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Model
KX-NT303X
Pages
20
Size
1.12 MB
Type
PDF
Document
Service Manual
Brand
Device
PBX / ADD ON KEY MODULE
File
kx-nt303x.pdf
Date

Panasonic KX-NT303X Service Manual ▷ View online

9
KX-NT303X / KX-NT303X-B
8 Miscellaneous
8.1.
Terminal Guide of ICs, Transistors and Diodes
10
KX-NT303X / KX-NT303X-B
8.2.
How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
8.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity 
→ 0.82.
Type 
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.3).
8.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
8.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
8.2.4.
Removing Solder From Between
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
11
KX-NT303X / KX-NT303X-B
Memo
12
KX-NT303X / KX-NT303X-B
9 Schematic Diagram
9.1.
Main Board
Q4
1
6
2
5
3
4
Q5
1
6
2
5
3
4
DG
DG
D3.3V
D3.3V
D3.3V
DG
R6
270
R4
270
R2
270
Q3
1
2
3
4
5
Q1
1
2
3
4
5
Q2
1
2
3
4
5
LED9
CO9
1
2
3
4
LED10
CO10
1
2
3
4
LED11
CO11
1
2
3
4
LED12
CO12
1
2
3
4
LED5
CO5
1
2
3
4
LED6
CO6
1
2
3
4
LED7
CO7
1
2
3
4
LED8
CO8
1
2
3
4
LED3
CO3
1
2
3
4
LED4
CO4
1
2
3
4
LED2
CO2
1
2
3
4
LED1
CO1
1
2
3
4
RA1
1k
1
2
3
4
6
7
8
SW5
CO5
SW9
CO9
SW10
CO10
SW11
CO11
SW12
CO12
SW2
CO2
SW3
CO3
SW1
CO1
SW4
CO4
SW7
CO7
SW8
CO8
SW6
CO6
R5
68
R3
68
R1
68
LED-K6
LED-K5
LED-K4
LED-K3
LED-K2
LED-K1
LED-C1
KEY-IN1
KEY-IN3
KEY-IN2
LED-C2
LED-C3
LED-C4
R
G
G
R
G
R
G
R
R
G
G
R
G
R
G
R
G
R
G
R
G
R
G
R
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(16)
5
KX-NT303X / KX-NT303X-B  : MAIN BOARD (1/2)
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