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Model
DMC-LC1PP DMC-LC1EB DMC-LC1EG DMC-LC1GC DMC-LC1GD DMC-LC1GN (serv.man2)
Pages
47
Size
2.7 MB
Type
PDF
Document
Service Manual
Brand
Device
Digital Camera / DIGITAL CAMERA
File
dmc-lc1pp-dmc-lc1eb-dmc-lc1eg-dmc-lc1gc-dmc-lc1gd-.pdf
Date

Panasonic DMC-LC1PP / DMC-LC1EB / DMC-LC1EG / DMC-LC1GC / DMC-LC1GD / DMC-LC1GN (serv.man2) Service Manual ▷ View online

8 CSP REPAIR PROCEDURE
This model is using the CSP.
When repair the CSP, it performes in the following equipment and procedure.
When repair the CSP, setup of temperature and time is important. Be careful to setting temperature and time, it may change with
models.
8.1. TOOLS TO BE USED
Name
Part No.
Usage
Manufacture
SPOT HEATER
HS-557
For reflow from above
HOZAN
BOARD WARMER
HV-500
For reflow from below
HOZAN
PCB SUPPORT PLATE
Accessory of HV-500
For holding PCB
HOZAN
BLOWER HOLDER
HS-505
For holding blower
HOZAN
NOZZLE
HS-572
For CSP reflow
HOZAN
BACUUM PIC
P-835
For CSP removal
HOZAN
FLUX WITH BRUSH
H-721
-----
HOZAN
DIGITAL THERMOMETER
DT-510
For measuring temperature
HOZAN
SENSOR PROBE
DT-510A
Connected to DT-500
HOZAN
ALCOHOL/THREAD SOLDER/SOLDERING IRON
-----
-----
This model uses lead free solder (PbF).
8.2. PART NAMES OF SPOT HEATER AND BOARD WARMER
SPOT HEATER
Temperature
control VR
Blower
Nozzle
PCB holder
PCB support plate
Stay
(Holder position
 adjustment knob)
Blower holder
Power supply
BOARD WARMER & PCB HOLDER
8.3. PREPARATION
For hot air blowout time, refer to the following table.
Removal
Installation
Preheat
Heat
Preheat
Heat
90 seconds
60 seconds
90 seconds
60 seconds
The temperatures are measured with DT-510 and DT-510A at a room temperature of approx. 20°C for reference.
Reflow tools
Preparation of tools
Setting conditions
Preheat
HEAT level
AIR level
SPOT HEATER
Install a nozzle to the blower
240°C
MIN
Turn on the power after presetting the
temperature and air flow.
Wait for at least 5 minutes to stabilize the hot
air temperature.
NOTE:
Open the board warmer shutter beforehand.
Set the board warmer hood at the lowest
position.
BOARD WARMER
Install the blower to the blower holder
210°C
----
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DMC-LC1PP / DMC-LC1EB / DMC-LC1EG / DMC-LC1GC / DMC-LC1GD / DMC-LC1GN
8.4. CSP REMOVAL PROCEDURE
CPU removal complete
CSP
SPOT HEATER
BOARD WAMER
Both of tools are turned on.
Wait for at least 5 minutes to stabilize the hot air temperature.
Leave the board warmer shutter open.
Moving the PCB support plate, and then align the CSP 
of the repair board over the reflow hole.
Wait for approx. 90 seconds to preheat the PCB.
Adjust the blower using the knobs of the stay so that the tip of the blower nozzle, fixed to the blower holder, 
moves as close as possible to the CSP surface. (less than 0.5 mm)
NOTE: Be careful not to touch the PCB surface or adjacent parts.
Heat for approx.
60 seconds.
Solder 
melts.
Move the nozzle tip 
as close as possible 
to the CSP surface.
PCB
NOTE: Pay attention to the hot air 
            blown from above and below.
Blower
Nozzle for CSP
Shutter
PCB holder or
support plate
Moving the CSP nozzle, draw up the CSP by 
suction with the Vacuum PIC.
Change the size of the pat on the Vacuum 
PIC tip according to the IC.
