DOWNLOAD Panasonic SV-AV50EB / SV-AV50EG / SV-AV50GC / SV-AV50GK (serv.man3) Service Manual ↓ Size: 2.12 MB | Pages: 40 in PDF or view online for FREE

CSP

Both of tools are turned on.

Wait for at least 5 minutes to stabilize the hot air temperature.

Leave the board warmer shutter open.

Moving the PCB support plate, and then align the CSP 
of the repair board over the reflow hole.

Wait for approx. 90 seconds to preheat the PCB.

Adjust the blower using the knobs of the stay so that the tip of the blower nozzle, fixed to the blower holder, 
moves as close as possible to the CSP surface.

NOTE: Be careful not to touch the PCB surface or adjacent parts.

Heat for approx.
90 seconds.

Solder 
melts.

Move the nozzle tip 
as close as possible 
to the CSP surface.

PCB

NOTE: Pay attention to the hot air 
            blown from above and below.

Blower

Nozzle for CSP

Shutter

PCB holder or
support plate

Moving the CSP nozzle, draw up the CSP by 
suction with the Vacuum PIC.

Change the size of the pat on the Vacuum 
PIC tip according to the IC.

Pad size of vacuum PIC

L size

M size

S size

NOTE: 1. Be careful of the CSP is hotted.

2. Do not use ordinary tweezers.

Remove the PCB from the plate in applox. 30 seconds 
after closing the Board Warmer shutter.
30 seconds ----- A standard time necessary for the solder 
                         becomes solid on the board.

After removing the PCB, open the Board Warmer shutter.

13

NOTE: Caution of hot wind from the reflow hole.

Removal of the solder fron the CSP installation area 
using soldering iron and desolder braid.
Be sure use less than 30W soldering iron.

Visually check for remaining solder using a magnifier.

Rainforced
land

Be careful not to produce soldering defects 
such as whisker or soldering inconsistency 
on the electrode lands.

PCB

NOTE: When using the desolder braid, be careful 

not to remove the land copper foil.

< Installation area figure. A >

Electrode 
land

Rainforced land

Alignment mark 
(on the PCB)

Reference: Some types of CSPs have reinforced 

lands and others not.

Wipe out the flux from the board surface using alcohol or others.

(*1: HOZAN Z-293, Code No. 92923 Flux remover)

Apply the flux lightly with a brush.

It is recommended to use a magnifier. (HOZAN L-55 + L-65 etc.)

Align the CSP with the alignment marks on the board. (Refer to "Installation area figure. A")
POINT: When viewed from above, the alignment marks should be visible along the CSP on the PCB.

After the CSP has been aligned, move the PCB to the SPOT HEATER / BOARD WARMER. 
Be careful not to vibrate the PCB while moving it.
After moving the PCB, check if the CSP does not deviate from the installation position using a magnifier 
or something.

14

Set the PCB to BOARD WARMER

The CSP has been aligned on the PCB.

Moving the PCB support plate, and then align the CSP 
repair area over the reflow hole.

NOTE: Pay attention to the hot air.

Preheat the PCB (at the CSP installation area) for applox. 
60 seconds.

CSP

PCB

Blower

Nozzle

Move the nozzle tip 
as close as possible 
to the CSP surface.

Shutter

PCB holder or
support plate

CAUTION: Be careful not to suffer a burn with the hot air from 
                  above and below.

Set the nozzle at the 
same position as set 
when the CSP was 
removed.

The nozzle position was 
adjusted when the CSP 
was removed.

*

Heat the PCB approx. 30 seconds.

Solder melts

When the solder melts, the CSP 
slightly moves or sinks due to a 
self alignment effect to correct 
subtle deviation.

*

Remove the PCB from the plate in applox. 30 seconds 
after closing the board wamer shutter.
applox. 30 seconds
  ----- A standard time necessary for the solder to become 
         solid on the PCB (cooling the PCB)

Install the capacitor and flash unit that have been removed.
This completes the repair of CSP. To check if the repair is successful or not, operate the 
circuit or perform some procedures such as the circuit checking procedure.

15

16