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At WebMC(Command-UM Command),input "FMER 200000,16", then "RUN".

Display "OK"?

Go "FAX Send/Recieve"

Repaire

Repaire

Check short/open IC102,IC103

Yes

No

Yes

No

Repaired or replaced IC103?

Repaire or replace IC103.

Check pull-up/pull-down/open 
R140 - R146, R120 - R123, 
R136 - R138

Yes

No

Repaired or replaced IC102?

Yes

No

Repaired or replaced IC102?

Repaire or replace IC101

Yes

No

Check short/open R101 - R108, 
R124 - 135 between IC101 and 
IC102, IC103

Yes

No

Repaire

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Send or recieve FAX error

Hardware is no problem.
Check the setting of software.

Repaire or replace 
L205, R334, CN301

Present positive 
8kHz FAX_HWSYNC_FPGA 1bit

No

Yes

No

Repaire or replace 
L202, R327, CN301

At FAX sending, 
present UHW_2M_FPGA signal.

No

Yes

Repaire or replace 
L204, R328, CN301

Present HWCLK2M_FPGA 8bit
7bit CLK of 2MHz, and 1bit
(8KHz - 7*2MHz) CLK

No

Yes

Repaire or replace 
L203, R333, CN301

At FAX recieveing 
Apresent DHW_2M_FPGA signal.

No

Yes

Repaire or replace IC101

Yes

Repaire or replace 
X301, C333, C334, R304

Power off.  Provide"H" level to 
"TEST".power on.
check "MODEM" 24.578MHz

No

Yes

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Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700

°F ± 20°F (370°C ± 10°C)

Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.

• Flux

Recommended Flux: Specific Gravity 

→ 0.82.

Type 

→ RMA (lower residue, non-cleaning type)

Note: See About Lead Free Solder (PbF: Pb free) (P.4).

1. Put plenty of solder on the IC pins so that the pins can be

completely covered.
Note:

If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.

2. Make a few cuts into the joint (between the IC and its

pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC

pins.

When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be

attached properly.

1. Tack the flat pack IC to the PCB by temporarily soldering

two diagonally opposite pins in the correct positions on
the PCB.

Be certain each pin is located over the correct pad on the PCB.

2. Apply flux to all of the pins on the IC.

3. Being careful to not unsolder the tack points, slide the sol-

dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.

1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part

of the pin to draw the solder from between the adjacent
pads.

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