Panasonic KX-NT321RU (serv.man2) Service Manual ▷ View online
29
KX-NT321RU
9.2.
How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
9.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity
→ 0.82.
Type
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.3).
9.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
9.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
solder to the tip so that it flows under the pins as they are
heated.
9.2.4.
Removing Solder From Between
Pins
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
pads.
30
KX-NT321RU
9.3.
Memo
31
KX-NT321RU
10 Schematic Diagram
10.1. Block Diagram
32
KX-NT321RU
10.2. Main No.1
KX-NT321
RU MAIN No.1 (1/2)
(1)
(2)
(3)
(4)
(4)
(5)
(6)
(6)
(7)
(8)
(8)
(9)
(10)
(11)
(12)
(13)
(13)
(14)
D
F
E
C
B
A
H
G
4
5
6
3
2
M1_MDIO
M1_MDC
M1_RXD[3]
M1_RXD[2]
M1_RXD[1]
M1_RXD[0]
M1_RXDV
M1_RXCLK
M1_RXCLK
M1_RXER
M1_TXCLK
PHY_nIRQ1
M1_TXEN
M1_COL
M1_CRS
PHY_nRST_1
M1_CRS
PHY_nRST_1
M1_TXD[3]
M1_TXD[2]
M1_TXD[1]
M1_TXD[0]
M2_MDIO
M2_MDC
M2_RXD[3]
M2_RXD[1]
M2_RXD[0]
M2_RXD[2]
M2_RXDV
M2_RXCLK
M2_RXER
M2_TXCLK
M2_TXEN
M2_TXD[3]
M2_TXD[2]
M2_TXD[1]
M2_TXD[0]
M2_COL
M2_CRS
PHY_nRST_2
M2_CRS
PHY_nRST_2
PHY_nIRQ2
M1_TX+
M1_TX-
M1_TX-
M1_RX+
M1_RX-
M2_TX-
M2_RX+
M2_RX-
M2_RX-
M2_TX+
DG
M2_COL
M2_TXD[3-0]
M2_TXEN
M2_MDIO
M2_RXCLK
M2_CRS
M2_RXDV
M2_TXCLK
M2_RXER
M2_RXD[3-0]
M2_MDC
C51
100/6.3V
PHY3.3V
D3.3V
DG
M1_MDC
M1_RXER
M1_RXDV
M1_RXCLK
M1_TXEN
M1_COL
M1_RXD[3-0]
M1_TXCLK
M1_CRS
M1_MDIO
M1_TXD[3-0]
PHY_nRST_2
DG
PHY_nRST_1
DC_ALARM
DG
C59
22p
C60
22p
X2
25MHz
D3.3V
DG
C53
100/6.3V
C66
K0.01
C77
Z0.1
Z0.1
C84
Z0.1
C58
K0.01
IC15
17
IC15
6
IC15
3
IC15
8
4
DG
C65
K0.01
C69
Z10
C73
K0.01
C67
Z10
DG
C78
Z22
DG
C63
K0.01
PHY3.3V
DG
DG
DG
C70
Z10
C72
K0.01
C76
K0.01
C68
Z10
C80
Z22
PHY3.3V
D5.0V
C61
K0.01
nDETPDN
PHY3.3V
PHY3.3V
C52
Z10
IC7
1
GND
2
VDDPLL_18
3
VDDA_3.3
4
RX-
5
RX+
6
TX-
7
TX+
8
XO
9
XI
10
REXT
11
MDIO
12
MDC
13
RXD3
14
RXD2
15
RXD1
16
RXD0
17
VDDIO_3.3
18 RXDV
19 RXC
20 RXER
21 INT#
22 TXC
23 TXEN
24 TXD0
19 RXC
20 RXER
21 INT#
22 TXC
23 TXEN
24 TXD0
25
TXD1
26
TXD2
27
TXD3
28
COL
29
CRS
30
LED0
31
LED1
32
RST#
IC6
1
GND
2
VDDPLL_18
3
VDDA_3.3
4
RX-
5
RX+
6
TX-
7
TX+
8
XO
9
XI
10
REXT
11
MDIO
12
MDC
13
RXD3
14
RXD2
15
RXD1
16
RXD0
17 VDDIO_3.3
18 RXDV
19 RXC
20 RXER
21 INT#
22 TXC
23 TXEN
24 TXD0
20 RXER
21 INT#
22 TXC
23 TXEN
24 TXD0
25
TXD1
26
TXD2
27
TXD3
28
COL
29
CRS
30
LED0
31
LED1
32
RST#
PHY3.3VA
PHY3.3VA
PHY3.3VA
RA24
180
RA25
180
C57
33p
C56
22p
A3.3V
AG
C50
220/6.3V
AG
C113
Z0.1
C114
Z0.1
A3.3V
DG
PHY_nIRQ1
PHY_nIRQ2
D5.0V
RA28
180
RA29
180
D6
NC
25MHz
C85
K0.01
K0.01
PHY3.3V
C86
K0.01
C83
K0.01
DG
D3.3V
J11
0
L19
L3
FIL1
NC
1
2
3
D3.3V
DG
D5.0V
DG
IC31
1
VIN
2
VSS
3
CE
4
NC
5
VOUT
IC10
1
CE
2
GND
3
NC
4
VDD
5
VOUT
C115
K0.01
C116
K0.01
K0.01
C117
K0.01
K0.01
C118
K0.01
K0.01
C119
K0.01
K0.01
C120
K0.01
C123
1000p
C124
1000p
C125
1000p
C43
K0.01
C44
K0.01
C47
K0.01
C48
K0.01
C79
K0.01
C74
K0.01
C121
1000p
1000p
L29
C126
K0.1
L18
330uH
C127
1000p
C128
K0.01
C129
Z0.1
R69 6.49k(1%)
R72
100k
R51
1M
R65
180
R50
470
470
R61
1k
R62
1k
R66
180
R67
180
R52
22
R70
6.49k(1%)
R68
180
5
2
(5)
(6)
(7)
(8),(9)
(11),(12)
(14),(15)
(17),(18)
(10)
(13)
(16)
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