DOWNLOAD LG 47LH7000 / 47LH7020 / 47LH7030 (CHASSIS:LD91D) Service Manual ↓ Size: 3.51 MB | Pages: 35 in PDF or view online for FREE

Model
47LH7000 47LH7020 47LH7030 (CHASSIS:LD91D)
Pages
35
Size
3.51 MB
Type
PDF
Document
Service Manual
Brand
Device
TV / LCD
File
47lh7000-47lh7020-47lh7030-chassis-ld91d.pdf
Date

LG 47LH7000 / 47LH7020 / 47LH7030 (CHASSIS:LD91D) Service Manual ▷ View online

- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1.  Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2.  Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and
solder it.
3.  Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as
possible to the component body.
2.  Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit
board.
4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.
Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as
possible to diode body.
2.  Bend the two remaining leads perpendicular y to the circuit
board.
3.  Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4.  Securely crimp each connection and solder it.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2.  Securely crimp the leads of replacement component around
notch at stake top.
3.  Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1.  Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2.  carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3.  Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4.  Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1.  Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2.  Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3.  Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General specification
1. Application range
This specification is applied to the LCD TV used LD91D
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature :  25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity :  65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed 
2) Demanded other specification 
- Safety: CE/IEC specification
- EMC: CE/IEC
No
Item Specification 
Remark
1
Display Screen Device 
47 wide Color Display Module 
LCD
2
Aspect Ratio
16:9
3
LCD Module 
47” TFT LCD FHD 100Hz
LGD
4
Operating Environment  Temp. : 0 ~50 deg
Humidity : 20 ~90 %
5
Storage Environment 
Temp. : -20 ~60 deg
Humidity : 10 ~90 %
6
Input Voltage 
AC100-240V~, 50/60Hz
7
Power consumption
Power on  (White)
47” LGD
Typ : 213, Max : 240 
LCD(Module) + Backlight(Lamp)
8
Module Size
47” LGD
1075.6(H) x 620.8(V) x 30.3mm(D)
9
Pixel Pitch
47” LGD
0.5415(H) x 0.5415(V)
10
Backlight  
22 EEFL
11
Display Colors
1.06B(true) colors
12
Coating 3H(Hard 
coating)
5. Chroma& Brightness
(1) Module optical specification
1) Stable for approximately 60 minutes in a dark environment at 25±2ºC and windless room
2) Operating Ambient Humidity : Min 10, Max 90% RH
3) Supply Voltage : 24V
4) Frame Frequency : 120Hz
(2) Chroma (PSM: Vivid, Color Temperature: Cool)
- except “RGB PC Mode PSM:Standard,Color Temperature:Medium”
**The W/B Tolerance is ±0.002 for Adjustment, but for DQA ±0.015
(3) SET Optical Feature
1) General feature
* Measurement Condition: Full white/Dynamic) -> Measure the black luminance after 30 seconds.
2) Special feature (Dynamic CR 15000:1)
- 7 -
No.
Item Specification 
Min.
Typ.
Max.
Remark
1.
Viewing Angle<CR>10>
Right/Left/Up/Down 
89/89
CR>10
89/89
2.
Luminance
Luminance (cd/m2)
400 
500
PSM:Vivid,CSM:Cool, 
White(100IRE)
Dynamic contrast :off
Dynamic color L off
Variation 1.3 
MAX 
/MIN
3.
Contrast Ratio 
CR 
1000 
1300
4.
CIE Color Coordinates
White
Wx
Typ 
0.279
Typ 
PSM:Vivid,CSM:Cool,
Wy
-0.03
0.292
+0.03
White(85IRE)
RED
Xr
0.638
Dynamic contrast :off
Yr
0.335
Dynamic color L off
Xg 0.289
Green
Yg 0.609
Xb 0.145
Blue
Yb
0.063
No Item 
Min
Typ 
Max 
Remark
1.
Cool
White Balance,X axis
0.274 
0.276
0.278
DQA : ±0.015
White Balance,Y axis
0.281  
0.283
0.285
DQA : ±0.015
2. 
Medium
White Balance,X axis
0.283 
0.285
0.287
DQA : ±0.015
White Balance,Y axis
0.291 
0.293
0.295
DQA : ±0.015
3.
Warm
White Balance,X axis
0.311 
0.313
0.315
DQA : ±0.015
White Balance,Y axis
0.327 
0.329
0.331
DQA : ±0.015
No 
Item
Min
typ
Max
Inch
Power Board P/N
Remark
1
Dynamic CR
10000 
15000
47”
EAY58470001
HDMI 720p Full Black Pattern
(Only HDMI mode) 
No Item
Module
Luminance (min)
C/R(min)
Remark
AV,COMPONENT,HDMI AV,COMPONENT,HDMI
1. 
47 inch
LGD
400cd/m2
1000 
except from the PC mode.
- 8 -
6. Component Video Input (Y, P
B
, P
R
)
No
Specification
Remark
Resolution
H-freq(kHz)
V-freq(Hz)
1.
720x480 15.73 
60.00 
SDTV,DVD 
480i
2.
720x480 15.63 
59.94
SDTV,DVD 
480i
3.
720x480 31.47
59.94
480p
4.
720x480 31.50 
60.00
480p
5.
720x576 
15.625 
50.00
SDTV,DVD 625 Line
6.
720x576 31.25 
50.00
HDTV 
576p
7.
1280x720 45.00
50.00
HDTV 
720p
8.
1280x720 44.96
59.94
HDTV 
720p
9.
1280x720 45.00
60.00
HDTV 
720p
10.
1920x1080
31.25
50.00
HDTV 1080i
11.
1920x1080 33.75 
60.00
HDTV 
1080i
12.
1920x1080 33.72 
59.94
HDTV 
1080i
13.
1920x1080 26.97/27 
23.97/24
HDTV 
1080p
14.
1920x1080 33.716/33.75 
29.976/30.00
HDTV 
1080p
15.
1920x1080 56.250 
50
HDTV 
1080p
16.
1920x1080 67.43/67.5  59.94/60
HDTV 
1080p
7. RGB PC INPUT 
No
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
Proposed
Remark
1.
720x400 31.468 
70.08  28.321
2.
640x480 31.469 
59.94
25.17
VESA
37.684 75.00
31.50
3. 800x600
37.879 
60.31
40.00 
VESA
46.875 75.00
49.50
4.
832x624 49.725 
74.55  57.283 
Macintosh
5. 1024x768
48.363 
60.00 
65.00 
VESA(XGA)
56.470 70.00 
75.00
60.123
75.029
78.75
6. 1280x768 
47.78 
59.87 
79.5 
WXGA
7. 1360x768 
47.72 
59.8 
84.75 
WXGA
8. 1366x768
47.56 
59.6 
84.75 
WXGA
9. 1280x1024 
63.595 
60.0 
108.875 
SXGA
10. 1920x1080
66.647 
59.988 
138.625 
WUXGA
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