Panasonic KX-TEB308RU / KX-TE82460X / KX-TE82493X / KX-A227X Service Manual ▷ View online
KX-TEB308RU
KX-TE82460X
KX-TE82493X
KX-A227X
KX-TE82493X
KX-A227X
(for Russia)
Advanced Hybrid System
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the use of PbF and how
it might be permissible to use Pb solder during service and repair work.
it might be permissible to use Pb solder during service and repair work.
ORDER NO. KMS0602202CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
SUGGESTED PbF SOLDER
4
1.2.
HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
5
2 FOR SERVICE TECHNICIANS
6
3 CAUTION
7
3.1.
SAFETY PRECAUTIONS
7
3.2.
INSULATION RESISTANCE TEST
7
3.3.
BATTERY CAUTION
7
3.4.
CAUTION
7
4 SPECIFICATIONS
8
4.1.
GENERAL DESCRIPTION
8
4.2.
CHARACTERISTICS
8
4.3.
SYSTEM CAPACITY
8
5 SYSTEM OVERVIEW
9
5.1.
SYSTEM COMPONENTS
9
5.2.
SYSTEM CONNECTION DIAGRAM
10
6 NAMES AND LOCATIONS
11
7 CONNECTION
11
7.1.
SERIAL INTERFACE CONNECTION
11
8 DISASSEMBLY INSTRUCTIONS
12
8.1.
DISASSEMBLY INSTRUCTION
12
9 BLOCK DIAGRAM
14
9.1.
SYSTEM BLOCK DIAGRAM
14
9.2.
POWER BLOCK DIAGRAM
15
9.3.
KX-TEB308RU MAIN BLOCK DIAGRAM
15
9.4.
KX-TEB308RU CO BLOCK DIAGRAM
16
9.5.
KX-TEB308RU POWER SUPPLY UNIT BLOCK
DIAGRAM
16
10 EXPLANATION OF BLOCK DIAGRAM
17
10.1. MAIN UNIT (KX-TEB308RU)
17
11 CIRCUIT OPERATION
19
11.1. POWER SUPPY CIRCUIT
19
11.2. CO INTERFACE CIRCUIT
20
11.3. CROSS POINT SWITCH CIRCUIT
25
11.4. INTERCOM CIRCUIT
27
11.5. POWER FAILURE THROUGH CALL SWITCHING
CIRCUIT
28
11.6. DATA COMMUNICATION CIRCUIT
28
11.7. CONTROL CIRCUIT
30
11.8. TONE GENERATOR CIRCUIT
30
11.9. DTMF GENERATOR CIRCUIT
31
11.10. DTMF RECEIVER CIRCUIT
31
11.11. INT CALLID INTERFACE CIRCUIT
32
11.12. MODEM INTERFACE CIRCUIT
32
11.13. USB INTERFACE CIRCUIT
33
11.14. OGM INTERFACE CIRCUIT
33
11.15. RINGING SIGNAL GENERATOR CIRCUIT
34
11.16. SMDR INTERFACE CIRCUIT
34
11.17. DOORPHONE CARD INTERFACE (KX-TE82460X)
35
11.18. CALL ID CARD INTERFACE (KX-TE82493X)
35
12 TROUBLESHOOTING GUIDE
36
12.1. NO OPERATION (Check POWER SUPPLY BOARD,
MAIN BOARD and 2AP BOARD)
36
12.2. NO DIAL TONE
37
12.3. CANNOT DIAL
38
12.4. CANNOT CALL EXTENSION
39
12.5. CANNOT USE PROPRIETARY TELEPHONE
39
12.6. CANNOT RECEIVE INCOMING CALL
39
12.7. CANNOT SEND DTMF DIALING
40
12.8. CANNOT RECEIVE CALL DIAL TONE
40
12.9. CANNOT SEND A HOLD ON MUSIC
41
13 IC DATA
42
13.1. IC700
42
13.2. IC7
44
13.3. IC8
44
14 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES
45
15 HOW TO REPLACE A FLAT PACKAGE IC
46
15.1. PREPARATION
46
15.2. REMOVAL PROCEDURE
46
15.3. INSTALLATION PROCEDURE
46
15.4. REMOVING SOLDER FROM BETWEEN PINS
46
16 FIXTURES AND TOOLS
47
17 CABINET AND ELECTRICAL PARTS LOCATION
48
18 ACCESSORIES AND PACKING MATERIALS
49
19 REPLACEMENT PARTS LIST (KX-TEB308RU)
50
19.1. CABINET AND ELECTRICAL PARTS
50
19.2. ACCESSORIES AND PACKING MATERIALS
50
19.3. MAIN BOARD PARTS
50
19.4. CO BOARD PARTS
57
19.5. POWER SUPPLY BOARD PARTS
59
19.6. FIXTURES AND TOOLS
60
19.7. MEMO
61
20 FOR THE SCHEMATIC DIAGRAM
62
21 SCHEMATIC DIAGRAM (KX-TEB308RU)
64
21.1. MAIN No.1 (Extention A-D Block)
64
21.2. MAIN No.2 (Extention E-H Block)
68
21.3. MAIN No.3 (Cross-Point Block)
72
21.4. MAIN No.4 (ASIC, Memory Block)
76
21.5. MAIN No.5 (CO Block)
80
21.6. POWER SUPPLY
84
21.7. MEMO
85
22 PRINTED CIRCUIT BOARD (KX-TEB308RU)
86
22.1. MAIN BOARD
86
22.2. CO BOARD
88
22.3. POWER SUPPLY
90
23 KX-TE82460X (2-PORT DOORPHONE CARD)
91
23.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
92
23.2. LOCATION OF OPTIONAL CARDS
93
23.3. DOORPHONE/DOOROPENER CARD BLOCK DIAGRAM
94
CONTENTS
Page
Page
2
KX-TEB308RU
23.4. EXPLANATION OF BLOCK DIAGRAM/CIRCUIT
OPERATIONS
94
23.5. TROUBLESHOOTING GUIDE
95
23.6. IC DATA
96
23.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
98
23.8. ACCESSORIES AND PACKING MATERIALS
98
23.9. REPLACEMENT PARTS LIST (KX-TE82460X)
99
23.10. FOR THE SCHEMATIC DIAGRAM
101
23.11. SCHEMATIC DIAGRAM (KX-TE82460X)
102
23.12. PRINTED CIRCUIT BOARD (KX-TE82460X)
104
24 KX-TE82493X (3-PORT CALLER ID CARD)
105
24.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
106
24.2. LOCATION OF OPTIONAL CARDS
107
24.3. BLOCK DIAGRAM
108
24.4. CIRCUIT OPERATIONS
108
24.5. TROUBLESHOOTING GUIDE
109
24.6. IC DATA
110
24.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
112
24.8. ACCESSORIES AND PACKING MATERIALS
112
24.9. REPLACEMENT PARTS LIST (KX-TE82493X)
113
24.10. FOR THE SCHEMATIC DIAGRAM
115
24.11. SCHEMATIC DIAGRAM (KX-TE82493X)
116
24.12. PRINTED CIRCUIT BOARD (KX-TE82493X)
118
25 KX-A227X (BACK-UP BATTERY CABLE)
119
25.1. ACCESSORIES AND PACKING MATERIALS
120
25.2. REPLACEMENT PARTS LIST (KX-A227X)
121
3
KX-TEB308RU
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
•
•
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
•
•
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TEB308RU
