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Model
KX-UT113RU KX-UT113RU-B KX-UT123RU KX-UT123RU-B (serv.man3)
Pages
93
Size
2.49 MB
Type
PDF
Document
Service Manual
Brand
Device
PBX / SIP PHONE
File
kx-ut113ru-kx-ut113ru-b-kx-ut123ru-kx-ut123ru-b-sm.pdf
Date

Panasonic KX-UT113RU / KX-UT113RU-B / KX-UT123RU / KX-UT123RU-B (serv.man3) Service Manual ▷ View online

45
KX-UT113RU/KX-UT113RU-B/KX-UT123RU/KX-UT123RU-B
11 Maintenance
11.1. Terminal Guide of the ICs Transistors and Diodes
11.1.1. Main Board
11.1.2. Ope Board
46
KX-UT113RU/KX-UT113RU-B/KX-UT123RU/KX-UT123RU-B
11.2. How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
11.2.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity 
→ 0.82.
Type 
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.3).
11.2.2. Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
11.2.3. Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
11.2.4. Removing Solder From Between
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
47
KX-UT113RU/KX-UT113RU-B/KX-UT123RU/KX-UT123RU-B
11.2.5. Memo
48
KX-UT113RU/KX-UT113RU-B/KX-UT123RU/KX-UT123RU-B
12 Schematic Diagram
12.1. UT123RU Main No.1
(a)
(b)
(c)
(1)
(2)
KX-UT123
RU
 MAIN BOARD No.1 1/4
1/4
E_TXD0
E_TXD2
XD12
Flash_CS
SI
XD8
*CE
XA4
XA5
BACKLIGHT
E_TXER
XD0
E_TXCLK
LCD_RST
ASICCLK
ASICRST
I2C_SDA
I2C_SCL
XD9
LCD_A0
SI
SCLK
SO
Flash_CS
SCLK
Flash_RST
Flash_RST
SO
LCD_A0
LCD_RST
LCD_CS
R520
100
DG
R512
NC
R515
47k
DG
I2C_SCL
004
I2C_SDA
004
D_TMS
M11
XA4
M12
ATDI
M13
ATCK
N1
BGPIO2
N2
BGPIO6
N3
BGPIO4
N4
BGPIO5
N5
BGPIO10
N6
BGPIO11
N7
CGPIO9
N8
AGPIO2
N9
AGPIO3
N10
XA5
N11
AGPIO5
N12
ATDO
N13
ATMS
A5
XD8
A6
XD0
A7
DGPIO1
1
A8
A
T
RSTN
A9
DGPIO14
A10
DGPIO15
A1
1
EGPIO2
A12
DTDI
A13
DTMS
B1
AGPIO9
A1
DGPIO12
A2
TEST
A3
XD12
A4
XD9
DG
DG
R522
100
R51
1
100
ASICRST
004
ASICCLK
004
BKL
T
004
A
T
RSTN
D_TDI
R585
1k
R586
1k
3.3V
DG
3.3V
CN504
1
ESD-VSS
2
SCL(/CS)
3
SDA(/RES)
4
A0
5
/RES(SCL)
6
/CS(SI)
7
VDD1
8
VD1
9
VSS
10
VDDA
11
VM
12
VO
13
XVO
14
VG
15
ESD-VSS
RESET
3.3V
R505
NC
LCD_CS
LCD_RST
LCD_A0
RA506
150
RA506
150
2
R521
100
IC502
NC
1
*CE
2
SO
6
SCK
7
*RST/*HOLD
3
*WP
8
VDD
4
VSS
5
SI
C568
NC
C569
1000p
C567 NC
DG
ATCK
ATDO
ATDI
ATMS
C504
1u
25
V0
XV0
C528
0.1u
C529
NC
D501
C503
1u
C501
NC
C505
1u
C506
NC
C507
1u
C508
1u
C530
1u
R596
0
RA511
47
1
RA511
47
4
7
8
1
8
5
Q504
4.7k
47k
NC
Q503
4.7k
47k
R597 4.7k
3.3V
DG
DG
C502
22u
IC504
1
*HOLD/IO3
2
VCC
14
N/C8
15
DI/IO0
3
N/C1
16
CLK
4
N/C2
13
N/C7
5
N/C3
12
N/C6
6
N/C4
11
N/C5
7
*CS
10
GND
8
DO/IO1
9
*WP/IO2
R504
100
L516
0
1
2
3
4
5
6
7
8
L517
OPE I/F
C
B
A
D
3
12
4
6
57
3
SCLK
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