Panasonic KX-FT982CA / KX-FT984CA / KX-FT988CA Service Manual ▷ View online
13
KX-FT982CA-B / KX-FT984CA-B / KX-FT988CA-B
6.2.
General Block
The following is an outline of each device IC on the digital board. (Refer to General Block Diagram (P.14).).
1. ASIC (IC1)
Composed mainly of an address decoder and a modem control.
Controls the general FAX operations.
Controls the operation panel I/F.
Controls the thermal head I/F and CIS I/F.
Performs the image processing.
CPU and Real time clock
Provides the reset pulse for each of the major ICs.
Controls the general FAX operations.
Controls the operation panel I/F.
Controls the thermal head I/F and CIS I/F.
Performs the image processing.
CPU and Real time clock
Provides the reset pulse for each of the major ICs.
2. Flash ROM (IC2)
Contains all of the program instructions on the unit operations.
This memory is used mainly for the parameter working in the storage area.
This memory is used mainly for the parameter working in the storage area.
3. Dynamic RAM (IC4)
This memory is used mainly for the parameter working in the storage area.
4. MODEM (IC5)
Performs the modulation and the demodulation for FAX communication.
5. Read Section
CIS image sensor to read transmitted documents.
6. Motor Driver (IC7)
Drives the transmission motor and the reception motor.
7. Thermal Head
Contains heat-emitting elements for dot matrix image printing.
8. Sensor Section
Composed of a cover open, a document set switch, a document top switch, a paper sensor switch, a jam sensor switch, and
a hook sensor switch.
a hook sensor switch.
9. Power Supply Board Switching Section
Supplies +6V and +24V to the unit.
10. Flash MEMORY (IC6) (KX-FT988 only)
Voice Prompt (TAM) D/L (DownLoad) area.
14
KX-FT982CA-B / KX-FT984CA-B / KX-FT988CA-B
6.2.1.
General Block Diagram
15
KX-FT982CA-B / KX-FT984CA-B / KX-FT988CA-B
6.3.
Control Section
6.3.1.
ASIC (IC1)
This custom IC is used for the general FAX operations.
1. CPU:
This model uses a Z80 equivalent to the CPU operating
at 24 MHz. Most of the peripheral functions are performed
by custom-designed LSIs. Therefore, the CPU only works
for processing the results.
at 24 MHz. Most of the peripheral functions are performed
by custom-designed LSIs. Therefore, the CPU only works
for processing the results.
2. RTC:
Real Time Clock
3. DECODER:
Decodes the address.
4. ROM/RAM I/F:
Controls the SELECT signal of ROM or RAM and the
bank switching.
bank switching.
5. CIS I/F:
Controls the document reading.
6. IMAGE DATA RAM:
This memory is programmed into the ASIC and uses 8
KB for the image processing.
KB for the image processing.
7. THERMAL HEAD I/F:
Transmits the recorded data to the thermal head.
8. MOTOR I/F:
Controls the transmission motor which feeds the docu-
ment.
Controls the receiving motor which feeds the recording
paper.
ment.
Controls the receiving motor which feeds the recording
paper.
9. OPERATION PANEL I/F:
Serial interface with Operation Panel.
10. I/O PORT:
I/O Port Interface.
11. ANALOG UNIT:
Electronic volume for the monitor.
Sends beep tones, etc.
Sends beep tones, etc.
Note:
This memory is incorporated into the ASIC (IC1) and used for the image processing.
Descriptions of Pin Distribution (IC1)
NO.
