DOWNLOAD Panasonic KX-HDV130RU / KX-HDV130RUB Service Manual ↓ Size: 5.28 MB | Pages: 62 in PDF or view online for FREE

Model
KX-HDV130RU KX-HDV130RUB
Pages
62
Size
5.28 MB
Type
PDF
Document
Service Manual
Brand
Device
PBX / SIP PHONE
File
kx-hdv130ru-kx-hdv130rub.pdf
Date

Panasonic KX-HDV130RU / KX-HDV130RUB Service Manual ▷ View online

37
KX-HDV130RU/KX-HDV130RUB
10.3. Assembly for Lead wire
Perform this process in reverse when taking the unit apart.
10.3.1.
Connecting Lead Wires
Blue
Blue
Blue
Purple
Purple
Purple
Purple
Gray
Gray
Gray
Gray
Orange
Orange
Orange
Solder
Solder
Solder
Solder
Solder
Solder
Solder
Solder
Solder
Yellow
Black
Black
Red
Red
Brown
Yellow
Brown
Fully insert the FFC into the 
connector until the edge of 
the reinforcing plate is 
aligned with the edge of the 
Main Board.
Cable is to be inserted into connector 
(CN504) and (CN101) without any inclining,
as shown.
<NG>
<OK>
Note:
38
KX-HDV130RU/KX-HDV130RUB
10.3.2.
Clamping Lead Wires
Clamp
Clamp
Clamp
Clamp
Clamp
Clamp
Clamp
Clamp
Tape
1
2
3
4
Clamp LEAD WIRE to each slot as follows.
  - No 1 : Wire from Headset Jack (Black & Brown)
  - No 2 : Wire from Headset Jack  (Red & Yellow)
No clamp LEAD WIRE to each slot as follows and lays at bottom PCB.
  - No 3 : Wire from Handset Jack (Black & Brown)
  - No 4 : Wire from Handset Jack (Red & Yellow)
Headset Jack
Handset Jack
Put two Lead Wires in each 
Rubber Slit.
39
KX-HDV130RU/KX-HDV130RUB
11 Maintenance
11.1. Terminal Guide of the ICs Transistors and Diodes
C3ABRY000078
C1CB00004314
C0DBAYY01648
@AS1113
C0EBH0000445
B1HBCFA00028
B1GBCFGN0022,B1ADBL000017
B1CFRM000042
B3AEB0000146
B3AAB0000316
DB2X41400L
B0JCML000007
D4ED18R00008
B3AFB0000370
B1ADNF000018
1
27
54
28
1
16
17
32
33
48
49
64
1
4
8
5
1
5
6
10
20
16
11
15
1
2
4
3
1
3
6
4
Cathode
Anode
Cathode
Anode
Cathode
Anode
Cathode
Anode
Anode
Cathode
Cathode
Anode
Cathode
Anode
Cathode
Anode
40
KX-HDV130RU/KX-HDV130RUB
11.2. How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
11.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
F ± 20F (370C ± 10C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity 
 0.82.
Type 
 RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.3).
11.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
11.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
11.2.4.
Removing Solder From Between
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
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