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49

(H)* Battery Monitor Check

-

1. Apply 2.25 V between BATT and GND.
2. Execute the command “readbatt”.

It assumes that the return value is XX.
a) 1E   XX   2C: No need to adjust
b) XX: 18 ~ 1D: Need to adjust
XX: 2D ~ 32: Need to adjust
Write AD value of 2.25V to EEPROM.
ex) read data: XX = 1D, write data: YY = 1D
read data: XX = 2D, write data: YY = 2D
EEPROM = 0004(Low Voltage) write “YY”
Execute the command “wreeprom 00 04 01 YY”.
EEPROM = 0005(No Voltage) write “YY - 1D”
Execute the command “wreeprom 00 05 01 ZZ”.
EEPROM = 000A(Low Voltage BL) write “YY - 16”
Execute the command “wreeprom 00 0A 01 WW”.

ZZ = YY - 1D, WW = YY - 16

No Voltage writing data limit is ‘00’.
c) XX: 00 ~ 17: Reject
XX: 33 ~ FF: Reject

IC1, F1, C1, 

C3, R12

(I)

Battery Low Confirma-

tion

-

1. Apply 2.40 V between BATTERY(+) and BATTERY(-).
2. Confirm that there is no flashing of Battery Icon.
3. Apply 2.25 V ± 0.08 V between BATTERY(+) and BATTERY(-).
4. Confirm that there is flashing of Battery Icon.

IC1, F1, C1,  

C3, R12

(J)* BBIC Clock Adjustment

CLK

1. Apply 2.6 V between BATTERY(+) and BATTERY(-) with DC power.
2. Execute the command “conttx”.
3. Input Command “rdeeprom 00 01 01”, then you can confirm the current value.
4. Adjust the frequency of CLK executing the command “setfreq xx (where xx is

the value)” so that the reading of the frequency counter is 10.368000 MHz ± 10
Hz.

CLK is displayed only for a few seconds when executing the command “conttx”
after battery is inserted.

IC1, X1, C6, 

C7, R19, IC4, 

C57

(K)* Transmitted Power Con-

firmation

-

Remove C66 before starting step from 1 to 4.

        Be sure to keep C66 you removed, and resolder it to the original position after  
        checking RF.

1. Configure the DECT tester (CMD60) as follows;

<Setting>

• Test mode: PP
• RFPI: 0102030405
• Traffic Carrier: 5
• Traffic Slot: 4
• Mode: Loopback
• RF LEVEL = -70 dBm

2. Execute the command “regcmd60 01 02 03 04 05”.
3. Initiate connection from DECT tester.
4. Confirm that the NTP value at ANT is 19 dBm ~ 25 dBm.

IC1, IC4, C66, 

C58, C57, 
C50, C52, 
C53, R52, 

C60, C61

(L)* Modulation Check and 

Adjustment

-

Follow steps 1 to 3 of (K).

4.Confirm that the B-Field Modulation is -350 ~ -400/+320 ~ +370 kHz/div using
data type Fig 31.
5.Adjust the B-Field Modulation if required. (Execute the command “Readmod”
and “wrtmod xx”, where xx is the value.)

IC1, IC4, C66, 

C58, C57, 
C50, C52, 
C53, R52, 

C60, C61

(M)* Frequency Offset Confir-

mation

-

Follow steps 1 to 3 of (K).

4.Confirm that the frequency Offset is < ± 45 kHz.

IC1, IC4, C66, 

C58, C57, 
C50, C52, 
C53, R52, 

C60, C61

(N)* Frequency Drift Confir-

mation

-

Follow steps 1 to 3 of (K).

4.Confirm that the frequency Drift is < ± 30 kHz/ms.

IC1, IC4, C66, 

C58, C57, 
C50, C52, 
C53, R52, 

C60, C61

(O)*

Sensitivity Receiver 

Confirmation

-

Follow steps 1 to 3 of (K).

4.Set DECT tester power to -88 dBm.
5.Confirm that the BER is < 1000 ppm.

IC1, IC4, C66, 

C58, C57, 
C50, C52, 
C53, R52, 

C60, C61

Items

Check 

Point

Procedure

Check or 

Replace Parts

50

When the customer’s telephone line corresponds to the following conditions, and the transmission signal of SP-Phone is inter-
rupted, performing the next set up to a cordless handset will improve it to some extent.
Conditions

1. When customer’s line has less line loss.

ex.) The customer is using optical fiber, ISDN terminal adaptor, or PBX.
In this case, receiving signal is strong and it may affect transmission signal.

2. When the other party is talking from noisy place.

ex.) The other party is using cellular phone. The background noise is very loud.
In this case, the noise from the other party (i.e. surrounding noise) may affect transmission signal.

• Change the address of EEPROM (0144) from 00 to 01.

(P)*

Timing Confirmation

-

Follow steps 1 to 3 of (K).

4.Confirm that the Timing accuracy is < ± 2.0 ppm.

IC1, IC4, C66, 

C58, C57, 
C50, C52, 
C53, R52, 

C60, C61

(Q)* RSSI Level Confirmation

-

Follow steps 1 to 3 of (K).

4.Set DECT tester power to -81 dBm.
5.Execute the command “readrssi”.
6.Confirm that the returned value is 1C ± 8 (hex).
7.Set DECT tester power to -63 dBm.
8.Execute the command “readrssi”.
9.Confirm that the returned value is 25 ± 8 (hex).

IC1, IC4, C66, 

C58, C57, 
C50, C52, 
C53, R52, 

C60, C61

(R)* Power RAMP Confirma-

tion

-

Follow steps 1 to 3 of (K).

4.Confirm that Power RAMP is matching.

IC1, IC4, C66, 

C58, C57, 
C50, C52, 
C53, R52, 

C60, C61

(S) Audio Check and Confir-

mation

-

1. Link to BASE which is connected to Line Simulator.
2. Set line voltage to 48 V and line current to 40 mA.
3. Input -45 dBm/1 KHz to MIC and measure Line output level.
4. Confirm that the level is -8 dBm ± 2 dBm and that the distortion level is < 5% at

TEL Line (600 

Ω Load).

5. Remove a bone conduction unit, and connect a JIG to REV (+) and REV (-) as 

shown in Adjustment Standard (Handset) (P.61).

6. Input -20dBm/1KHz to Line I/F and measure Receiving level at REV (+) and 

REV (-).

7. Confirm that the level is -24 dBm ± 2 dBm. (vol = 1)

IC1, R23, R25, 

C12, R24, 

C11, R143, 

R97, C82, R9, 

CN4, C83, 

R21, MIC, 

C113, R22, 
R33, C105, 

C107, R32

(T) SP phone Audio Check 

and Confirmation

-

1. Link to Base which is connected to Line Simulator.
2. Set line voltage to 48 V and line current to 40 mA.
3. Set the handset off-hook using SP-Phone key.
4. Input -25 dBm/1KHz to Line I/F and measure Receiving level at SP+ and SP-.
5. Confirm that the level is -13.5 dBm ± 2 dBm. (vol = 3)

IC1, R121, 
C121, IC5, 

R122, C122, 

L13, C70, C71, 

R124, C126, 

D12, C123, 

C124, C125

Items

Check 

Point

Procedure

Check or 

Replace Parts

51

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700 

°F ± 20 °F (370 °C ± 10 °C)

Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.

• Flux

Recommended Flux: Specific Gravity 

→ 0.82.

Type 

→ RMA (lower residue, non-cleaning type)

Note: See About Lead Free Solder (Pbf: Pb free) (P.4)

1. Put plenty of solder on the IC pins so that the pins can be completely covered.

If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.

52

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.