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45

If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester
(*1) or not. 

(*1) A general repair is possible even if you don’t have the DECT tester because it is for confirming the levels, such as Acoustic
level in detail.
(*2) Refer to Check Point (Handset) (P.45)

Please follow the items below when BBIC or EEPROM is replaced.

After the measuring, suck up the solder of TP.
*: PC Setting (P.58) is required beforehand.
The connections of adjustment equipments are as shown in Adjustment Standard (Handset) (P.60).

Items

Check 

Point

Procedure

Check or 

Replace Parts

(A)* 1.8V Supply Adjustment

VDD1

1. Confirm that the voltage between test point VDD1 and GND is 1.8V ± 0.02V.
2. Execute the command “bandgap”, then check the current value.
3. Adjust the 1.8V voltage of VDD1 executing command “bandgap XX“(XX is the

value).

IC1, Q2, C10

(B)

DC/DC Supply Confir-

mation

VDD3

1. Confirm that the voltage between test point VDD3 and GND is 3.3V ± 0.3V

(Backlight is ON).

IC1, F1, C1, 

C2, C3, R1, 

Q1, D1, L1

(C) 2.5V Supply Confirma-

tion

VDD2

1. Confirm that the voltage between test point VDD2 and GND is 2.5V ± 0.1V.

IC1, Q3, C4, 

C5

(D)*

BBIC Confirmation

-

1. BBIC Confirmation (Execute the command “getchk”).
2. Confirm the returned checksum value.

Connection of checksum value and program number is shown below.

IC1, X1, C6, 

C7, R19

(E)* EEP-ROM Confirmation

-

1. EEP-ROM Confirmation (Execute the command “ChkTGA710XXrevYY”).

XX: country code
YY: revision number

2. Confirm the returned checksum value.

“XX”, “YY”, and “checksum” vary depending on the country version. You can find
them in the batch file, PQZZ- mentioned in JIG and PC (P.58).

IC1, IC3, R40, 

R41, R42, 
Q10, Q11, 
R43, R44,

C37

(F) Charge Control Check & 

Charge Current Monitor 

Check

-

1. Apply 3.5V between J3(+) and J4(-) with DC power supply and set current limit

to 250mA.

2. Confirm that the current limit LED of DC power supply is ON/OFF.
3. Decrease current limit of DC power supply to 100mA.
4. Confirm that the current limit LED of DC power supply is stable. (Current limiter

is ON.)

(If charge control cannot be confirmed by this procedure, please use battery to hand-
set power supply and try again.)

IC1, Q4, Q5, 

Q9, D6, D7, 

D8, L4, 

L5, R5, R6, 

R7, R8, F1

46

(G)* Charge Detection (OFF) 

Check

-

1. Stop supplying 3.5V to J3 CHARGE(+) and J4 CHARGE(-).
2. Execute the command “Backloff” then “charge”.
3. Confirm that the returned value is 00 (hex).

IC1, Q4, Q5, 

Q9, D6, D7, 

D8, L4, 

L5, R5, R6, 

R7, R8, F1

(H)* Battery Monitor Check

-

1. Apply 2.25V between BATT and GND.
2. Execute the command “readbatt”.

It assumes that the return value is XX.
a) 1E   XX   2C: No need to adjust
b) XX: 18 ~ 1D: Need to adjust
XX: 2D ~ 32: Need to adjust
Write AD value of 2.25V to EEPROM.
ex) read data: XX = 1D, write data: YY = 1D
read data: XX = 2D, write data: YY = 2D
EEPROM = 0004(Low Voltage) write “YY”
Execute the command “wreeprom 00 04 01 YY”.
EEPROM = 0005(No Voltage) write “YY - 1D”
Execute the command “wreeprom 00 05 01 ZZ”.
EEPROM = 000A(Low Voltage BL) write “YY - 16”
Execute the command “wreeprom 00 0A 01 WW”.

ZZ = YY - 1D, WW = YY - 16

No Voltage writing data limit is ‘00’.
c) XX: 00 ~ 17: Reject
XX: 33 ~ FF: Reject

IC1, F1, C1 

C3, R12

(I)

Battery Low Confirma-

tion

-

1. Apply 2.40V between BATTERY(+) and BATTERY(-).
2. Confirm that there is no flashing of Battery Icon.
3. Apply 2.25V ± 0.08V between BATTERY(+) and BATTERY(-).
4. Confirm that there is flashing of Battery Icon.

IC1, F1, C1 

C3, R12

(J)* BBIC Clock Adjustment

CLK

1. Apply 2.6V between BATTERY(+) and BATTERY(-) with DC power.
2. Execute the command “conttx”.
3. Input Command “rdeeprom 00 01 01”, then you can confirm the current value.
4. Adjust the frequency of CLK executing the command “setfreq xx (where xx is

the value)” so that the reading of the frequency counter is 10.368000MHz ±
10Hz.

Note:

CLK is displayed only for a few seconds when executing the command “conttx”
after battery is inserted.

IC1, X1, C6, 

C7, R19, 

IC4, C57,

R51

(K)* Transmitted Power Con-

firmation

-

Remove the Antenna before starting step from 1 to 4.

