Panasonic KX-HDV330RUB Service Manual ▷ View online
41
KX-HDV330 Series
10.2. Remove LCD unit
10.3. Assembly for Lead wire
Perform this process in reverse when taking the unit apart.
1. Remove the LCD unit to Main Board.
Note:
Please note Lead soldering.
2. Pull the boss in the direction of the arrow, remove the LCD PLATE.
3. Remove the LCD and LCD HOLDER.
Lead soldering
Assemble LCD unit
Assemble LCD unit
Main Board
Main Board
Assemble LCD unit
LCD PLATE
LCD
LCD HOLDER
42
KX-HDV330 Series
10.3.1.
Connecting Lead Wires
Speaker
SOLDERING
Headset &Handset Jack
Headset
Jack
Handset
Jack
Clamp LEAD WIRE
to rubber slot.
to rubber slot.
RED
BLACK
YELLOW
GREEN
ORANGE
BLUE
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KX-HDV330 Series
11 Maintenance
11.1. Terminal Guide of the ICs Transistors and Diodes
11.1.1.
Main Board
C3ABUY000067
C1CB00003892
C1CB00004330
C0DBAYY01648
C0EBE0000436
C0DBAYY00921
C1CB00004391
DZ2J056M0L,DZ2J068M0L
B3AEB0000146
B3AEB0000146
B0JCDD000001,B0JCPL000004
DB2X41400L
B1CFRM000042
B1ADCN000007,B1ABDF000026
B1GDCFGJ0008,B1ADCF000020
B1GBCFGN0022,B1GBCFJJ0040
B1GDCFGJ0008,B1ADCF000020
B1GBCFGN0022,B1GBCFJJ0040
C0DBAYY01570
C2HBBY000150
A1
W1
W19
A19
1
32
96
65
33
64
128
97
1
4
8
5
1
2
4
3
1
3
6
4
1
8
16
9
A9
A1
T9
T1
Cathode
Anode
Anode
Cathode
Anode
Cathode
44
KX-HDV330 Series
11.2. How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
11.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity
0.82.
Type
RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4).
11.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
11.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
solder to the tip so that it flows under the pins as they are
heated.
11.2.4.
Removing Solder From Between
Pins
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
pads.
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