DOWNLOAD Panasonic KX-TDE600UC Service Manual ↓ Size: 4.89 MB | Pages: 127 in PDF or view online for FREE

ORDER NO. KMS1006780CE

(for Ukraine)

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1 Safety Precautions -----------------------------------------------4

1.1. For Service Technicians  ---------------------------------4
1.2. Insulation Resistance Test -------------------------------4

2 Warning --------------------------------------------------------------4

2.1. Battery Caution ---------------------------------------------4
2.2. Caution--------------------------------------------------------4
2.3. Discarding of P. C. Board --------------------------------4
2.4. About Lead Free Solder (PbF: Pb free) --------------5

2.4.1. Suggested PbF Solder -------------------------------5

3 Specifications ------------------------------------------------------6

3.1. General Description ---------------------------------------6
3.2. Characteristics ----------------------------------------------6

4 Technical Descriptions------------------------------------------7

4.1. IPCEMPR Block Diagram --------------------------------7
4.2. IPCEMPR Card Circuit Operation ------------------- 11

4.2.1. IPCEMPR Card -------------------------------------- 11
4.2.2. Description of Each Part--------------------------- 12
4.2.3. Circuit Description----------------------------------- 13

4.3. Back Board Circuit Operation ------------------------- 16
4.4. Outline ------------------------------------------------------ 17

4.4.1. General Description--------------------------------- 17
4.4.2. IPCEMPR Card -------------------------------------- 17
4.4.3. Back Board-------------------------------------------- 17
4.4.4. Power Supply Unit ---------------------------------- 17
4.4.5. System Control--------------------------------------- 18
4.4.6. Back Board Signal Connection Diagram ------ 21

5 Location of Controls and Components------------------ 24

5.1. Name and Locations ------------------------------------ 24

6 Installation Instructions--------------------------------------- 25

6.1. System Construction ------------------------------------ 25

6.1.1. Basic System ----------------------------------------- 25

6.2. System Overview----------------------------------------- 29

6.2.1. System Configurations ----------------------------- 29
6.2.2. System Connection Diagram --------------------- 30
6.2.3. System Components ------------------------------- 32
6.2.4. System Capacity------------------------------------- 34

7 Test Mode---------------------------------------------------------- 38

7.1. Utility--------------------------------------------------------- 38

7.1.1. Utility-Diagnosis-------------------------------------- 38

8 Troubleshooting Guide---------------------------------------- 50

8.1. IPCEMPR Card------------------------------------------- 50

8.1.1. Startup-------------------------------------------------- 50
8.1.2. Phone Call -------------------------------------------- 58
8.1.3. Paging-------------------------------------------------- 59
8.1.4. Using MOH-------------------------------------------- 63
8.1.5. LAN ----------------------------------------------------- 66
8.1.6. SVM----------------------------------------------------- 67
8.1.7. RS-232C----------------------------------------------- 68
8.1.8. SD card IF--------------------------------------------- 69
8.1.9. Other---------------------------------------------------- 70

8.1.10. BUS-M Card ------------------------------------------ 71

8.2. MEC Card -------------------------------------------------- 72

9 Service Fixture & Tools --------------------------------------- 73

9.1. Extension Boards for Servicing----------------------- 73

10 Disassembly and Assembly Instructions--------------- 74

10.1. IPCEMPR Card------------------------------------------- 74
10.2. Back Board ------------------------------------------------ 75

11 Miscellaneous ---------------------------------------------------- 77

11.1. How To Replace a Flat Package IC----------------- 77

11.1.1. Preparation ------------------------------------------- 77
11.1.2. Removal Procedure -------------------------------- 77
11.1.3. Procedure--------------------------------------------- 77
11.1.4. Removing Solder From Between Pins--------- 77

11.2. How to Replace the LLP (Leadless Leadframe

Package) IC and IC ground plate-------------------- 78

11.2.1. Preparation ------------------------------------------- 78
11.2.2. Caution ------------------------------------------------ 78
11.2.3. How to Remove the IC ---------------------------- 78
11.2.4. How to Install the IC-------------------------------- 78
11.2.5. How to Remove a Solder Bridge---------------- 79

11.3. Terminal Guide of the ICs Transistors and

Diodes ------------------------------------------------------ 80

11.4. memo ------------------------------------------------------- 81

12 Schematic Diagram -------------------------------------------- 82

12.1. Block Diagram -------------------------------------------- 82
12.2. IPCEMPR Card No.1 ----------------------------------- 84
12.3. IPCEMPR Card No.2 ----------------------------------- 86
12.4. IPCEMPR Card No.3 ----------------------------------- 88
12.5. IPCEMPR Card No.4 ----------------------------------- 90
12.6. IPCEMPR Card No.5 ----------------------------------- 92
12.7. IPCEMPR Card No.6 ----------------------------------- 94
12.8. IPCEMPR Card No.7 ----------------------------------- 96
12.9. IPCEMPR Card No.8 ----------------------------------- 98

12.10. IPCEMPR Card No.9 ----------------------------------100

12.11. IPCEMPR Card No.10 --------------------------------102

12.12. IPCEMPR Card No.11---------------------------------104
12.13. IPCEMPR Card No.12 --------------------------------106
12.14. IPCEMPR Card No.13 --------------------------------108
12.15. IPCEMPR Card No.14 -------------------------------- 110
12.16. IPCEMPR Card No.15 -------------------------------- 112
12.17. IPCEMPR Card No.16 -------------------------------- 114
12.18. Memo ------------------------------------------------------ 115
12.19. BB-B1 (Back) Board No.1 ---------------------------- 116
12.20. BB-B1 (LED) Board No.2 ----------------------------- 118
12.21. BB-B2 Board---------------------------------------------120
12.22. Memo ------------------------------------------------------121
12.23. MEC Card ------------------------------------------------ 122
12.24. Waveform-------------------------------------------------124

13 Printed Circuit Board-----------------------------------------126

13.1. IPCEMPR Card -----------------------------------------126

13.1.1. Component View-----------------------------------126
13.1.2. Flow Solder Side View----------------------------127

13.2. BB-B1 (Back/LED) Board-----------------------------128

13.2.1. Component View-----------------------------------128

13.3. BB-B2 Board---------------------------------------------129

13.3.1. Component View-----------------------------------129

13.4. MEC Card ------------------------------------------------ 130

13.4.1. Component View-----------------------------------130
13.4.2. Flow Solder Side View----------------------------130

14 Appendix Information of Schematic Diagram -------131
15 Exploded View and Replacement Parts List----------132

15.1. IC Data ----------------------------------------------------132

15.1.1. IC101--------------------------------------------------132

15.2. Cabinet and Electric Parts----------------------------140
15.3. Accessories and Packing Materials----------------142
15.4. Replacement Parts List ------------------------------- 143

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15.4.1. Cabinet and Electrical Parts ------------------- 143
15.4.2. Accessories and Packing Materials ---------- 143
15.4.3. Main Board Parts --------------------------------- 144
15.4.4. BB-B1 Board Parts ------------------------------- 152
15.4.5. BB-B2 Board Parts ------------------------------- 152
15.4.6. MEC Board Parts --------------------------------- 153
15.4.7. Tools ------------------------------------------------- 153

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• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,

injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with ohmmeter between the jumpered AC plug and each exposed metal cabinet part, such as

screw threads, control shafts, handle brackets, etc.
Note:

Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired

and rechecked before it is returned to the customer.

1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the

manufacturer. Dispose of used batteries according to the manufacturer's lnstructions. 

2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location

when replacing it and soldering the replacement lithium battery in.

The power socket wall outlet should be located near this equipment and be easily accessible.

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.