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In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.

• PbF solder has a melting point that is 50 

°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with 

temperature control and adjust it to 700 

°F ± 20 °F (370 °C ± 10 °C). 

• Exercise care while using higher temperature soldering irons.: 

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 

°F (600 °C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

Component

Component 
pin

solder

Remove all of the
excess solder

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There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

0.3 mm X 100 g

0.6 mm X 100 g

1.0 mm X 100 g

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• Design and specifications are subject to change without notice.

• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line

DECT (Digital Enhanced Cordless 
Telecommunications),
GAP (Generic Access Profile)
   Number of channels:
120 Duplex Channels
   Frequency range:
1.88 GHz to 1.90 GHz
   Duplex procedure:
TDMA (Time Division Multiple Access)
   Channel spacing:
1,728 kHz
   Bit rate:
1,152 kbit/s
   Modulation:
GFSK (Gaussian Frequency Shift Keying)
   RF transmission power:
Approx. 10 m W (average power per channel) 

   Power source (AC Adaptor):
220–240 V AC, 50/60 Hz

   Power consumption

Base unit: PQLV219CEW

Charger: PQLV219CEW

Standby: Approx. 0.45 W
Maximum: Approx. 3.8 W
Charger:
Standby: Approx. 0.2 W
Maximum: Approx. 3.0 W

   Operating conditions:
0

°C–40 °C, 20 %–80 % relative air humidity (dry) 

   Dimensions:
Base unit: Approx. 97 mm x 117 mm x 50 mm
Handset: Approx. 47 mm x 25 mm x 148 mm
Charger: Approx. 72 mm x 79 mm x 52 mm
   Mass (weight):
Base unit: Approx. 125 

g

Handset: Approx. 115 

g

Charger: Approx. 55 

g

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   Voice coding:
ADPCM 32 kbit/s

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Analog

Front

End

To TEL_LINE

Bridge

Rect

 D3 D

3

Hook Switch

Q3,Q4,Q5Q

3

,Q

4

,Q

5

Audio

Bell/Caller ID

Interface

CPU

18

16

23

20

21

19

24

BELL

HOOK

Off-Hook Line Voltage

25

A/D

D/A

ADPCM

Codec Filter

DSP

Speech Encoding

Speech Decoding

BMC

Burst Encoding

Burst Decoding

RF

PLL 

5

3

77

75

9

10

EEPROM

SCL

SDA

57

58

44

Charge

Detector

(Optional)

BBIC

KX-TG5511 BLOCK DIAGRAM 

(BASE UNIT)

MOD/DEMOD

Charge

Pump

43

2.5V

XTAL

X1X

1

10.368

MHz

RX

n

RX

p

TX

p

TX

n

P

on

PSEL

V

DD

-PADRV

4

3

6

7

TX

on

RX

on

D801

6

72

ANT1

ANT2

9

8

ANT1

ANT2

RF PA

ANT1

ANT2

78

73

74

80

L1

L2

2

To AC Adaptor

Limit

Resistor

CHARGE 

CONTACT

IC2IC

2

Q9Q

9

Q8Q

8

2.4V

Reg.

1.8V

Reg.

3.0 V

2.4 V

1.8 V

DCP

DCM

IC3IC

3