
read data: XX = 2D, write data: YY = 2D
FLASH = 0004(Low Voltage) write “YY”
Execute the command “wreeprom 00 04 01 YY”.
FLASH = 0005(No Voltage) write “YY - 1D”
Execute the command “wreeprom 00 05 01 ZZ”.
FLASH = 000A(Low Voltage BL) write “YY - 16”
Execute the command “wreeprom 00 0A 01 WW”.
Note:
ZZ = YY - 1D, WW = YY - 16
No Voltage writing data limit is ‘00’.
c) XX: 00 ~ 17: Reject
XX: 33 ~ FF: Reject
IC1, F1, C1, 
C3, R12
(I)
Battery Low Confirma-
tion
-
1. Apply 2.40V between J1 (BATT+) and J2 (BATT-).
2. Confirm that there is no flashing of Battery Icon.
3. Apply 2.25V ± 0.08V between J1 (BATT+) and J2 (BATT-).
4. Confirm that there is flashing of Battery Icon.
IC1, F1, C1, 
C3, R12
(J)* BBIC Clock Adjustment
CLK
1. Apply 2.5V between BATTERY(+) and BATTERY(-) with DC power.
2. Execute the command “conttx”.
3. Input Command “rdeeprom 00 01 01”, then you can confirm the current value.
4. Adjust the frequency of CLK executing the command “setfreq 00 xx (where xx
is the value)” so that the reading of the frequency counter is 10.368000MHz ±
10Hz.
Note:
CLK is displayed only for a few seconds when executing the command “conttx”
after battery is inserted.
IC1, X1, C6, 
C7, R19, IC4, 
C57
(K)* Transmitted Power Con-
firmation
-
Remove the Antenna before starting step from 1 to 4.
1. Configure the DECT tester (CMD60) as follows;
<Setting>
• Test mode: PP
• RFPI: 0102030405
• Traffic Carrier: 5
• Traffic Slot: 4
• Mode: Loopback
• RF LEVEL = -70dBm
2. Execute the command “regcmd60 01 02 03 04 05”.
3. Initiate connection from DECT tester.
4. Confirm that the NTP value at ANT is 19dBm ~ 25dBm.
IC1, IC4, C66, 
C58, C57, 
C50, C53, 
C52, R52, 
C60, C61
(L)* Modulation Check and 
Adjustment
-
Follow steps 1 to 3 of (K).
4.Confirm that the B-Field Modulation is -350 ~ -400/+320 ~ +370kHz/div using
data type Fig 31.
5.Adjust the B-Field Modulation if required. (Execute the command “Readmod”
and “wrtmod xx”, where xx is the value.)
IC1, IC4, C66, 
C58, C57, 
C50, C53, 
C52, R52, 
C60, C61
(M) Frequency Offset Confir-
mation
-
Follow steps 1 to 3 of (K).
4.Confirm that the frequency Offset is < ± 45kHz.
IC1, IC4, C66, 
C58, C57, 
C50, C53, 
C52, R52, 
C60, C61
(N) Frequency Drift Confir-
mation
-
Follow steps 1 to 3 of (K).
4.Confirm that the frequency Drift is < ± 30kHz/ms.
IC1, IC4, C66, 
C58, C57, 
C50, C53, 
C52, R52, 
C60, C61
(O)
Sensitivity Receiver 
Confirmation
-
Follow steps 1 to 3 of (K).
4.Set DECT tester power to -90dBm.
5.Confirm that the BER is < 1000ppm.
IC1, IC4, C66, 
C58, C57, 
C50, C53, 
C52, R52, 
C60, C61
Items
Check 
Point
Procedure
Check or 
Replace Parts
51
KX-TG8125RU/KX-TGA810RU
9.3.2.
Troubleshooting for Speakerphone (Handset)
When the customer’s telephone line corresponds to the following conditions and transmission signal of SP-Phone is interrupted,
performing the next set up to a cordless handset will improve it to some extent.
Conditions
1. When customer’s line has less line loss.
ex.) The customer is using optical fiber, ISDN terminal adaptor, or PBX.
In this case, receiving signal is strong and it may affect transmission signal.
2. When the other party is talking from noisy place.
ex.) The other party is using cellular phone. The background noise is very loud.
In this case, the noise from the other party (i.e. surrounding noise) may affect transmission signal.
Setting Method
• Change the address of EEPROM (0144) from 00 to 01.
(P)
Timing Confirmation
-
Follow steps 1 to 3 of (K).
4.Confirm that the Timing accuracy is < ± 2.0ppm.
IC1, IC4, C66, 
C58, C57, 
C50, C53, 
C52, R52, 
C60, C61
(Q)* RSSI Level Confirmation
-
Follow steps 1 to 3 of (K).
4.Set DECT tester power to -81dBm.
5.Execute the command “readrssi”.
6.Confirm that the returned value is 1B ± 8 (hex).
7.Set DECT tester power to -63dBm.
8.Execute the command “readrssi”.
9.Confirm that the returned value is 23 ± 8 (hex).
IC1, IC4, C66, 
C58, C57, 
C50, C53, 
C52, R52, 
C60, C61
(R) Power RAMP Confirma-
tion
-
Follow steps 1 to 3 of (K).
4.Confirm that Power RAMP is matching.
IC1, IC4, C66, 
C58, C57, 
C50, C53, 
C52, R52, 
C60, C61
(S) Audio Check and Confir-
mation
-
1. Link to BASE which is connected to Line Simulator.
2. Set line voltage to 48V and line current to 40mA.
3. Input -45dBm/1KHz to MIC and measure Line output level.
4. Confirm that the level is -10dBm ± 2dBm and that the distortion level is < 5% at
TEL Line (600
Ω Load).
5. Input -20dBm/1KHz to Line I/F and measure Receiving level at REV-TEST1
and REV-TEST2.
6. Confirm that the level is -21dBm ± 2dBm and that the distortion level is < 5% at
Receiver. (vol = 1)
IC1, R21, R22, 
L9, R93, C11, 
R24, R23, 
R25, C12, 
C95, R94, 
C98, C112, 
C86, R31, 
C108, D4, D5
(T) SP phone Audio Check 
and Confirmation
-
1. Link to Base which is connected to Line Simulator.
2. Set line voltage to 48V and line current to 40mA.
3. Set the handset off-hook using SP-Phone key.
4. Input -25dBm/1KHz to Line I/F and measure Receiving level at SP_TEST1 and
SP_TEST2.
5. Confirm that the level is -14dBm ± 2dBm and that the distortion level is < 5%.
(vol = 3)
IC1, R21, R22, 
L9, R93, C11, 
R24, R23, 
R25, C12, 
C39, C101, 
C102
Items
Check 
Point
Procedure
Check or 
Replace Parts
52
KX-TG8125RU/KX-TGA810RU
9.4.
How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
9.4.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity 
→ 0.82.
Type 
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (Pbf: Pb free) (P.4).
9.4.2.
How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the land with some tools like a soldering wire. If some solder is left
at the joint on the board, the new IC will not be attached properly.
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