SIGNAL
I/O
POWER SUPPLIED
VOLTAGE
DESCRIPTION
1
VSSA1
GND
POWER SOURCE (ANALOG GND)
2
VDDA 3.3
3.3V
POWER SOURCE (ANALOG +3.3V)
3
AIN1
A
3.3V
CIS IMAGE SIGNAL INPUT (ATN1)
4
AIN2
A
3.3V
THERMISTOR TEMPERATURE WATCH INPUT
5
AIN3
A
3.3V
LINE VOLTAGE DETECTION SIGNAL INPUT (DCIN)
6
AMON
A
3.3V
ANALOG SIGNAL MONITOR TERMINAL
7
VSS1
GND
POWER SOURCE (GND)
8
X32OUT
O
3.3V/BATT
RTC (32.768KHz) CONNECTION
9
X32IN
I
3.3V/BATT
RTC (32.768KHz) CONNECTION
10
VDD (3.3V / B)
-----
POWER SOURCE (+3.3V/LITHIUM BATTERY)
11
XBACKEN
I
3.3V/BATT
BACKUP ENABLE
12
XRAMCS
O
3.3V/BATT
XRAMCS
13
VDD (3.3V / B)
-----
POWER SOURCE(+3.3V / LITHIUM BATTERY)
14
VDD (2.5V/B)
-----
POWER SOURCE (+2.5V / LITHIUM BATTERY)
15
FTG
O
3.3V
SH SIGNAL OUTPUT FOR CIS (FTG)
16
F1
O
3.3V
01 SIGNAL OUTPUT FOR CIS (F1)
17
F2/OP
O
3.3V
OUTPUT PORT (HEADON)
18
FR/OP
O
3.3V
OUTPUT PORT (MDMRST)
19
CPC
I
3.3V
INPUT PORT (BELL/CPC)
20
RVN
I
3.3V
INPUT PORT (PAPER)
21
IRDATXD
I
3.3V
INPUT PORT (JAM)
22
IRDARXD
O
3.3V
OUTPUT PORT (HSTX MUTE)
23
TXD/IOP
I
3.3V
TXD
24
RXD/IOP
I/O
3.3V
RXD
25
RTS/IOP
I
3.3V
RTS
26
CTS/IOP
I/O
3.3V
CTS
27
VDD (2.5V)1
-----
POWER SOURCE (+2.5V)
28
TONE1
A
3.3V
TONE OUTPUT
29
TONE2
A
3.3V
TONE OUTPUT
30
VOLUREF/VOLU1
A
3.3V
ANALOG REF VOLTAGE
31
VOLUOUT/VOLU2
A
3.3V
VOLUME OUTPUT
32
VOLUIN/VOLU3
A
3.3V
VOLUME INPUT
33
XNMI
I
3.3V
HIGH FIXED
34
FMEMDO/IOP
O
3.3V
OUTPUT PORT (LED ON)
35
VDD (3.3V)1
-----
POWER SOURCE (+3.3V)
36
VSS2
GND
POWER SOURCE (GND)
37
VSS3
GND
POWER SOURCE (GND)
16
KX-FT982CA-B / KX-FT984CA-B / KX-FT988CA-B
38
VDD (3.3V)2
-----
POWER SOURCE (+3.3V)
39
MIDAT/IOP
I/O
3.3V
PORT (TONE1EN)
40
MICLK/IOP
O
3.3V
OUTPUT PORT (MDMTXEN)
41
MILAT/IOP
I/O
3.3V
PORT (HSRXEN)
42
20KOSC/IOP
O
3.3V
OUTPUT PORT (PSHORT/ACK_EN)
43
XWAIT
I
3.3V
INPUT PORT (HOOK)
44
XHSTRD/IOP
I
3.3V
INPUT PORT (TEST)
45
XHSTWR/IOP
O
3.3V
OUTPUT PORT (DCN)
46
XOPRBE
O
3.3V
OUTPUT PORT (MFCS)
47
ADR15
O
3.3V
CPU ADDRESS BUS 15 (NOT USED)
48
ADR14
O
3.3V
CPU ADDRESS BUS 14 (NOT USED)
49
ADR13
O
3.3V
