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In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder. 

• PbF solder has a melting point that is 50

° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-

ture control and adjust it to 700

° ± 20° F, (370° ± 10°C). 

Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100

°F, (600°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

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*1 If tolerance may be exceeded, an Uninterruptible Power Supply (UPS) is recommended.

Control Bus

Original bus (16 bit, 8 MHz,10 megabytes per second)

Communication Bus

H.100 bus conformity (1024 time slot)

Switching

Distributed Switching

Power Input

PSU-M

100 V AC to 130 V AC; 2.5 A/200 V AC to 240 V AC; 1.4 A; 50 Hz/60 Hz

PSU-L

100 V AC to 130 V AC; 5.1 A/200 V AC to 240 V AC; 2.55 A; 50 Hz/60 Hz

Maximum Power Failure Tolerance*1

300 ms

Power Consumption (per shelf)

With PSU-M

190 W; 2.5 A (at 120 V AC; 60 Hz)

With PSU-L

410 W; 5.1 A (at 120 V AC; 60 Hz)

Memory Backup Duration

 7 years

Dialling  

CO Line

Dial Pulse (DP) 10 pps, 20 pps
Tone (DTMF) Dialling

Extension 

Dial Pulse (DP) 10 pps, 20 pps
Tone (DTMF) Dialling

Mode Conversion 

DP-DTMF, DTMF-DP

Ring Frequency 

20 Hz/25 Hz (selectable)

Central Office Loop Limit 

1600 

Ω maximum

Operating Environment

Temperature

 0 

°C to 40 °C (32 °F to 104 °F)

Humidity

10%to 90% (non condensing)

Conference Call CO Line (per shelf)

From 10 x 3-party conference call to 3 x 8-party conference call

Music on Hold (MOH)

2 ports (Level Control: -11 dB to +11 dB in 1 dB steps)
MOH1: External Music Source port
MOH2: Selectable Internal/External Music Source port

Paging

Internal

Level Control: -15 dB to +6 dB in 3 dB steps

External

2 ports (Volume Control: -15 dB to +15 dB in 1 dB steps)

Serial Interface Port

RS-232C 

1 (max 115.2 kbps)

RJ45 Port

MNT Port 

1 (for PC connection)

LAN Port

1 (for LAN connection)

Extension Connection Cable

SLT 

1 pair wire (T, R)

DPT 

1-pair wire (D1, D2) or
2-pair wire (T, R, D1, D2)

APT 

2-pair wire (T, R, D1, D2)

PT-interface CS 

1-pair wire (D1, D2)

PT-interface CS (High-density)

4-pair wire (D1, D2)

DSS Consoles and Add-on Key Module

1-pair wire (D1, D2)

Dimension

430 mm (W) x 415 mm (H) x 270 mm (D)
(17-1/5 in  x 16-3/5 in  x 10-4/5 in)

Weight (when fully mounted)

Under 16 kg (35.2 lb.)

Terminal Equipment Loop Limit

• PT: KX-DT300/KX-T7600 series DPT: 90 

Ω; all other DPTs/APTs:40 Ω

• SLT: 600 

Ω including set

• Doorphone: 20 

Ω

• CS: 130 

Ω; PT-interface CS: 65Ω

Minimum Leakage Resistance

15000 

Ω maximum

Maximum Number of Extension
Instruments per Line

1 for PT or SLT
2 by Parallel or eXtra Device Port connection of an APT/DPT and an SLT
3 by Digital eXtra Device Port connection of 2 DPTs and an SLT

Ring Voltage

75 Vrms at 20 Hz/25 Hz depending on the Ringing Load

Central Office Loop Limit

1600 

Ω maximum

Hookswitch Flash Timing Range

24 ms to 2032 ms

Door Opener Current Limit

24 V DC/30 V AC, 1 A maximum

External Relay Current Limit

24 V DC/30 V AC, 1 A maximum

External Sensor Current Limit

Power to the external sensor is provided from the EIO4 card and must be grounded through
the EIO4 card. For the connection diagram, refer to EIO4 Card (KX-TDA0164). The PBX
detects input from the sensor when the signal is under 100

Ω.

Paging Terminal Impedance

600 

Ω

MOH (Music on Hold) Terminal Impedance

10000 

Ω

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Local Highway 0ch

Back Board

Connector

(TDA100/200 I/F

TDE100/200 I/F)

RS232C

D/R

EC-bus

CT-bus

16bit

16bit

16bit

16bit

Local Highway 0ch

LAN

Controller

SDRAM

32M x 16

64MB

32bit

32bit

16bit

VoIP DSP

SRAM

1M x 16

1chip

CS4

FLASH

512K x 16

1chip

1MB

CS0

DDR SDRAM

512Mbit

(32M x 16)

2chip

128MB

SD_ACCESS_

_LED

BATT_ALARM

PHY

16bit

100Base TX

PCI bus

TDE0110

or

TDE0111

Serial

SPI / RTC bus

Serial

CPU

SH7780

SD

CARD

Connector

SD

Controller

CS6

SRAM

x 16

CS4

(6MB)

(TDE6105)

8bit

FPGA

(POWER_LED_

CONTROLLER

RTC_CONTROLLER 

SPI_ CONTROLLER

Highway Buffer

LED_DRIVER

NEXUS-SRAM_I/F)

CS1

RMT

Connector

TDA0196

ASIC

CS5

CODEC

2chip

1chip

Buffered Local Highway 1ch

RTC

8bit

SVM (DSP)

CS1

100Base TX

RJ45_CON

(TRANS)

ETHER_LED x 2

RJ45_CON

(TRANS)

100Base TX

PORT 2

PORT 1

EPG

1

EPG

2

MOH

1

MOH

2

RESET

BUTTOM

INITIAL

SW

_LED

100Base TX

ETHER_LED x 2

KX-TDE600UC IPCEMPR CARD 

BLOCK DIAGRAM No.1

5 port LAN SW

Melody

4

3

2

1

5

2MB

2MB

TDA600

Connector

CS2

16bit

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