Panasonic KX-TDA0177XJ / KX-TDA0177X (serv.man2) Service Manual ▷ View online
33
KX-TDA0177XJ / KX-TDA0177X
9 Miscellaneous
9.1.
Terminal Guide of the ICs Transistors and Diodes
34
KX-TDA0177XJ / KX-TDA0177X
9.2.
How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
9.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity
→ 0.82.
Type
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.3).
9.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
9.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
solder to the tip so that it flows under the pins as they are
heated.
9.2.4.
Removing Solder From Between
Pins
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
pads.
35
KX-TDA0177XJ / KX-TDA0177X
10 Schematic Diagram
10.1. Block Diagram
36
KX-TDA0177XJ / KX-TDA0177X
10.2. No.1
1/4
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(16)
KX-TDA0177XJ/KX-TDA0177X CSLC16 CARD SCHEMATIC DIAGRAM No.1 (1/4)
(a)
(b)
(c)
(d)
(e)
(f)
(g)
(i)
(k)
(n)
(h)
(j)
(m)
+3.3V
Q11
E
C
B
DG
+3.3V
1
2
3
4
5
TP94
TP93
RA5
10K
1
2
3
4
5
6
7
8
6
7
8
RA6
10K
1
2
3
4
5
6
7
8
6
7
8
100k
R87
+3.3V
TP10
+3.3V
TP31
TP89
+3.3V
TP45
TP84
10V/0.1
C45
TP86
100k
R85
100k
R24
TP66
TP85
DG
R29
NC
100k
R12
TP48
TP12
100k
R70
TP64
100k
R76
TP20
J1
0
100k
R41
TP18
100k
R68
TP37
50V/0.1
C6
TP62
50V/0.1
C36
50V/0.1
C30
100k
R94
100k
R26
DG
TP40
TP39
TP81
100k
R82
TP6
TP82
TP33
100k
R43
TP80
100k
R47
TP44
100k
R98
50V/0.1
C24
TP38
DG
100k
R78
+3.3V
IC4
DTMF RECIEVER
INP1
1
INM1
2
GS1
3
TEST1
4
INP2
5
INM2
6
GS2
7
VREF
8
INP3
9
INM3
10
GS3
11
TEST2
12
INP4
13
INM4
14
GS4
15
GTSEL1
16
GTSEL2
17
Vss
18
Vdd
19
OSC0
20
OSCI
21
CLKSEL
22
nREST
23
TOE1
24
TOE2
25
TOE3
26
TOE4
27
Q1
28
Q2
29
Q3
30
Q4
31
EST/STD1
32
EST/STD2
33
EST/STD3
34
EST/STD4
35
S/nESEL
36
TP4
50V/0.1
C32
TP79
50V/0.1
C4
TP14
DG
100k
R80
50V/0.1
C16
DTMF RECIEVER
INP1
1
INM1
2
GS1
3
TEST1
4
INP2
5
INM2
6
GS2
7
VREF
8
INP3
9
INM3
10
GS3
11
TEST2
12
INP4
13
TOE1
24
TOE2
25
TOE3
26
TOE4
27
Q1
28
Q2
29
Q3
30
Q4
31
EST/STD1
32
EST/STD2
33
EST/STD3
34
EST/STD4
35
S/nESEL
36
TP87
50V/0.1
C34
+3.3V
TP2
DG
TP56
50V/0.1
C12
TP35
C78
10V/1
100k
R20
TP77
TP50
TP42
50V/0.1
C2
EST[8-15]
TP36
100k
R45
TP32
50V/0.1
C10
C74
10V/1
100k
R89
TP24
100k
R100
TP26
100k
R33
+3.3V
50V/0.1
C22
100k
R31
50V/0.1
C14
TP74
TP72
TP28
J2
0
IC1
DTMF RECIEVER
INP1
1
INM1
2
GS1
3
TEST1
4
INP2
5
INM2
6
GS2
7
VREF
8
INP3
9
INM3
10
GS3
11
TEST2
12
INP4
13
INM4
14
GS4
15
GTSEL1
16
GTSEL2
17
Vss
18
Vdd
19
OSC0
20
OSCI
21
CLKSEL
22
nREST
23
TOE1
24
TOE2
25
TOE3
26
TOE4
27
Q1
28
Q2
29
Q3
30
Q4
31
EST/STD1
32
EST/STD2
33
EST/STD3
34
EST/STD4
35
S/nESEL
36
TP83
TP58
+3.3V
100k
R16
100k
R14
10V/0.1
C18
TP60
DTMF RECIEVER
INP1
1
INM1
2
GS1
3
TEST1
4
INP2
5
INM2
6
GS2
7
VREF
8
INP3
9
INM3
10
GS3
11
TEST2
12
INP4
13
TOE1
24
TOE2
25
TOE3
26
TOE4
27
Q1
28
Q2
29
Q3
30
Q4
31
EST/STD1
32
EST/STD2
33
EST/STD3
34
EST/STD4
35
S/nESEL
36
100k
R35
50V/0.1
C26
100k
R66
R48
NC
TP16
100k
R22
100k
R96
TP52
TP30
TP41
TP70
TP76
EST[15]
TOE[6]
EST[2]
D[0-7]
EST[11]
DTMFR[4]
D[1]
TOE[0]
DTMFR[1]
EST[0-7]
D[2]
D[2]
DTMFR[11]
D[3]
DTMFR[0]
EST[1]
EST[8]
DTMFR[14]
EST[4]
DTMFR[2]
DTMFR[8]
D[2]
DTMFR[5]
TOE[8]
D[3]
D[0]
D[0]
D[0-7]
DTMFR[13]
D[3]
EST[7]
TOE[3]
D[2]
TOE[13]
DTMFR[12]
TOE[9]
TOE[11]
EST[9]
D[3]
EST[8-15]
TOE[0-7]
D[1]
EST[6]
EST[12]
DTMFR[8-15]
TOE[15]
EST[14]
TOE[1]
DTMFR[3]
D[1]
EST[3]
D[1]
TOE[7]
DTMFR[9]
EST[0]
DTMFR[6]
TOE[10]
D[0]
TOE[12]
D[0-7]
DTMFR[0-7]
TOE[14]
EST[5]
D[0-7]
TOE[2]
D[0]
EST[10]
TOE[4]
DTMFR[10]
TOE[0-7]
EST[13]
TOE[5]
TOE[15]
TOE[14]
TOE[13]
TOE[12]
TOE[11]
TOE[10]
TOE[8]
TOE[9]
D
C
B
A
45
6
3
2
1
3
1
3
1
1
1
2
3
3
2
2
2
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