Panasonic KX-TDA0177XJ / KX-TDA0177X (serv.man2) Service Manual ▷ View online
ORDER NO. KMS0703310CE
16-Port Single Line Telephone Extension Card with Cer ID
KX-TDA0177XJ
KX-TDA0177X
KX-TDA0177X
(for Europe, Asia Oceania, Middle Near East, Latin
America, Russia and Africa)
America, Russia and Africa)
2
KX-TDA0177XJ / KX-TDA0177X
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precaution --------------------------------------------- ---3
1.1. For Service Technicians ----------------------------- ---3
2 Warning ---------------------------------------------------------- ---3
2.1. About Lead Free Solder (PbF: Pb free) ---------- ---3
3 Specifications -------------------------------------------------- ---4
4 General/Introduction ----------------------------------------- ---4
4 General/Introduction ----------------------------------------- ---4
4.1. General Description ----------------------------------- ---4
5 Technical Descriptions-------------------------------------- ---5
5.1. Block Diagram ------------------------------------------ ---5
5.2. Circuit Operation --------------------------------------- ---6
5.2. Circuit Operation --------------------------------------- ---6
6 Location of Controls and Components---------------- - 19
6.1. Names and Locations--------------------------------- - 19
7 Installation Instructions------------------------------------- - 20
7.1. CSLC16 Card ------------------------------------------- - 20
7.2. Fastening Amphenol Connector-------------------- - 21
7.3. Power Failure Connections-------------------------- - 22
7.2. Fastening Amphenol Connector-------------------- - 21
7.3. Power Failure Connections-------------------------- - 22
8 Troubleshooting Guide-------------------------------------- - 25
9 Miscellaneous -------------------------------------------------- - 33
9 Miscellaneous -------------------------------------------------- - 33
9.1. Terminal Guide of the ICs Transistors and Diodes33
9.2. How To Replace a Flat Package IC --------------- - 34
9.2. How To Replace a Flat Package IC --------------- - 34
10 Schematic Diagram------------------------------------------- - 35
10.1. Block Diagram ------------------------------------------ - 35
10.2. No.1-------------------------------------------------------- - 36
10.3. No.2-------------------------------------------------------- - 40
10.4. No.3-------------------------------------------------------- - 44
10.5. No.4-------------------------------------------------------- - 48
10.6. No.5-------------------------------------------------------- - 50
10.7. Waveform ------------------------------------------------ - 51
10.2. No.1-------------------------------------------------------- - 36
10.3. No.2-------------------------------------------------------- - 40
10.4. No.3-------------------------------------------------------- - 44
10.5. No.4-------------------------------------------------------- - 48
10.6. No.5-------------------------------------------------------- - 50
10.7. Waveform ------------------------------------------------ - 51
11 Printed Circuit Board ---------------------------------------- - 55
11.1. Component View --------------------------------------- - 55
11.2. Bottom View --------------------------------------------- - 56
11.2. Bottom View --------------------------------------------- - 56
12 Appendix Information of Schematic Diagram ------- - 57
13 Exploded View and Replacement Parts List --------- - 58
13 Exploded View and Replacement Parts List --------- - 58
13.1. IC Data---------------------------------------------------- - 58
13.2. Cabinet and Electrical Parts Location------------- - 66
13.3. Accessories and Packing Material----------------- - 67
13.4. Replacement Parts List ------------------------------- - 68
13.2. Cabinet and Electrical Parts Location------------- - 66
13.3. Accessories and Packing Material----------------- - 67
13.4. Replacement Parts List ------------------------------- - 68
3
KX-TDA0177XJ / KX-TDA0177X
1 Safety Precautions
1.1.
For Service Technicians
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
2 Warning
2.1.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50
° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700
° ± 20° F, (370° ± 10°C).
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F, (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
2.1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TDA0177XJ / KX-TDA0177X
3 Specifications
4 General/Introduction
4.1.
General Description
This card is plugged into a free slot on the TDA100/200 systems and randomly connects up to 16 SLT devices.
This card sends Caller ID signal to extension ports.
The LPR is SH-1(SH7020), and the memory is composed of a 512K byte Flash Rom and a 128K byte SRAM.
It also supports a software upgrade by downloading the latest version.
This card sends Caller ID signal to extension ports.
The LPR is SH-1(SH7020), and the memory is composed of a 512K byte Flash Rom and a 128K byte SRAM.
It also supports a software upgrade by downloading the latest version.
Functional Block
Functional contents
Extension Interface
Number of Ports
16 ports
SLT Interface
+30V 30mA Feeding function
Dial-pulse signal detecting function
DTMF signal detecting function
Bell signal issuing function
Hook detecting function
Ringtrip detecting function
2W/4W converting function
Surge protective function
4ch CODEC function
Dial-pulse signal detecting function
DTMF signal detecting function
Bell signal issuing function
Hook detecting function
Ringtrip detecting function
2W/4W converting function
Surge protective function
4ch CODEC function
• Test function (Loop back, Tone generation)
• Programmable digital filtering function
• Serial interface function
• PIO function
• Programmable digital filtering function
• Serial interface function
• PIO function
DTMF Receiver
16 lines for each port
On-board Ringer
20/25Hz 75Vrms
Phase control (Three-phase / Four-phase)
Phase control (Three-phase / Four-phase)
On-board DC/DC Power Supply
Input +15V
Output +5V, +3.3V
Input +40V
Output for Bell ringing relay: +160V, -100V
Output +5V, +3.3V
Input +40V
Output for Bell ringing relay: +160V, -100V
Power Failure Forwarding Function
4 lines supported
Self-Diagnostic Function
Carried out with outside-line interface in a pair (only one port)
Speech path test, Dial pulse test, DTMF test
Speech path test, Dial pulse test, DTMF test
ASIC
EC bus interface function
H.100 bus interface function, Digital PLL function
Local bus interface function
Time switch function, Gain controlling function, FIFO/DPRAM function
Intelligent PIO function
H.100 bus interface function, Digital PLL function
Local bus interface function
Time switch function, Gain controlling function, FIFO/DPRAM function
Intelligent PIO function
Control Unit
CPU
SH-1/SH7020 (12.288MHz)
Flash ROM
512Kbyte
SRAM
128Kbyte
LED Display Circuit
Card status indicating LED: Two colors (Red/Green)
External Interface Connector
Extension interface
50pin Amphenol connector: 1
Power failure forwarding 4pin modular jack: 2
Caller ID Generator
Mounted Number
4
Supported Standard
ITU-T V.23 (1200bps) FSK
Bell202 (1200bps) FSK
Bell202 (1200bps) FSK
