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3.2.1.2.
About Main P.C.B. (Ref. 1) / POW Flash P.C.B. (Ref. 52)
1. This Service Manual does not contain the following repair service information for “MAIN P.C.B.”(Ref.1) and “POW Flash
P.C.B.”(Ref.52), because it requires special facilities and equipment.
a. Schematic diagram, Block diagram and P.C.B. layout.
b. Parts list for individual parts.
a. Schematic diagram, Block diagram and P.C.B. layout.
b. Parts list for individual parts.
2. When a part replacement is required for repairing “MAIN P.C.B.” and “POW Flash P.C.B.”, replace as an assembled P.C.B.
parts and send it/them to Central Repair Center.
3. The following category is recycle module part. Please send it/them to Central Repair Center.
*MAIN P.C.B. (VEP56107A)
*POW FLASH P.C.B. (VEP51027A)
*POW FLASH P.C.B. (VEP51027A)
Important (About Main P.C.B.):
1. Before exchange the "MAIN P.C.B.", the performances must be carefully checked, by following the "7.Troubleshooting Guide"
section of this service manual.
2. Before replacing the "MAIN P.C.B.", proceed the EEPROM data backup from the unit. After replacing the MAIN P.C.B., over-
write the EEPROM data with backup data from the unit first, then proceed the adjustment /inspection.
If it is impossible to make a data backup due to the unit does not turns on the power and so on, additional adjustment (using
the light box) is required.
Refer to the adjustment instruction in the adjustment software for details.
If it is impossible to make a data backup due to the unit does not turns on the power and so on, additional adjustment (using
the light box) is required.
Refer to the adjustment instruction in the adjustment software for details.
3. The full adjustment must be performed after replacing the "MAIN P.C.B.", otherwise Picture quality can not be meet with spec-
ification.
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3.2.2.
Lens Unit (Interchangeable Lens: H-FS014042)
3.2.2.1.
About Lens Main Block Unit (Ref. 208)
1. This Service Manual does not contain the repair service information for "LENS MAIN BLOCK UNIT"(Ref.208), because it
requires special facilities and equipment.
2. The "LENS MAIN BLOCK UNIT"(Ref.208) performance must be confirmed.
3. In case of the "LENS MAIN BLOCK UNIT"(Ref.208) defect, contact to the service department of sales company.
3. In case of the "LENS MAIN BLOCK UNIT"(Ref.208) defect, contact to the service department of sales company.
Fig. S3
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3.2.3.
Lens Unit (Interchangeable Lens: H-FS045200)
3.2.3.1.
About Lens Main Block Unit (Ref. 308)
1. This Service Manual does not contain the repair service information for "LENS MAIN BLOCK UNIT"(Ref.308), because it
requires special facilities and equipment.
2. The "LENS MAIN BLOCK UNIT"(Ref.308) performance must be confirmed.
3. In case of the "LENS MAIN BLOCK UNIT"(Ref.308) defect, contact to the service department of sales company.
3. In case of the "LENS MAIN BLOCK UNIT"(Ref.308) defect, contact to the service department of sales company.
Fig. S4
3.2.4.
About Flexible Cable and Connector
Do not touch carelessly so that the foreign body should not adhere to the terminal part of flexible cable and connector.
Wipe off with a clean cloth and the cotton bud, etc. when the terminal part is dirty.
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3.3.
General Description About Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30
°C (86°F) more than that of the
normal solder.
Distinction of P.C.B. Lead Free Solder being used
Distinction of P.C.B. Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the P.C.B. using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the P.C.B. cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
• Remove the remaining lead free solder on the P.C.B. cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
°C
(662±86
°F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01KS-----------(0.3mm 100g Reel)
RFKZ06D01KS-----------(0.6mm 100g Reel)
RFKZ10D01KS-----------(1.0mm 100g Reel)
RFKZ06D01KS-----------(0.6mm 100g Reel)
RFKZ10D01KS-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
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