Panasonic KX-NT553RU-B / KX-NT556RU-B Service Manual ▷ View online
45
KX-NT553RU/KX-NT553RU-B/KX-NT556RU/KX-NT556RU-B
11 Maintenance
11.1. Terminal Guide of the ICs Transistors and Diodes
11.1.1.
Main Board
11.1.2.
Operation Board
46
KX-NT553RU/KX-NT553RU-B/KX-NT556RU/KX-NT556RU-B
11.2. How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
11.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
F ± 20F (370C ± 10C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity
0.82.
Type
RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4).
11.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
11.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
solder to the tip so that it flows under the pins as they are
heated.
11.2.4.
Removing Solder From Between
Pins
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
pads.
47
KX-NT553RU/KX-NT553RU-B/KX-NT556RU/KX-NT556RU-B
11.3. Memo
48
KX-NT553RU/KX-NT553RU-B/KX-NT556RU/KX-NT556RU-B
12 Schematic Diagram
12.1. Main No.1
1/4
K
X
-NT553
58
/ K
X
-NT55
6
58
M
A
IN BO
A
RD No.1 1/4
C
B
A
3
2
1
4
DDR_R
AS
_N
DDR_C
AS
_N
DDR_WE_N
DDR_DM0
DDR_DM1
DDR_ODT0
DDR_C
S
0_N
DDR_CKE
DDR_
A
[0]
DDR_
A
[1]
DDR_
A
[2
]
DDR_
A
[3]
DDR_
A
[4]
DDR_
A
[5]
DDR_
A
[6
]
DDR_
A
[7
]
DDR_
A
[8]
DDR_
A
[9]
DDR_
A
[10]
DDR_
A
[11]
DDR_
A
[1
2
]
DDR_
A
[0]
DDR_
A
[1]
DDR_
A
[2
]
DDR_
A
[3]
DDR_
A
[4]
DDR_
A
[5]
DDR_
A
[6
]
DDR_
A
[7
]
DDR_
A
[8]
DDR_
A
[9]
DDR_
A
[10]
DDR_
A
[11]
DDR_
A
[1
2
]
DDR_C
S
0_N
DDR_WE_N
DDR_R
AS
_N
DDR_C
AS
_N
DDR_CKE
DDR_D
Q
[0]
DDR_D
Q
[1]
DDR_D
Q
[2
]
DDR_D
Q
[3]
DDR_D
Q
[4]
DDR_D
Q
[5]
DDR_D
Q
[6
]
DDR_D
Q
[7
]
DDR_D
Q
[8]
DDR_D
Q
[9]
DDR_D
Q
[10]
DDR_D
Q
[11]
DDR_D
Q
[1
2
]
DDR_D
Q
[13]
DDR_D
Q
[14]
DDR_D
Q
[15]
DDR_DM0
DDR_DM1
DDR_ODT0
NFLC
S
0
NFL
A
LE
NFLCLE
NFLRD
NFLWR
NFLRE
A
D
Y
DDR_B
A
[0]
DDR_B
A
[1]
DDR_B
A
[2
]
DDR_B
A
[0]
DDR_B