1. Configure the DECT tester (CMD60) as follows;

<Setting>

• Test mode: PP
• RFPI: 0102030405
• Traffic Carrier: 5
• Traffic  Slot:  4
• Mode: Loopback
• RF LEVEL = -70dBm

2. Execute the command “regcmd60 01 02 03 04 05".
3. Initiate connection from DECT tester.
4. Confirm that the NTP value at A201 is   19dBm ~ 25dBm.

IC1, IC4, C66,

C58, R51, 
C57, C50, 
C52, C53, 
R52, C60,

C61

(L)* Modulation Check and 

Adjustment

-

Follow steps 1 to 3 of (K).

4.Confirm that the B-Field Modulation is -350 ~ -400/+320 ~ +370kHz/div using
data type Fig 31.
5.Adjust the B-Field Modulation if required. (Execute the command “Readmod”
and “wrtmod xx”, where xx is the value.)

IC1, IC4, C66,

C58, R51, 
C57, C50, 
C52, C53, 
R52, C60,

C61

(M) Frequency Offset Confir-

mation

-

Follow steps 1 to 3 of (K).

4.Confirm that the frequency Offset is < ± 45kHz.

IC1, IC4, C66,

C58, R51, 
C57, C50, 
C52, C53, 
R52, C60,

C61

(N) Frequency Drift Confir-

mation

-

Follow steps 1 to 3 of (K).

4.Confirm that the frequency Drift is < ± 30kHz/ms.

IC1, IC4, C66,

C58, R51, 
C57, C50, 
C52, C53, 
R52, C60,

C61

Items

Check 

Point

Procedure

Check or 

Replace Parts

47

When the customer’s telephone line corresponds to the following conditions, and the transmission signal of SP-Phone is inter-
rupted, performing the next set up to a cordless handset will improve it to some extent.
Conditions

1. When customer’s line has less line loss.

ex.) The customer is using optical fiber, ISDN terminal adaptor, or PBX.
In this case, receiving signal is strong and it may affect transmission signal.

2. When the other party is talking from noisy place.

ex.) The other party is using cellular phone. The background noise is very loud.
In this case, the noise from the other party (i.e. surrounding noise) may affect transmission signal.

• Change the address of EEPROM (0144) from 00 to 01.

(O)

Sensitivity Receiver 

Confirmation

-

Follow steps 1 to 3 of (K).

4.Set DECT tester power to -88dBm.
5.Confirm that the BER is < 1000ppm.

IC1, IC4, C66,

C58, R51, 
C57, C50, 
C52, C53, 
R52, C60,

C61

(P)

Timing Confirmation

-

Follow steps 1 to 3 of (K).

4.Confirm that the Timing accuracy is < ± 2.0ppm.

IC1, IC4, C66,

C58, R51, 
C57, C50, 
C52, C53, 
R52, C60,

C61

(Q)* RSSI Level Confirmation

-

Follow steps 1 to 3 of (K).

4.Set DECT tester power to -81dBm.
5.Execute the command “readrssi".
6.Confirm that the returned value is 1C ± 8 (hex).
7.Set DECT tester power to -63dBm.
8.Execute the command “readrssi".
9.Confirm that the returned value is 25 ± 8 (hex).

IC1, IC4, C66,

C58, R51, 
C57, C50, 
C52, C53, 
R52, C60,

C61

(R) Power RAMP Confirma-

tion

-

Follow steps 1 to 3 of (K).

4.Confirm that Power RAMP is matching.

IC1, IC4, C66,

C58, R51, 
C57, C50, 
C52, C53, 
R52, C60,

C61

(S) Audio Check and Confir-

mation

-

1. Link to BASE which is connected to Line Simulator.
2. Set line voltage to 48V and line current to 40mA.
3. Input -45dBm/1KHz to MIC and measure Line output level.
4. Confirm that the level is -10dBm ± 2dBm and that the distortion level is < 5% at

TEL Line (600

Ω Load).

5. Input -20dBm/1KHz to Line I/F and measure Receiving level at REV1 and

REV2.

6. Confirm that the level is -21dBm ± 2dBm and that the distortion level is < 5% at

Receiver. (volume: 3)

IC1, R21, R22, 

R23, R24, 

R25, C11, 

C70, C71, 

D4, D5

(T) SP phone Audio Check 

and Confirmation

-

1. Link to Base which is connected to Line Simulator.
2. Set line voltage to 48V and line current to 40mA.
3. Set the handset off-hook using SP-Phone key.
4. Input -25dBm/1KHz to Line I/F and measure Receiving level at SP_TEST1 and

SP_TEST2.

5. Confirm that the level is -14dBm ± 2dBm and that the distortion level is < 5%.

(vol = 3)

IC1, R21, R22, 

R23, R24, 

R25, C11, 

R103, R104, 

C98, C99, 

C39

Items

Check 

Point

Procedure

Check or 

Replace Parts

48

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700 

°F ± 20 °F (370 °C ± 10 °C)

Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.

• Flux

Recommended Flux: Specific Gravity 

→ 0.82.

Type 

→ RMA (lower residue, non-cleaning type)

Note: See About Lead Free Solder (Pbf: Pb free) (P.4)

1. Put plenty of solder on the IC pins so that the pins can be completely covered.

If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.