DOWNLOAD LG 47LH30FR (CHASSIS:LP91A) Service Manual ↓ Size: 5.48 MB | Pages: 33 in PDF or view online for FREE

C

2009

- 5 -

IC Remove/Replacement
Some  chassis  circuit  boards  have  slotted  holes  (oblong)  through
which  the  IC  leads  are  inserted  and  then  bent  flat  against  the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards  using  the  familiar  round  hole,  use  the  standard  technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying  up  on  the  lead  with  the  soldering  iron  tip  as  the  solder
melts.

2.  Draw  away  the  melted  solder  with  an  anti-static  suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully  bend  each  IC  lead  against  the  circuit  foil  pad  and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect  the  replacement  transistor  leads  to  the  corresponding

leads  extending  from  the  circuit  board  and  crimp  the  "U"  with
long  nose  pliers  to  insure  metal  to  metal  contact  then  solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove  defective  diode  by  clipping  its  leads  as  close  as

possible to diode body.

2.  Bend  the  two  remaining  leads  perpendicular  y  to  the  circuit

board.

3.  Observing  diode  polarity,  wrap  each  lead  of  the  new  diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect  (on  the  circuit  board  copper  side)  the  solder  joints  of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely  crimp  the  leads  of  replacement  component  around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain  original  spacing  between  the  replaced
component  and  adjacent  components  and  the  circuit  board  to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive  heat  applied  to  the  copper  foil  of  any  printed  circuit
board  will  weaken  the  adhesive  that  bonds  the  foil  to  the  circuit
board  causing  the  foil  to  separate  from  or  "lift-off"  the  board.  The
following  guidelines  and  procedures  should  be  followed  whenever
this condition is encountered.

At IC Connections
To  repair  a  defective  copper  pattern  at  IC  connections  use  the
following  procedure  to  install  a  jumper  wire  on  the  copper  pattern
side  of  the  circuit  board.  (Use  this  technique  only  on  IC
connections).

1.  Carefully  remove  the  damaged  copper  pattern  with  a  sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully  scratch  away  the  solder  resist  and  acrylic  coating  (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route  the  jumper  wire  along  the  path  of  the  out-away  copper

pattern and let it overlap the previously scraped end of the good
copper  pattern.  Solder  the  overlapped  area  and  clip  off  any
excess jumper wire.

At Other Connections
Use  the  following  technique  to  repair  the  defective  copper  pattern
at  connections  other  than  IC  Pins.  This  technique  involves  the
installation  of  a  jumper  wire  on  the  component  side  of  the  circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace  along  the  copper  pattern  from  both  sides  of  the  pattern

break  and  locate  the  nearest  component  that  is  directly
connected to the affected copper pattern.

3.  Connect  insulated  20-gauge  jumper  wire  from  the  lead  of  the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

C

2009

- 6 -

NOTE : Specifications and others are subject to change without notice for improvement.

4.1 General Specification

This  spec  sheet  is  applied  to  LCD  TV  used  LP91A/  B/  C/  D
chassis.

Each part is tested as below without special appointment.
1) Temperature :  25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity :  65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)

* Standard Voltage of each products is marked by models.

4) Specification  and  performance  of  each  parts  are  followed

each  drawing  and  specification  by  part  number  in
accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

1) Performance: LGE TV test method followed 
2) Demanded other specification 

- Safety: CE, IEC specification
- EMC : CE, IEC

No

Item 

Specification 

Remark

1

Display Screen 

47” wide Color Display Module

Resolution: 1366*768/1920* 1080

Device

55” wide Color Display Module 

Resolution: 1920* 1080

2

Aspect Ratio

16:9

3

LCD Module

47” TFT WUXGA LCD

1096 x 640 x 50/ (51) 

without inverter/ with inverter

55” TFT WUXGA LCD

4

Operating Environment 

Temp.: 0 ~ 40 deg

Humidity : 0 ~ 80 %

5

Storage Environment 

Temp.: -20 ~ 60 deg

Humidity : 0~ 85 %

6

Input Voltage 

AC100 ~ 240V,50/60Hz

7≤ 27

0 W

47

”FHD

≤ 280 W 

47”FHD,100Hz

≤ 360 W 

55”FHD,100Hz

8

Coating

3H

LP91A

47LH30FR(FHD)

