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5

There are special components used in this equipment which are important for safety.

These parts are marked by   in the Schematic Diagrams, Exploded View & Replacement Parts List. It is essential that these
critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the
original design without permission of manufacturer.

Safety

Ref. No.

Part No.

Part Name & Description

Remarks

23

RGN3453-K

NAME PLATE

EC/EB/EF/EG

23

RGN3453A-K

NAME PLATE

EE

29

RMV0442

SMPS COVER SHEET

301

RAE1028Z-V

TRAVERSE UNIT

A2

K2CQ2YY00119

AC CORD

EC/EE/EF/EG

A2

K2CT2YY00097

AC CORD

EB

A3

RQT9926-B

O/I BOOK (En)

EB/EC

A3

RQT9927-D

O/I BOOK (Fge/Fr/It/Du)

EG

A3

RQT9928-H

O/I BOOK (Fr)

EF

A3

RQT9929-E

O/I BOOK (Sw/Da/Sp/Cz/Po/Fi)

EC

A3

RQT9930-1R

O/I BOOK (Ru/Ur)

EE

PCB5

REP5070AA

SMPS P.C.B.

(RTL)

Z1752

D4EAY511A182

VARISTOR

L1702

G0B922G00002

LINE FILTER

T1700

G4DYZ0000077

TRANSFORMER

PC1702

B3PBA0000579

PHOTO COUPLER

F1700

K5G202Y00006

FUSE

P1751

K2AA2B000011

AC INLET

R1724

ERJ12YJ105U

1M     1/2W

R1726

ERJ12YJ105U

1M     1/2W

C1702

F0CAF224A105

0.22uF

C1710

F1BAF471A013

470pF

C1725

F0CAF104A105

0.1uF

C1727

F1BAF1020020

1000pF

C1728

F1BAF1020020

1000pF

6

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices.

The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge
(ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals.   These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
CAUTION: 

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).

7

This product utilizes a laser diode with the unit turned "on", invisible laser radiation is emitted from the pickup lens.
Wavelength: 790 nm (CD)
Maximum output radiation power from pickup: 100 

μW/VDE

Laser radiation from the pickup unit is safety level, but be sure the followings: 

1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous. 
2. Do not adjust the variable resistor on the pickup unit. It was already adjusted.
3. Do not look at the focus lens using optical instruments.
4. Recommend not to look at pickup lens for a long time.

Dieses Produkt enthält eine Laserdiode. Im eingeschalteten Zustand wird unsichtbare Laserstrahlung von der Lasereinheitadg-
estrahit.
Wellenlänge : 790nm (CD)
Maximale Strahlungsleistung der Lasereinheit :100 

μW/VDE

Die Strahlung an der Lasereinheit ist ungefährlich, wenn folgende Punkte beachtet werden:

1. Die Lasereinheit nicht zerlegen, da die Strahlung an der freigelegten Laserdiode gefährlich ist.
2. Den werkseitig justierten Einstellregler der Lasereinhit nicht verstellen.
3. Nicht mit optischen Instrumenten in die Fokussierlinse blicken.
4. Nicht über längere Zeit in die Fokussierlinse blicken.

THIS PRODUCT UTILIZES A LASER.
USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT
IN HAZARDOUS RADIATION EXPOSURE.

8

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86

°F) more than that

of the normal solder.

• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the

lead free solder.

• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees

C (662±86

°F).

• The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)

* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)