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Model
KX-TG6421CAM KX-TG6421CAT KX-TG6422CAT KX-TGA641RUM KX-TGA641RUT
Pages
106
Size
2.62 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / DIGITAL CORDLESS ANSWERING SYSTEM
File
kx-tg6421cam-kx-tg6421cat-kx-tg6422cat-kx-tga641ru.pdf
Date

Panasonic KX-TG6421CAM / KX-TG6421CAT / KX-TG6422CAT / KX-TGA641RUM / KX-TGA641RUT Service Manual ▷ View online

73
KX-TG6421CAM/KX-TG6421CAT/KX-TG6422CAT/KX-TGA641RUM/KX-TGA641RUT
12.2. CPU Data (Handset)
12.2.1. IC1 (BBIC)
Pin No.
Description
I/O
Connection
at Normal mode
at Reset mode
1
VSS_LNA1
-
GND
-
-
2
RF_RXp
A.I
RF_RXp
A.I
A.I
3
RF_RXn
A.I
RF_RXn
A.I
A.I
4
VSS_LNA2
-
GND
-
-
5
RFP1
D.O
RXON
H/L
Hi-Z
6
RFP0
D.O
ANT1
H/L
Hi-Z
7
REF_RES
A.O
REF_RES
A.O
A.O
8
AVS_XTAL
-
GND
-
-
9
XTAL2
A.I
XTAL2
A.I
A.I
10
XTAL1
A.I
XTAL1
A.I
A.I
11
AVD_XTAL
-
AVD_XTAL
-
-
12
RF_SUPPLY1
-
RF_SUPPLY1
-
-
13
LDO_CTRL
A.O
LDO_CTRL
A.O
O-1
14
AVD
-
+1.8V
-
-
15
LSRn
A.O
LSRn
A.O
A.O
16
LSRp
A.O
LSRp
A.O
A.O
17
VREFm
-
GND
-
-
18
MICh
A.I
N.C.
A.I
A.I
19
CIDOUT/MICn
A.I
MICn
A.I
A.I
20
CIDINn/MICp
A.I
MICp
A.I
A.I
21
CIDINp/VREFp
A.O
VREFp
A.O
A.I
22
RINGp/P3_7
D.O
COL4
H/L
L
23
RINGn/P3_6
D.O
COL3
H/L
L
24
RINGOUT/RINGING/P3_5
D.O
COL2
H/L
L
25
PARADET/P3_4
D.O
COL1
H/L
L
26
ADC0/P3_3
D.O
COL0
H/L
L
27
ADC1/INT0/P1_0
D.O
NC
L
L
28
NTC/ADC2
A.I
ADC2
I_0
A.I
29
SOCp
A.I
SOCp
A.I
A.I
30
SOCn
A.I
SOCn
A.I
A.I
31
CHARGE_CTRL
A.O
CHARGE_CTRL
A.O
O-0
32
P1_7/CHARGE
A.I
CHARGE
A.I
I-PD
33
PAOUTp/P3_1
A.O
PAOUTp
A.O
O-0
34
VDDPA
-
VDDPA
-
-
35
PAOUTn/P3_0
A.O
PAOUTn
A.O
O-0
36
VBAT1
-
VBAT1
-
-
37
CP_C1x
A.I/O
CP_C1x
A.I/O
A.I
38
CP_C2x
A.I/O
CP_C2x
A.I/O
A.I
39
CP_C1y
A.I/O
CP_C1y
A.I/O
A.I
40
VBAT2
-
VBAT2
-
-
41
CP_C2y
A.I/O
CP_C2y
A.I/O
A.I
42
CP_VOUT1/LED1
A.O
CP_VOUT1
A.O
A.I
43
CP_VOUT2/LED2
A.O
CP_VOUT2
A.O
A.I
44
PON/P1_6
A.I
PON
A.I
L
45
VDD1
-
+1.8V
-
-
46
P2_7/BXTAL
D.O
BXTAL
H/L
H
47
P1_5/INT5/RDI/VDDE
D.O
N.C.
L
L
48
P1_4/INT4/TDOD
D.I
ROW0
H/L
L
49
P1_3/INT3/SIO
D.I
ROW3
H/L
L
50
P1_2/INT2/SK
D.I
ROW2
H/L
H
51
P1_1/INT1/LE
D.I
ROW1
H/L
H
52
P2_6/WTF_IN
D.O
KEY_LED
H/L
H
53
P0_7/SPI_DI
D.O
EEPROM_WP
H/L
H
54
P0_6/SPI_DO
D.O
LCD_SDA
H/L
L
55
P0_5/SPI_CLK
D.O
LCD_SCL
H/L
L
56
P0_4/SPI_EN
D.O
LCD_CD
H/L
L
57
P0_3/SCL2
D.O
SCL
H/L
L
58
P0_2/SDA2
D.I/O
SDA
H/L
L
59
P0_1/URX
D.I
URX
H/L
H
60
P0_0/UTX
D.O
UTX
H/L
L
61
RSTn
D.O
RSTn
H/L
H
62
JTAG
D.I/O
JTAG
H/L
H
74
KX-TG6421CAM/KX-TG6421CAT/KX-TG6422CAT/KX-TGA641RUM/KX-TGA641RUT
63
P2_5/PCM_FSC/SF
D.O
LCD_CSB
H/L
H
64
P2_4/SCL1/PCM_DO/DP3
D.O
N.C.
L
L
65
P2_3/SDA1/PCM_DI/DP2
D.O
N.C.
L
L
66
P2_2/PCM_CLK/CLK100
D.O
LCD_RESET
H/L
L
67
P2_1/ECZ2/PWM1/LED4
D.O
N.C.
L
L
68
P2_0/ECZ1/PWM0/LED3
D.O
BELL_LED_A
A.I
A.I
69
VDD2
-
+1.8V
-
-
70
LDORF_CTRL
A.I
N.C.
A.I
A.I
71
RF_SUPPLY2
-
RF_SUPPLY2
-
-
72
RF0n
D.O
ANT2
H/L
Hi-Z
73
RFP4
D.O
PON
H/L
Hi-Z
74
RFP3
D.O
PSEL
H/L
Hi-Z
75
VDD_PADR
A.O
VDD_PADRV
A.O
A.O
76
VSS_PADR1
-
GND
-
-
77
RF_TXp
A.O
TXp
A.O
A.O
78
RF_TXn
A.O
TXn
A.O
A.O
79
VSS_PADR2
-
GND
-
-
80
RFP2
D.O
TXON
H/L
Hi-Z
81
GND
-
GND
-
-
Pin No.
Description
I/O
Connection
at Normal mode
at Reset mode
75
KX-TG6421CAM/KX-TG6421CAT/KX-TG6422CAT/KX-TGA641RUM/KX-TGA641RUT
12.3. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
12.3.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 
°F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity 
→ 0.82.
Type 
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (Pbf: Pb free) (P.4)
12.3.2. How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
76
KX-TG6421CAM/KX-TG6421CAT/KX-TG6422CAT/KX-TGA641RUM/KX-TGA641RUT
12.3.3. How to Install the IC
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
12.3.4. How to Remove a Solder Bridge
1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
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