A
[1]
DDR_B
A
[2
]
DDR_CLK0
DDR_CLK0_N
DDR_CLK0_N
DDR_CLK0
DDR_D
Q
[0]
DDR_D
Q
[1]
DDR_D
Q
[2
]
DDR_D
Q
[3]
DDR_D
Q
[4]
DDR_D
Q
[5]
DDR_D
Q
[6
]
DDR_D
Q
[7
]
DDR_D
Q
[8]
DDR_D
Q
[9]
DDR_D
Q
[10]
DDR_D
Q
[11]
DDR_D
Q
[1
2
]
DDR_D
Q
[13]
DDR_D
Q
[14]
DDR_D
Q
[15]
DDR_D
QS
0_N
DDR_D
QS
0
DDR_D
QS
1_P
DDR_D
QS
1_N
DDR_D
QS
1_N
DDR_D
QS
1_P
DDR_D
QS
0_N
DDR_D
QS
0
DGND
R501
1
k
R50
2 1k
C503
0.1u
C504
0.1u
C505
0.1u
C506
0.1u
C507
0.1u
C508
0.1u
C511
0.1u
C512
0.1u
10
C513
0.1u
C509
0.1u
C510
0.1u
C50
2
0.1u
DGND
V
DDIO_DDR
C57
8
22u
6.3
C566
NC
C538
0.1u
C539
0.1u
C562
NC
C537
0.1u
C540
0.1u
C56
0
0.1u
DGND
C572
NC
C57
5
50
NC
C567
NC
PH
Y
_INT
00
2
:5B
PH
Y
_nR
S
T
00
2
:1C
IC50
2
D9
*DDRR
S
T
C10
DDRC
S
0
L4
M1
B11
DDRC
S
1
M4
A
14
*DDRWE
L1
B13
*DDRR
AS
M
2
B1
2
*DDRC
AS
K
2
D11
DDRB
A
0
B14
DDRB
A
1
K1
C13
DDRB
A2
J2
B15
DDR
A
0
H1
C1
2
DDR
A
1
J
1
C14
DDR
A2
K3
MEM
X
D10/LCDD14
B1
6
DDR
A
3
K4
MEM
X
D11/LCDD15
D13
DDR
A
4
N1
MEM
X
D1
2
/LCDD18
C15
DDR
A
5
L
2
MEM
X
D13/LCDD19
B1
7
DDR
A6
L3
MEM
X
D14/LCDD
2
0
A
19
DDR
A7
M3
MEM
X
D15/LCDD
2
1
C1
6
DDR
A
8
D14
DDR
A
9
B18
DDR
A
10
D15
DDR
A
11
C1
7
DDR
A
12
D1
6
DDR
A
13
B19
DDR
A
14
D10
DDRCKE
A
13
DDRCKELP
A
1
7
DDRCLK0
A
18
DDRCLK0_N
A
15
DDRCLK1
A
1
6
DDRCLK1_N
A7
DDRD
Q
0
B
7
DDRD
Q
1
B8
DDRD
Q2
C8
DDRD
Q
3
B9
DDRD
Q
4
A
10
DDRD
Q
5
C9
DDRD
Q6
B10
DDRD
Q7
D8
DDRDM0
A
9
DDRD
QS
0
A
8
DDRD
QS
0_N
B4
DDRD
Q
8
D5
DDRD
Q
9
C5
DDRD
Q
10
B5
DDRD
Q
11
C
6
DDRD
Q
12
D
6
DDRD
Q
13
C
7
DDRD
Q
14
D
7
DDRD
Q
15
B
6
DDRDM1
A6
DDRD
QS
1
A
5
DDRD
QS
1_N
E1
6
DDRP
A
DHI
E14
DDRP
A
DLO
R5
NFLRE
A
D
Y
1/MEM
XA22
U5
T4
V
5
NFLCLE/MEM
XA2
5
U4
NFL
A
LE/MEM
XA
1
7
T5
NFLC
S
0/MEM
XA
18
H4
MEMC
S
3/E
X
TINT
7
H3
MEMC
S2
/E
X
TINT
6
G4
G3
E4
MEMRD
J
4
MEMWR
E1
F
2
F1
MEMCKE/E
X
TINT13
G1
MEMCLK
D4
MEM
XA
1
6
F4
MEM
XA
15
D3
MEM
XA
14_B
A
1/LCDD8
D1
MEM
XA
