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Model
KX-TG8021UAC KX-TG8021UAS KX-TG8021UAT KX-TGA800RUC KX-TGA800RUS KX-TGA800RUT
Pages
103
Size
2.47 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / DIGITAL CORDLESS ANSWERING SYSTEM
File
kx-tg8021uac-kx-tg8021uas-kx-tg8021uat-kx-tga800ru.pdf
Date

Panasonic KX-TG8021UAC / KX-TG8021UAS / KX-TG8021UAT / KX-TGA800RUC / KX-TGA800RUS / KX-TGA800RUT Service Manual ▷ View online

73
KX-TG8021UA/KX-TGA800RU
12.2. CPU Data (Handset)
12.2.1. IC1 (BBIC)
Pin No.
Description
I/O
Connection
at Normal mode
at Reset mode
1
VSS_LNA1
-
GND
-
-
2
RF_RXp
A.I
RF_RXp
A.I
A.I
3
RF_RXn
A.I
RF_RXn
A.I
A.I
4
VSS_LNA2
-
GND
-
-
5
RFP1
D.O
RXON
O_0/1
Hi-Z
6
RFP0
D.O
ANT1
O_0/1
Hi-Z
7
REF_RES
A.O
REF_RES
A.O
A.O
8
AVS_XTAL
-
GND
-
-
9
XTAL2
A.I
XTAL2
A.I
A.I
10
XTAL1
A.I
XTAL1
A.I
A.I
11
AVD_XTAL
-
AVD_XTAL
-
-
12
RF_SUPPLY1
-
RF_SUPPLY1
-
-
13
LDO_CTRL
A.O
LDO_CTRL
A.O
O-1
14
AVD
-
+1.8V
-
-
15
LSRn
A.O
LSRn
A.O
A.O
16
LSRp
A.O
LSRp
A.O
A.O
17
VREFm
-
GND
-
-
18
MICh
A.I
MICh
A.I
A.I
19
CIDOUT/MICn
A.I
MICn
A.I
A.I
20
CIDINn/MICp
A.I
MICp
A.I
A.I
21
CIDINp/VREFp
A.O
VREFp
A.O
A.I
22
RINGp/P3_7
D.O
COL4
O_0/1
A.I
23
RINGn/P3_6
D.O
COL3
O_0/1
A.I
24
RINGOUT/RINGING/
P3_5
D.O
COL2
O_0/1
A.I
25
PARADET/P3_4
D.O
COL1
O_0/1
A.I
26
ADC0/P3_3
D.O
COL0
O_0/1
A.I
27
ADC1/INT0/P1_0
D.I
ROW0
I_0/1
I-PU
28
NTC/ADC2
A.I
GND
I_0
A.I
29
SOCp
A.I
SOCp
A.I
A.I
30
SOCn
A.I
SOCn
A.I
A.I
31
CHARGE_CTRL
A.O
CHARGE_CTRL
A.O
O-0
32
P1_7/CHARGE
A.I
CHARGE
A.I
I-PD
33
PAOUTp/P3_1
A.O
PAOUTp
A.O
O-0
34
VDDPA
-
VDDPA
-
-
35
PAOUTn/P3_0
A.O
PAOUTn
A.O
O-0
36
VBAT1
-
VBAT1
-
-
37
CP_C1x
A.I/O
CP_C1x
A.I/O
A.I
38
CP_C2x
A.I/O
CP_C2x
A.I/O
A.I
39
CP_C1y
A.I/O
CP_C1y
A.I/O
A.I
40
VBAT2
-
VBAT2
-
-
41
CP_C2y
A.I/O
CP_C2y
A.I/O
A.I
42
CP_VOUT1/LED1
A.O
CP_VOUT1
A.O
A.I
43
CP_VOUT2/LED2
A.O
CP_VOUT2
A.O
A.I
44
PON/P1_6
A.I
PON
A.I
I-PD
45
VDD1
-
+1.8V
-
-
46
P2_7/BXTAL
D.O
COL5
O_0/1
I-PU
47
P1_5/INT5/RDI/VDDE
D.O
N.C.
O_0
O-1
48
P1_4/INT4/TDOD
D.O
N.C.
O_0
I-PD
49
P1_3/INT3/SIO
D.I
ROW3
I_0/1
I-PD
50
P1_2/INT2/SK
D.I
ROW2
I_0/1
I-PU
51
P1_1/INT1/LE
D.I
ROW1
I_0/1
I-PU
52
P2_6/WTF_IN
D.O
KEY_LED
O_0/1
I-PU
53
P0_7/SPI_DI
D.O
EEPROM_WP
O_0/1
I-PU
54
P0_6/SPI_DO
D.O
LCD_SDA
O_0/1
I-PU
55
P0_5/SPI_CLK
D.O
LCD_SCL
O_0/1
I-PU
56
P0_4/SPI_EN
D.O
LCD_CD
O_0/1
I-PU
57
P0_3/SCL2
D.O
SCL
O_0/1
I-PU
58
P0_2/SDA2
D.I/O
SDA
I/O_0/1
I-PU
59
P0_1/URX
D.I
URX
I_0/1
I-PU
60
P0_0/UTX
D.O
UTX
O_0/1
I-PU
61
RSTn
D.O
RSTn
O_0/1
I-PU
74
KX-TG8021UA/KX-TGA800RU
62
JTAG
D.I/O
JTAG
I/O_0/1
I-PU
63
P2_5/PCM_FSC/SF
D.O
LCD_CSB
O_0/1
I-PU
64
P2_4/SCL1/PCM_DO/
DP3
D.O
N.C.
O_0
I-PU
65
P2_3/SDA1/PCM_DI/DP2
D.O
LCD_BACKLIT(NC)
O_0
I-PU
66
P2_2/PCM_CLK/CLK100
D.O
LCD_RESET
O_0/1
I-PU
67
P2_1/ECZ2/PWM1/LED4
D.I
N.C.
O_0
A.I
68
P2_0/ECZ1/PWM0/LED3
D.O
BELL_LED_A
A.I
A.I
69
VDD2
-
+1.8V
-
-
70
LDORF_CTRL
A.I
N.C.
A.I
A.I
71
RF_SUPPLY2
-
RF_SUPPLY2
-
-
72
RF0n
D.O
ANT2
O_0/1
Hi-Z
73
RFP4
D.O
PON
O_0/1
Hi-Z
74
RFP3
D.O
PSEL
O_0/1
Hi-Z
75
VDD_PADR
A.O
VDD_PADRV
A.O
A.O
76
VSS_PADR1
-
GND
-
-
77
RF_TXp
A.O
TXp
A.O
A.O
78
RF_TXn
A.O
TXn
A.O
A.O
79
VSS_PADR2
-
GND
-
-
80
RFP2
D.O
TXON
O_0/1
Hi-Z
81
GND
-
GND
-
-
Pin No.
Description
I/O
Connection
at Normal mode
at Reset mode
75
KX-TG8021UA/KX-TGA800RU
12.3. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
12.3.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 
°F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity 
→ 0.82.
Type 
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (Pbf: Pb free) (P.4)
12.3.2. How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
76
KX-TG8021UA/KX-TGA800RU
12.3.3. How to Install the IC
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
12.3.4. How to Remove a Solder Bridge
1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
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