Panasonic KX-NT400RU Service Manual ▷ View online
45
KX-NT400RU
46
KX-NT400RU
9.2.
How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
9.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity
→ 0.82.
Type
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.3).
9.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
9.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
solder to the tip so that it flows under the pins as they are
heated.
9.2.4.
Removing Solder From Between
Pins
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
pads.
47
KX-NT400RU
9.3.
Memo
48
KX-NT400RU
10 Schematic Diagram
10.1. Main Board
10.1.1. L2SW , PoE , Power DC
(a)
(b)
(c)
(d)
(e)
(f)
(g)
(h)
(i)
KX-NT400R
U :
MAIN BO
ARD No
.1 (1/4)
1/4
2/4
3/4
4/4
M2_TXD[0]
M2_TXD[1]
M2_RXD[0]
M2_RXD[1]
M2_RXD[2]
M2_RXD[3]
M2_TXD[2]
M2_TXD[3]
PHY1.2V
PHY_D33
RA4
10k
PHY_D33
DG
R98
4.7k
R96
4.7k
DG
PHY_nRST_2
002:9G
DG
PHY_D33
R2
NC
RA6
10k
M2_TXD[3-0]
002:9H
DG
DG
C5
Z10
[2125]
PHY1.2V
PHY1.2V
DG
PHY_D33
DG
R5
180
R6
180
PHY_D33
M2_MDC
002:9G
SCL
006:3E
DG
PHY1.2V
M2_CRS
002:9G
R3
180
DG
DG
PHY_D33
DG
PHY_D33
DG
DG
DG
R7
180
DG
M2_RXD[3-0]
002:9G
R69
3.01k(1%)
R4
180
RA5
10k
M2_TXCLK
002:9H
DG
M2_RXCLK
002:9H
DG
DG
M2_COL
002:9G
R97
4.7k
DG
PHY_D33
DG
M2_TXEN
002:9H
RA2
10k
M2_MDIO
002:9G
X1
25MHz
M2_RXDV
002:9G
PHY_D33
PHY1.2V
PHY1.2V
DG
RA3
10k
RA1
180
R113
100
PHY1.2V
C6
Z10
DG
SDA
006:3E
SPIS_N
006:3E
SPIQ
006:4F
C2
39p
C1
18p
R1
0
IC5
1
P1LED2
2
P1LED1
3
P1LED0
4
P2LED2
5
P2LED1
6
P2LED0
7
DGND7
8
VDDIO8
9
NC9
10
NC10
11
NC11
12
ADVFC
13
P2ANEN
14
P2SPD
15
P2DPX
16
P3FFC
17
NC17
18
NC18
19
NC19
20
P2LED3
21
DGND21
22
VDDC22
23
LEDSEL1
24
NC24
25
P1LED3
26
RMII_EN
27
HWPOVR
28
P2MDIXDIS
29
P2MDIX
30
P1ANEN
31
P1SPD
32
P1DPX
33
P1FFC
34
NC34
35
NC35
36
PWRDN
37
AGND37
38
VDDA38
39
AGND39
40
MUX1
41
MUX2
42
AGND42
43
VDDA43
44
FXSD1
45
RXP1
46
RXM1
47
AGND47
48
TXP1
49
TXM1
50
VDDATX
51
VDDARX
52
RXM2
53
RXP2
54
AGND54
55
TXM2
56
TXP2
57
VDDA57
58
AGND58
59
TEST1
60
TEST2
61
ISET
62
AGND62
63
VDDAP
64
AGND64
65 X1
66 X2
67 RST_N
68 UNUSED68
69 UNUSED69
70 LEDSEL0
71 SMTXEN
72 SMTXD3
73 SMTXD2
74 SMTXD1
75 SMTXD0
76 SMTXER
77 SMTXC/REFCLK
78 DGND78
79 VDDIO79
80 SMRXC
81 SMRXDV
82 SMRXD3
83 SMRXD2
84 SMRXD1
85 SMRXD0
86 SCOL
87 SCRS
88 SCONF1
89 SCONF0
90 DGND90
91 VDDC91
92 UNUSED92
93 UNUSED93
94 MDC
95 MDIO
96 SPIQ
97 SCL
98 SDA
99 SPIS_N
100 PS1
101 PS0
102
66 X2
67 RST_N
68 UNUSED68
69 UNUSED69
70 LEDSEL0
71 SMTXEN
72 SMTXD3
73 SMTXD2
74 SMTXD1
75 SMTXD0
76 SMTXER
77 SMTXC/REFCLK
78 DGND78
79 VDDIO79
80 SMRXC
81 SMRXDV
82 SMRXD3
83 SMRXD2
84 SMRXD1
85 SMRXD0
86 SCOL
87 SCRS
88 SCONF1
89 SCONF0
90 DGND90
91 VDDC91
92 UNUSED92
93 UNUSED93
94 MDC
95 MDIO
96 SPIQ
97 SCL
98 SDA
99 SPIS_N
100 PS1
101 PS0
102
UNUSED102
103
UNUSED103
104
UNUSED104
105
UNUSED105
106
DGND106
107
VDDIO107
108
UNUSED108
109
UNUSED109
110
UNUSED110
111
UNUSED111
112
UNUSED112
113
UNUSED113
114
UNUSED114
115
UNUSED115
116
UNUSED116
117
UNUSED117
118
UNUSED118
119
UNUSED119
120
UNUSED120
121
UNUSED121
122
DGND122
123
VDDC123
124
UNUSED124
125
UNUSED125
126
UNUSED126
127
TESTEN
128
SCANEN
C4
K0.01
R93
10k
R94
10k
R92
10k
R89
10k
R90
NC
R91
NC
R100
10k
R99
NC
R83
10k
R82
10k
R78
NC
R87
10k
R84
10k
R86
10k
R85
10k
RA7
NC
RA8
NC
RA9
NC
R70
NC
R71
NC
SW_25MHz
C84
K0.01
C83
K0.01
C87
100p
C81
100p
C70 100p
C7
100p
C82 100p
C69
100p
C80
100p
C89
K0.01
C91
K0.01
C86
K0.01
C85
K0.01
C88
K0.01
C90
K0.01
C3
K0.01
C92
K0.01
PHY_D33
C95 100p
R121
10K
R122
10K
R123
0
NC
NC
NC
R89
R90
R91
R92
I2C master mode
I2C slave mode
SPI slave mode
SMI mode
NC
NC
NC
NC
NC
D
E
C
B
A
45
6
3
2
1
(15)
(16)
(19), (20)
(17), (18)
(11), (12)
(13), (14)
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