Pad size of vacuum PIC
L size
M size
S size
NOTE: 1. Be careful of the CSP is hotted.
2. Do not use ordinary tweezers.
Remove the PCB from the plate in applox. 30 seconds 
after closing the Board Warmer shutter.
30 seconds ----- A standard time necessary for the solder 
                         becomes solid on the board.
After removing the PCB, open the Board Warmer shutter.
CSP removal complete
Do not reuse of the removed CSP
14
DMC-LC1PP / DMC-LC1EB / DMC-LC1EG / DMC-LC1GC / DMC-LC1GD / DMC-LC1GN
8.5. CSP ASSEMBLY PROCEDURE
Step 1.
Cleaning of the PCB (at CSP installation area)
Remove the PCB from BOARD WARMER
NOTE: Caution of hot wind from the reflow hole.
Removal of the solder of CSP installation area
Flat the solder on the electrode land using the solder of CSP
installation area on C.B.A. by the soldering iron.
   --- (the tip temperature is  380   )
Slide soldering iron on the surface of the remaining solder with
gentle stroke.
Perform soldering without making a string and uneven solder.
(Visually check for remaining solder using a magnifire)
Rainforced
land
Be careful not to produce soldering defects 
such as whisker or soldering inconsistency 
on the electrode lands.
PCB
NOTE: Do not use the desolder braid.
It causes to remove the electrode land
copper foil.
< Installation area figure. A >
Electrode 
land
Rainforced land
Alignment mark 
(on the PCB)
Reference: Some types of CSPs have reinforced 
lands and others not.
Clean the CSP installation area
Wipe out the flux from the board surface using alcohol or others.
(*1: HOZAN Z-293, Code No. 92923 Flux remover)
Apply the flux at the CSP installation area  -----  Using flux with brush
Apply the flux lightly with a brush.
Place a new CSP on the PCB and align it
It is recommended to use a magnifier. (HOZAN L-55 + L-65 etc.)
Align the CSP with the alignment marks on the board. (Refer to "Installation area figure. A")
POINT: When viewed from above, the alignment marks should be visible along the CSP on the PCB.
After the CSP has been aligned, move the PCB to the SPOT HEATER / BOARD WARMER. 
Be careful not to vibrate the PCB while moving it.
After moving the PCB, check if the CSP does not deviate from the installation position using a magnifier 
or something.
Apply the flux lightly.
15
DMC-LC1PP / DMC-LC1EB / DMC-LC1EG / DMC-LC1GC / DMC-LC1GD / DMC-LC1GN
Step 2.
Install of the CSP
SPOT HEATER
BOARD WAMER
Set the PCB to BOARD WARMER
The CSP has been aligned on the PCB.
Moving the PCB support plate, and then align the CSP 
repair area over the reflow hole.
NOTE: Pay attention to the hot air.
Preheat the PCB (at the CSP installation area) for applox. 
90 seconds.
CSP
PCB
Blower
Nozzle
Move the nozzle tip 
as close as possible 
to the CSP surface.
Shutter
PCB holder or
support plate
CAUTION: Be careful not to suffer a burn with the hot air from 
                  above and below.
Set the nozzle at the 
same position as set 
when the CSP was 
removed.
The nozzle position was 
adjusted when the CSP 
was removed.
*
Heat the PCB approx. 60 seconds.
Solder melts
When the solder melts, the CSP 
slightly moves or sinks due to a 
self alignment effect to correct 
subtle deviation.
*
Remove the PCB from the plate in applox. 30 seconds 
after closing the board wamer shutter.
applox. 30 seconds
  ----- A standard time necessary for the solder to become 
         solid on the PCB (cooling the PCB)
CSP install (repair) complete.      Confirm for deviation from the alignment 
                                                      marks again.
This completes the repair of CSP. To check if the repair is successful or not, operate the 
circuit or perform some procedures such as the circuit checking procedure.
16
DMC-LC1PP / DMC-LC1EB / DMC-LC1EG / DMC-LC1GC / DMC-LC1GD / DMC-LC1GN
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