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1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

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This description is only applied on the model with Shield case.

• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700 

°F ± 20 °F (370 °C ± 10 °C)

Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less 
experience could overheat and damage the PCB foil.

• Hot Air Desoldering Tool

Temperature: 608 

°F ± 68 °F (320 °C ± 20 °C)

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

1. Heat the IC with a hot air desoldering tool through the P.C.Board.

2. Pick up the IC with tweezers, etc. when the solder is melted completely.

• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable. 

When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.

3. After removing the IC, clean the P.C.Board of residual solder.

P.C.Board

IC

Hot Air Desoldering Tool

Tweezers, etc.

P.C.Board

IC

P.C.Board

Hot Air Desoldering Tools

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1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.

2. Place the solder a little on the land where IC pins are to be attached, then place the IC.

• When placing the IC, the positioning should be done very carefully.

3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.

• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.

4. After soldering, confirm there are no short and open circuits with visual inspection.

Solder

Soldering Iron

P.C.Board

Land

IC

Solder

Soldering Iron

P.C.Board

Land

P.C.Board

IC

Hot Air Desoldering Tool

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• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700

°F ± 20°F (370°C ± 10°C)

Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less 
experience could overheat and damage the PCB foil.

• Hot Air Desoldering Tool

Temperature: 608

°F ± 68°F (320°C ± 20°C)

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.

1. Cut the case along perforation.

2. Remove the cut part.

3. Cut the four corners along perforation.

4. Remove the reminds by melting solder.