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ORDER NO. KMS0804483CE

(for Kazakhstan, Uzbekistan, Kyrgyzstan, Tajikistan

and Turkmenistan)

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PAGE

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1 Safety Precautions -----------------------------------------------3

1.1. Insulation Resistance Test -------------------------------3

2 Warning --------------------------------------------------------------4

2.1. Battery Caution ---------------------------------------------4
2.2. Caution--------------------------------------------------------4
2.3. About Lead Free Solder (PbF: Pb free) --------------4

3 Specifications ------------------------------------------------------5

3.1. General Description ---------------------------------------5
3.2. Characteristics ----------------------------------------------5

4 Technical Descriptions------------------------------------------6

4.1. System Block Diagram------------------------------------6
4.2. Power Block Diagram -------------------------------------7
4.3. Main Block Diagram  --------------------------------------7
4.4. CO Block Diagram -----------------------------------------8
4.5. Power Supply Unit Block Diagram---------------------8
4.6. Explanation of Block Diagram (Main Unit) -----------9
4.7. Circuit Operation (Power Supply Circuit)----------- 11
4.8. CO Interface Circuit-------------------------------------- 12
4.9. Cross Point Switch Circuit ----------------------------- 16

4.10. Intercom Circuit ------------------------------------------- 18

4.11. Power Failure Through Call Switching Circuit ---- 19

4.12. DATA Communication Circuit ------------------------- 20
4.13. Control Circuit --------------------------------------------- 21
4.14. TONE Generator Circuit -------------------------------- 21
4.15. DTMF Generator Circuit-------------------------------- 22
4.16. DTMF Receiver Circuit---------------------------------- 22
4.17. INT CALL ID Interface Circuit ------------------------- 22
4.18. MODEM Interface Circuit------------------------------- 23
4.19. USB Interface Circuit------------------------------------ 23
4.20. OGM Interface Circuit----------------------------------- 24
4.21. Ringing Signal Generator Circuit--------------------- 24
4.22. SMDR Interface Circuit --------------------------------- 25
4.23. DOORPHONE Card Interface (KX-

TE82460X)------------------------------------------------- 25

4.24. CALL ID Card Interface (KX-TE82493X)----------- 25

5 Location of Controls and Components------------------ 26

5.1. Name and Locations ------------------------------------ 26

6 Installation Instructions--------------------------------------- 26

6.1. Connection------------------------------------------------- 26
6.2. System Capacity ----------------------------------------- 27
6.3. System Overview----------------------------------------- 27

7 Troubleshooting Guide---------------------------------------- 29

7.1. No Operation (Check Power Supply Board,

Main Board and 2AP Board) -------------------------- 29

7.2. No Dial Tone----------------------------------------------- 30
7.3. Cannot Dial  ----------------------------------------------- 31
7.4. Cannot Call Extension ---------------------------------- 31
7.5. Cannot Use Proprietary Telephone------------------ 31
7.6. Cannot Receive Incoming Call ----------------------- 32
7.7. Cannot Send DTMF Dialing --------------------------- 32
7.8. Cannot Receive Call Dial Tone ----------------------- 33
7.9. Cannot Send a Hold On Music ----------------------- 33

8 Service Fixture & Tools --------------------------------------- 34
9 Disassembly and Assembly Instructions--------------- 35

10 Maintenance ------------------------------------------------------ 38

10.1. Terminal Guide of the ICs Transistors and

Diodes------------------------------------------------------- 38

10.2. How To Replace a Flat Package IC ----------------- 29

10.3. Memo ------------------------------------------------------- 40

11 Schematic Diagram -------------------------------------------- 41

11.1.  Block Diagram ------------------------------------------- 41
11.2. Main No.1 (Extention A-D Block) -------------------- 42
11.3. Main No.2 (Extention E-H Block) -------------------- 46
11.4. Main No.3 (Cross-Point Block) ----------------------- 50
11.5. MAIN No.4 (ASIC, Memory Block) ------------------ 54
11.6. Main No.5 (CO Block) ---------------------------------- 58
11.7. Power Supply --------------------------------------------- 62
11.8. Memo ------------------------------------------------------- 63

12 Printed Circuit Board------------------------------------------ 64

12.1. Main Board ------------------------------------------------ 64
12.2. CO Board -------------------------------------------------- 66
12.3. Power Supply --------------------------------------------- 68

13 Appendix Information of Schematic Diagram -------- 69
14 Exploded View and Replacement Parts List----------- 70

14.1. IC DATA ---------------------------------------------------- 70
14.2. Cabinet and Electric Parts----------------------------- 73
14.3. Accessories and Packing Materials----------------- 74
14.4. Replacement Parts List -------------------------------- 75

15 KX-TE82460X (2-Port Doorphone Card) ---------------- 86

15.1. DoorPhone/DoorOpener Card Block Diagram  -- 87
15.2. Explanation of Block Diagram/Circuit

Operations------------------------------------------------- 87

15.3. Location of Optional Cards---------------------------- 88
15.4. Troubleshooting Guide --------------------------------- 89
15.5. Terminal Guide of the ICs Transistors and

Diodes ------------------------------------------------------ 90

15.6. Memo ------------------------------------------------------- 91
15.7. Schematic Diagram ------------------------------------- 92
15.8. Printed Circuit Board------------------------------------ 94
15.9. For the Schematic Diagram--------------------------- 94

15.10. IC Data ----------------------------------------------------- 95

15.11. Accessories and Packing Material ------------------ 97

15.12. Replacement Parts List -------------------------------- 98

16 KX-TE82493X (3-Port Caller ID Card) -------------------100

16.1. Block Diagram  ------------------------------------------101
16.2. Circuit Operations --------------------------------------101
16.3. Location of Optional Cards---------------------------102
16.4. Troubleshooting Guide --------------------------------103
16.5. Terminal Guide of the ICs Transistors and

Diodes -----------------------------------------------------103

16.6. Schematic Diagram ------------------------------------104
16.7. Printed Circuit Board-----------------------------------106
16.8. For the Schematic Diagram--------------------------107
16.9. IC Data ----------------------------------------------------108

16.10. Accessories and Packing Material ----------------- 110

16.11. Replacement Parts List ------------------------------- 111

17 KX-A227X (Back-Up Battery Cable) --------------------- 113

17.1. Accessories and Packing Material ----------------- 114
17.2. Replacement Parts List ------------------------------- 115

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• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,

injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with ohmmeter between the jumpered AC plug and each exposed metal cabinet part, such as

screw threads, control shafts, handle brackets, etc.
Note:

Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired

and rechecked before it is returned to the customer.

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1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the

manufacturer. Dispose of used batteries according to the manufacturer's lnstructions. 

2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location

when replacing it and soldering the replacement lithium battery in.

The power socket wall outlet should be located near this equipment and be easily accessible.

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder. 

• PbF solder has a melting point that is 50

° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-

ture control and adjust it to 700

° ± 20° F, (370° ± 10°C). 

Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100

°F, (600°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.