13_B
A
0/LCDD1
G
2
MEM
XA
1
2
/E
X
TINT14
F3
MEM
XA
11/LCDGP8
C
2
MEM
XA
10/LCDGP
7
E
2
E3
D
2
C1
C3
B
2
A
3
A2
MEM
XA2
/E
X
TINT4
B3
B1
H
2
MEMD
Q
MBL
S
0/LCDD1
7
J
3
MEMD
Q
MBL
S
1/E
X
TINT5
C518
50
NC
C522
NC
C52
3
NC
C56
3
NC
C56
8
NC
C56
5
NC
DGND
C577
22u
6.3
R55
7
100
R559
NC
R5
6
0
NC
R5
6
1
NC
IC501
V
DDL
J
1
VSS
DL
J7
R1
V
DD5
P9
VSS
5
M9
V
DD4
N1
VSS
4
J
9
V
DD3
J
3
VSS
3
E1
V
DD
2
E3
VSS2
B
2
VSSQ2
C9
V
DD
Q
5
A7
VSSQ
1
A
0
M8
A
1
M3
C
7
V
DD
Q
4
A
1
V
DD1
A
3
VSS
1
A
9
V
DD
Q
1
C1
V
DD
Q2
E9
V
DD
Q6
G1
V
DD
Q7
C3
V
DD
Q
3
G3
V
DD
Q
8
G
7
V
DD
Q
9
G9
V
DD
Q
10
J2
V
REF
A2
M
7
A
3
N
2
D
Q
1
G
2
D
Q
0
G8
A
4
N8
A
5
N3
D
Q
3
H3
D
Q2
H
7
A6
N
7
A7
P
2
D
Q
5
H9
D
Q
4
H1
A
8
P8
A
9
P3
D
Q7
F9
D
Q6
F1
A
10
M
2
A
11
P
7
D
Q
9
C
2
D
Q
8
C8
A
1
2
R
2
NC
6
R8
D
Q
11
D3
D
Q
10
D
7
NC4
R3
NC5
R
7
D
Q
13
D9
D
Q
1
2
D1
B
A
0
L
2
B
A
1
L3
D
Q
15
B9
D
Q
14
B1
NC3
L1
*R
AS
K
7
*LD
QS
E8
LD
QS
F
7
*C
AS
L
7
*WE
K3
*UD
QS
A
8
UD
QS
B
7
LDM
F3
UDM
B3
NC
2
E
2
NC1
A2
ODT
K9
*C
S
L8
CKE
K
2
CK
J
8
B8
VSSQ
3
D
2
VSSQ
4
D8
VSSQ
5
E
7
VSSQ6
F
2
VSSQ7
F8
VSSQ
8
H
2
VSSQ
9
H8
VSSQ
10
*CK
K8
L508
R5
6
9
NC
R510
NC
V
DD33
V
R5
7
0
0
R5
7
1
0
R5
72
0
R5
7
3
0
DGND
R514
NC
R5
7
4
6
8
R5
7
5
6
8
GPIO
6
S
T
2
S
T1
S
T0
S
T3
R5
7
8
4.
7k
DGND
R5
22
22
R5
2
3
22
MEM
X
D0/LCDD
2
MEM
X
D1/LCDD3
MEM
X
D
2
/LCDD4
MEM
X
D3/LCDD5
MEM
X
D4/LCDD
6
MEM
X
D5/LCDD
7
MEM
X
D
6/LCDD10
MEM
X
D
7/LCDD11
MEM
X
D8/LCDD1
2
MEM
X
D9/LCDD13
MEM
XA
0/LCDD
22
MEM
XA
1/LCDD
23
MEM
XA
3/LCDGP0
MEM
XA
4/LCDGP1
MEM
XA
5/LCDGP
2
MEM
XA6
/LCDGP3
MEM
XA7
/LCDGP4
MEM
XA
8/LCDGP5
MEM
XA
9/LCDGP
6
MEM
XA
19_MEMC
AS
/LCDD9
MEM
XA2
0_MEMR
AS
/LCDD1
6
MEMC
S
0/LCDD0
MEMC
S
1/LPCLK
NFLRD/MEM
XA2
4
NFLWR/MEM
XA2
3
GPIO0
GPIO1
GPIO
2
GPIO5
GPIO3
GPIO4
(10)
(9)
(8)
(7
)
(6
)
(5)
(4)
(3)
(2
)
(1)
(9)
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