DOWNLOAD Panasonic KX-FT57E Service Manual ↓ Size: 3.76 MB | Pages: 127 in PDF or view online for FREE

Model
KX-FT57E
Pages
127
Size
3.76 MB
Type
PDF
Document
Service Manual
Brand
Device
Fax / THERMAL PAPER
File
kx-ft57e.pdf
Date

Panasonic KX-FT57E Service Manual ▷ View online

|
114
|
KX-FT57E
(A)
PAPER GUIDE
FRONT LID 
       OPEN BUTTON
Screwdriver
Fig. A
1
2
Fig. B
STOPPER
FLAT HEAD
SCREWDRIVER
CUTTER GUIDE
RECORDING 
PAPER  ROLLER
PAPER CUTTER 
Remove the shaft.
STOPPER
1
2
1) Push the front lid open button in the direction of the arrow to open the operation block.
2) Remove the paper guide.
3) Remove the 2 screws (A).
4) Remove the shaft with a flat head screwdriver (small size) as shown in Fig. A.
5) Remove the paper cutter block.
6) Remove the cutter guide.
7) Replace the paper cutter.
8) Remove the stopper with a flat head screwdriver (small size) as shown in Fig. B.
9) Remove the recording paper roller.
HOW TO REMOVE THE CUTTER BLOCK
HOW TO CLEAN:
Clean the roller with cloth
a soaked in alcohol.
Ref. No. 10
Procedure
10
|
115
|
KX-FT57E
DISASSEMBLY INSTRUCTIONS
RECORDING PAPER COVER
ARM
ARM
2
1
3
Fig. A
HOW TO REMOVE THE RECORDING PAPER COVER
1) Pull out both arms as shown in Fig. A.
2) Remove the recording paper cover.
Ref. No. 11
Procedure
10
¤
11
|
116
|
KX-FT57E
2
1
DOCUMENT FEED TRAY
HOOKS
HOW TO REMOVE THE THERMAL HEAD ROLLER
1) Remove the thermal head block.
2) Pull out the 2 connectors.
3) Remove the 2 screws (A) of the thermal head to remove the guides.
4) Replace the thermal head.
HOW TO CLEAN:
Clean the thermal head
printing surface with a
cloth soaked in alcohol.
HOW TO REMOVE THE DOCUMENT TRAY
1) Press the hooks in the direction of the arrow to remove the document tray.
Ref. No. 12
Procedure
10
¤
12
Ref. No. 13
Procedure
13
THERMAL HEAD BLOCK
CONNECTORS
THERMAL HEAD
GUIDE
(A)
(A)
GUIDE
|
117
|
KX-FT57E
DISASSEMBLY INSTRUCTIONS
¡
 PROCEDURE
1.  Temporarily fix the FLAT PACKAGE IC by soldering on the two marked pins.
Check that the IC is set correctly to the soldering foil.
2.  Apply flux to all of the pins of the FLAT PACKAGE IC.
3.  Solder using the specified solder by sliding the soldering iron in the direction of the arrow.
¡
 BRIDGE MODIFICATION PROCEDURE
1.  Slightly re-solder on the bridged portion.
2.  Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
Soldering iron
bridge
Specified solder
Flux
Temporary soldering point
¡
 PREPARATION
• SOLDER
Sparkle Solder 115A-1, 115B-1
OR
Almit Solder KR-19, KR-19RMA
• Soldering iron
Recommended power consumption should be between 30 W to 40 W.
Temperature of Copper Rod 662 
±
 50  F
 
(350 
±
10
 )
(An expert may handle a 60~80 W iron, but a beginner might
damage the foil by overheating.)
• Flux
HI115         Specific gravity 0.863
(The original flux should be replaced daily.)
°
HOW TO REPLACE THE FLAT PACKAGE IC
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