Panasonic KX-FP85 Service Manual ▷ View online
5 HOW TO REPLACE THE FLAT PACKAGE IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
5.1. PREPARATION
·
SOLDER
Sparkle Solder 115A-1, 115B-1 OR Almit Solder KR-19, KR-19RMA
·
Soldering iron
Recommended power consumption is between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle a 60~80 W iron, but a beginner might damage the foil by overheating.)
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle a 60~80 W iron, but a beginner might damage the foil by overheating.)
·
Flux
HI115 Specific gravity 0.863
(Original flux should be replaced daily.)
HI115 Specific gravity 0.863
(Original flux should be replaced daily.)
5.2. FLAT PACKAGE IC REMOVAL PROCEDURE
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the land with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
left at the joint on the board, the new IC will not be attached properly.
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5.3.
FLAT PACKAGE IC INSTALLATION PROCEDURE
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering
foil.
foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
5.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
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6 CIRCUIT OPERATIONS
6.1. CONNECTION DIAGRAM
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6.2. GENERAL BLOCK DIAGRAM
The following is an outline of each device IC on the digital board. (Refer to 6.2.1 GENERAL BLOCK DIAGRAM(P.129).).
1. ASIC (IC501)
Composed mainly of an address decoder and a modem control.
Controls the general FAX operations.
Controls the operation panel I/F.
Controls the thermal head I/F and CIS I/F.
Performs the image processing.
CPU and Real time clock
Provides the reset pulse for each of the major ICs.
2. ROM (IC502)
Contains all of the program instructions on the unit operations.
3. Static RAM (IC504)
This memory is used mainly for the parameter working in the storage area.
4. Dynamic RAM (IC503)
This memory is used mainly for the parameter working in the storage area.
5. MODEM (IC505)
Performs the modulation and the demodulation for FAX communication.
6. Read Section
CIS image sensor to read transmitted documents.
7. Motor Driver (IC508)
Drives the transmission motor and the reception motor.
8. Thermal Head
Contains heat-emitting elements for dot matrix image printing.
9. Analog Board
Composed of ITS circuit and NCU circuit.
10. Sensor Section
Composed of a cover open and film end switch, a document set switch, a document top switch, a paper top sensor and a motor
position switch.
position switch.
11. Power Supply Board Switching Section
Supplies +5V and +24V to the unit.
12. Flash Memory (IC512)
This memory is used for voice prompt and TAM.
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