LP91B

47LH50YR(FHD+100Hz)

55LH50YR(FHD+100Hz) 

LP91C

47LH90QR(FHD)

LP91D

47LH70YR(FHD+100Hz+Slim) 

- 7-

C

2009

No Item 

Min 

Typ

Max 

Unit 

Remark

1. Incline Plane Tip Test 

10 

deg 

IEC60065

2. Isolation Gap,AC-AC 

3.0 

mm

3. Isolation Gap, Hot and Cold 

6 

mm

4. Isolation Gap,Primary <-> GND

3 

mm

Isolation Gap,Primary <-> Secondary

6.0

mm 

5. Power Consumption,Max 

270

W

47” FHD

280

W 

47” FHD+100Hz

360

W

55” FHD+100Hz

6. Power Consumption,Stand by 

0.5 

0.6

W 

OFF mode: 1W under(china only)

7. Power Consumption,Switch off 

0.1

W

8. Dielectric Voltage

AC <-> FG 

1.5

At 100mA for 1 sec(Line)

1.5

KV

At 100mA for 1 min(OQC)

Without

3

At 100mA for 1 sec(Line)

3

KV

At 100mA for 1 min(OQC)

9. Isolation Resistance 

4

MΩ

IEC60065

10. Leakage Current 

UL/CSA

0.5

mA rms

Etc.

0.35 

V Peak

11. Flammability - Back Cover

V0

UL94

12.  CSA Compliance 

Safety 

CSA 60065

EMC 

GRR Part II

13. UL Compliance 

Safety 

UL6500

EMC 

FCC Part15 ClassA

FCC Part15 ClassB

14.  IEC Compliance 

Safety 

IEC60065

EMC 

CISPR

15. CE Compliance

Safety

EN60065

EMC

EN55013, EN55020

No

Item

Min 

Typ

Max 

Unit 

Remark

1.

AC Power Shut Down Voltage,SET

90 

264 

Vac

2.

DC Voltage,Module Logicvoltage(Vcc)

4.5

5.0 

5.5

11.4 

12.0 

12.6

Vdc

3.

DC Voltage,VSC 12Vcc 

11.4 

12 

12.6 

Vdc

4.

DC Voltage,VSC St-By

4.94 

5.2 

5.46 

Vdc

23.8 

24

25.2 

Vdc 

PSU

5.

DC Voltage,Sound amp Vcc 

19 

20 

21 

Vdc 

LIPS

14.25 

15 

15.75 

Vdc 

LIPS

6.

DC Voltage,Tuner +B 

4.8 

5.0 

5.2 

Vdc

- 8 -

C

2009

No

Item 

Min 

Typ 

Max 

Unit 

1

SIG Qualification

Profile 

Protocol

RF Test

2

Wireless test(R &TTE) 

Wireless RF : EN 300 328

Wireless EMC : 301 489

3

CE-EMC(TV &MNT) 

TV : EN 55013 /EN 55020

MNT : EN 550222 /EN55024

4

Bluetooth module voltage 

3.0 

3.3 

3.6 

Voltage

5

Operation Temperature range 

-40

85 

C

6

Storage Temperature range 

-40

105 

C

7Output Power

-6

4 

dBm

8

Frequency Range 

2.402 

2.480 

GHz   

9

Impedance at Antenna 

50 

Ohm

10

Sensitivity level (single slot)

-70 

-82 

dBm

11

Sensitivity level (multi slot)

-70

-80

dBm

12

∆F1 avg

145 

175

kHz

13

∆F2 max

115

kHz

14

∆F2 avg /∆F1 avg

80 

kHz

15

ICFT 

-75

75 

kHz

16

Drift 

-25 

25 

kHz

17Adjacent channel power(+-2Mhz)

-20 

dBm

18

Adjacent channel power(+-3Mhz)

-40 

dBm

19

Adjacent channel power(+-4Mhz)

-40 

dBm

20

Operation Distance 

10 

m

21

Operation Degree 

-45

0 

45 

Deg