CPU ADDRESS BUS 13 (NOT USED)
50
VDD (2.5V)2
-----
POWER SOURCE (+2.5V)
51
XOUT
O
3.3V
SYSTEM CLOCK (24MHz)
52
XIN
I
3.3V
SYSTEM CLOCK (24MHz)
53
VSS4
GND
POWER SOURCE (GND)
54
VDD (3.3V)3
-----
POWER SOURCE (+3.3V)
55
XTEST
O
3.3V
24MHz CLOCK
56
TEST1
I
3.3V
HIGH FIXED
57
TEST2
I
3.3V
HIGH FIXED
58
TEST3
I
3.3V
HIGH FIXED
59
TEST4
I
3.3V
HIGH FIXED
60
XMDMINT
I
3.3V
MODEM INTERRUPT
61
XMDMCS
O
3.3V
MODEM CHIP SELECT
62
XRAS/IOP
O
3.3V
DRAM ROW ADDRESS STROBE (RAS)
63
XCAS1/IOP
O
3.3V
DRAM COLUMN ADDRESS STROBE (CAS)
64
XCAS2/IOP
I
3.3V
PORT (SPMUTE)
65
XRESCS2
O
3.3V
FLASH CHIP SELECT (XRESCS2)
66
DB3
I/O
3.3V
CPU DATA BUS 3
67
DB2
I/O
3.3V
CPU DATA BUS 2
68
DB4
I/O
3.3V
CPU DATA BUS 4
69
DB1
I/O
3.3V
CPU DATA BUS 1
70
DB5
I/O
3.3V
CPU DATA BUS 5
71
VDD (3.3V)4
-----
POWER SOURCE (+3.3V)
72
VSS5
GND
POWER SOURCE (GND)
73
VSS6
GND
POWER SOURCE (GND)
74
VDD (3.3V)5
-----
POWER SOURCE (+3.3V)
75
DB0
I/O
3.3V
CPU DATA BUS 0
76
DB6
I/O
3.3V
CPU DATA BUS 6
77
DB7
I/O
3.3V
CPU DATA BUS 7
78
XROMCS
O
3.3V
FLASH (IC2) CHIP SELECT
79
XRD
O 3.3V
CPU
RD
80
XWR
O 3.3V
CPU
WR
81
ADR0
O
3.3V
CPU ADDRESS BUS 0
82
ADR1
O
3.3V
CPU ADDRESS BUS 1
83
ADR2
O
3.3V
CPU ADDRESS BUS 2
84
ADR3
O
3.3V
CPU ADDRESS BUS 3
85
ADR4
O
3.3V
CPU ADDRESS BUS 4
86
ADR5
O
3.3V
CPU ADDRESS BUS 5
87
VSS7
GND
POWER SOURCE (GND)
88
VDD (2.5V)3
-----
POWER SOURCE (+2.5V)
89
ADR6
O
3.3V
CPU ADDRESS BUS 6
90
ADR7
O
3.3V
CPU ADDRESS BUS 7
91
ADR8
O
3.3V
CPU ADDRESS BUS 8
92
ADR9
O
3.3V
CPU ADDRESS 9
93
ADR10
O
3.3V
CPU ADDRESS 10
94
ADR11
O
3.3V
CPU ADDRESS 11
95
ADR12
O
3.3V
CPU ADDRESS 12
96
RBA0
O
3.3V
ROM/RAM BANK ADDRESS 0
97
RBA1
O
3.3V
ROM/RAM BANK ADDRESS 1
98
RBA2
O
3.3V
ROM/RAM BANK ADDRESS 2
99
RBA3
O
3.3V
ROM/RAM BANK ADDRESS 3
100
RBA4
O
3.3V
ROM/RAM BANK ADDRESS 4
101
RBA5
O
3.3V
ROM/RAM BANK ADDRESS 5
102
RBA6/IOP
O
3.3V
OUTPUT PORT (NC)
103
STB1
O
3.3V
STROBE SIGNAL OUTPUT TO THERMAL HEAD
NO.
SIGNAL
I/O
POWER SUPPLIED
VOLTAGE
DESCRIPTION
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