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• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700

°F ± 20°F (370°C ± 10°C)

Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less 
experience could overheat and damage the PCB foil.

If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.

1. Cut the case along perforation.

2. Remove the cut part.

3. Cut the four corners along perforation.

4. Remove the reminds by melting solder.

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• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
• Shield case’s No. : PNMC1013Z

1. Put the shield case.

2. Solder the surroundings.

67

• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700 

°F ± 20 °F (370 °C ± 10 °C)

Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less 
experience could overheat and damage the PCB foil.

• Hot Air Desoldering Tool

Temperature: 608 

°F ± 68 °F (320 °C ± 20 °C)

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

1. Heat the IC with a hot air desoldering tool through the P.C.Board.

2. Pick up the IC with tweezers, etc. when the solder is melted completely.

• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable. 

When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.

3. After removing the IC, clean the P.C.Board of residual solder.

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1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.

2. Place the solder a little on the land where IC pins are to be attached, then place the IC.

• When placing the IC, the positioning should be done very carefully.

3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.

• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.

4. After soldering, confirm there are no short and open circuits with visual inspection.

When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.