DOWNLOAD Panasonic KX-NS0180X Service Manual ↓ Size: 2.49 MB | Pages: 62 in PDF or view online for FREE

Model
KX-NS0180X
Pages
62
Size
2.49 MB
Type
PDF
Document
Service Manual
Brand
Device
PBX / LCOT/SLC CARD
File
kx-ns0180x.pdf
Date

Panasonic KX-NS0180X Service Manual ▷ View online

33
KX-NS0180X
34
KX-NS0180X
8 Miscellaneous
8.1.
How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
8.1.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity 
→ 0.82.
Type 
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4).
8.1.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
8.1.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
8.1.4.
Removing Solder From Between
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
35
KX-NS0180X
8.2.
Terminal Guide of the ICs Transistors and Diodes
4
5
1
3
C0CBCAC00061
C0JBAA000362
C0ABBB000184
C0ABBB000179
C0DBAJD00003
C1CB00001432
C1CB00002850
C1BB00001153
C0JBAZ001876 
C1CB00002851
C0DBZZB00005
C0DBAYY00600
C0JBAZ002713
C0EBY0000679
C0EBY0000665
2SC4731S *
1
B1ABDF000026
2SC4081R
B1CFRM000009
B1CHRD000011
DMG504010R
B0ADDM000002
PQVDRLZ2R0B
B0EDKT000007
DA2J10100L, B0HCMR000002
DB2J31300L, DZ2J062M0L
DZ2J051M0L, DZ2J075M0L
B0BC020A0213
 B0BC024A0213
DA3J103E0L
DA3J101F0L
B0JCNE000008
1
4
8
5
B
E
C
49
64
1
16
17
32
33
48
1
10
11
20
1
3
4
6
1
18
36
19
6
4
3
1
5
2
Cathode
Anode
100
1
25
26
50
51
75
76
1
7
14
8
C
B
E
B
E
C
1
2
3
Cathode
Anode
+
1
3
2
4
1
4
3
6
5
2
1
3
*
1
Although the parts of this form are attached, 
    there is no problem. 
36
KX-NS0180X
9 Schematic Diagram
9.1.
Main Board
9.1.1.
No.1
(1)
(2)
(3)
(4)
(5)
(6)
(a)
(b)
(c)
(d)
(e)
(f)
(g) (h)
(i)
(j)
(k)
(7)
KX-NS0180X LCOT2/SLC2 BOARD No.1 1/4
1/4
+
-
+
-
D
C
B
A
46
35
2
1
CIDA_T
CIDA_R
DL[0]
PC1A
1
2
4
3
PC2A
1
2
3
4
J1A
0
NC
R1A
68k
C2A
0.47u
16
R4A
1.2k
R6A
68k
D1A
D2A
R2A
22
C3A
1u
250
J4A
NC
J7A
0
R11A
680
C4A
0.47u
16
D4A
2V
NC
PC4A
NC
1
23
4
R19A
8.2k
PC5A
1
2
3
4
R18A
100
R20A
680
+5V
+5V
+5V
+5V
R17A 10k
R3A
NC
+5V
R21A
100k
R24A
91k
C10A
22p
50
R34A
100k
R35A
91k
C16A
22p
50
R30A
510
R22A
510
R27A
56k
C9A
22p
50
C11A
0.1u
50
+5V
+5V
VH1
C212
1000p
250
C213
1000p
250
VH1
R5A
22k
PF_TA
PF_RA
TH1A
D3A
1
2
3
4
VA1A
NC
2
1
ZNR1A
NC
ZNR2A
82V
R40A
0
NC
Q4A
SFG
DG
DG
DG
DG
DG
DG
DG
RL3A
12
3
4
J3A
NC
RL2A
NC
1
23
4
R14A
0
R15A
39
CN2
1A
2A
3A
4A
5A
6A
7A
8A
L3
SA1A
NC
1
3
2
C1A
220p
1000
L1A
23
14
T1A
2
14
3
SA2A
1
3
2
DA1A
1
3
2
C8A
10u
16
R16A
3.9k
C6A 10u
50
IC1A
3
2
1
IC1A
5
6
7
C7A
1u
50
C12A
6800p50
R32A
560
R23A
180k
A
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