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Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700 

°F ± 20 °F (370 °C ± 10 °C)

Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where
someone with less experience could overheat and damage
the PCB foil.

• Flux

Recommended Flux: Specific Gravity 

→ 0.82.

Type 

→ RMA (lower residue, non-cleaning type)

Note: See About Lead Free Solder (PbF: Pb free) (P.4)

1. Put plenty of solder on the IC pins so that the pins can be

completely covered.
Note:

If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.

2. Make a few cuts into the joint (between the IC and its

pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC

pins.

When you attach a new IC to the board, remove all solder left
on the board with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.

1. Temporarily fix the FLAT PACKAGE IC, soldering the two

marked pins.

*Check the accuracy of the IC setting with the corresponding 
soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction

of the arrow.

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a

soldering iron as shown in the figure below.

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• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700 

°F ± 20 °F (370 °C ± 10 °C)

Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less 
experience could overheat and damage the PCB foil.

• Hot Air Desoldering Tool

Temperature: 608 

°F ± 68 °F (320 °C ± 20 °C)

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

1. Heat the IC with a hot air desoldering tool through the

P.C.Board.

2. Pick up the IC with tweezers, etc. when the solder is

melted completely.
Note:

• Be careful not to touch the peripheral parts with twee-

zers, etc. They are unstable. 

3. After removing the IC, clean the P.C.Board of residual sol-

der.

1. Place the solder a little on the land where the radiation

GND pad on IC bottom is to be attached.

2. Place the solder a little on the land where IC pins are to

be attached, then place the IC.
Note:

• When placing the IC, the positioning should be done very

carefully.

3. Heat the IC with a hot air desoldering tool through the

P.C.Board until the solder on IC bottom is melted.
Note:

• Be sure to place it precisely, controlling the air volume of

the hot air desoldering tool.

4. After soldering, confirm there are no short and open cir-

cuits with visual inspection.

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When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.

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