LG 42PG6300-ZA (CHASSIS:PD85A) Service Manual ▷ View online
7
5. MODEL General Specification
No
Item
Specification
Remark
1.
Market
EU ( Finland Only )
2. Broadcasting
system
PAL BG, DVB-T, DVB-C
3. Receiving
system
Analog : Upper Heterodyne
DVB-T : COFDM
DVB-C : QAM
DVB-T : COFDM
DVB-C : QAM
4.
Scart Jack (2EA)
PAL,
Full SCART: 1, Half SCART: 1
5.
Video Input RCA(1EA)
PAL,
6.
S-Video Input (1EA)
PAL,
7.
Component Input(1EA)
Y/Cb/Cr, Y/ Pb/Pr
8.
RGB PC Input(1EA)
RGB-PC
Analog (D-SUB 15PIN)
9. HDMI
Input(3EA)
HDMI1(DTV)/DVI, HDMI2(DTV),
HDMI3(DTV)
HDMI3(DTV)
PC (HDMI version 1.2),
Support HDCP
Support HDCP
10. Audio Input(3EA)
RGB/DVI Audio, Component, AV
L/R Input
11. SPDIF out(1EA)
SPDIF out
12. RS-232(1EA)
D-SUB 9 Pin
Service Only
6. PDP Module General Specification
6.1 42" PDP Module
NO.
Item
Specification
Unit Remark
1.
Display Screen Device 42 inch wide Color Display Module
42PG6300
2. Aspect
Ratio
16:9
3.
PDP Module
1.PDP42G110235, RGB Closed Type, Film Filter
4. Operating
Environment
1) Temp. : 0 ~ 60 deg
LGE Spec.
2) Humidity : 20 ~ 80%
5. Storage
Environment
1) Temp. : -20 ~ 60 deg
2) Humidity : 10 ~ 90%
6.
Input Voltage
AC100 ~ 240V, 50/60Hz
Maker
LG
6.2 50" PDP Module
NO.
Item
Specification
Unit Remark
1.
Display Screen Device 50 inch wide Color Display Module
50PG6300
2. Aspect
Ratio
16:9
3.
PDP Module
PDP501G110223, RGB Closed Type, Film Filter
4. Operating
Environment
1) Temp. : 0 ~ 55 deg
LGE Spec.
2) Humidity : 20 ~ 80%
5. Storage
Environment
1) Temp. : -20 ~ 60 deg
2) Humidity : 10 ~ 90%
6.
Input Voltage
AC100 ~ 240V, 50/60Hz
Maker
LG
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
6
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application Range.
This spec sheet is applied to the 42"/50" PDP TV used PG6300 chassis.
2. Specification
Each part is tested as below without special appointment
2.1 Temperature : 25±5°C(77±9°F), CST : 40±5°C
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage (100~240V@ 50/60Hz)
• Standard Voltage of each products is marked by models.
2.4 Specification and performance of each parts are followed each drawing and specification by part
number in accordance with BOM.
2.5 The receiver must be operated for about 5 minutes prior to the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
Safety : CE, IEC specification / EMC : CE, IEC
4. General Specification
No.
Item
Specification
Remark
1. Video input applicable system
PAL -B/G
2. Receivable Broadcasting System
1) PAL- B/G
2) DVB-T
3) DVB-C
2) DVB-T
3) DVB-C
EU(Finland Market)
3. RF Input Channel
VHF : E2 ~ E12
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S41
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S41
Analog TV Receiving
Range
Range
4. Input Voltage
AC 100 ~ 240 V / 50Hz, 60Hz
5. Market
EU ( Finland )
6. Picture Size
42 inch
50 inch
50 inch
42PG6300
50PG6300
50PG6300
7. Tuning System
Analog : FVS 99 program
DVB-T : 200 ( TV/Radio Channel )
DVB-C : 200 ( TV/Radio Channel )
DVB-T : 200 ( TV/Radio Channel )
DVB-C : 200 ( TV/Radio Channel )
8. Operating Environment
1) Temp : 5 ~ 35 deg
2) Humidity : 10 ~ 90 %
2) Humidity : 10 ~ 90 %
9. Storage Environment
3) Temp : -20 ~ 50 deg
4) Humidity : 10 ~ 90 %
4) Humidity : 10 ~ 90 %
10. Display
PDP Module
LGE ( 42”, 50” )
8
7. Optical Feature
7.1 42" PDP Module
- 42G1A Module, SET With 38% Glass Filter, 60Hz (This data at 50Hz is about 80% level of 60Hz data)
for more details, refer to the module spec.
No.
Item
Min.
Typ.
Max.
Unit
Remark
1.
White Peak Brightness
360 460
cd/m
2
(*) Peak Brightness Mode
-1/100 white Window pattern
(Typically 1% Window size)
-100IRE (255Gray)
- Picture: Vivid (Medium)
- Input: HDMI-PC
- Picture: Vivid (Medium)
- Input: HDMI-PC
(1920*1080 60Hz)
*Peak Brightness Condition may
Slightly different between sets.
164 205
cd/m
2
25/100 white Window pattern
2.
White average brightness
50
60
-
cd/m²
- 100% Window White Pattern
- 100IRE(255Gray)
- Picture: Vivid(Medium )
- 100IRE(255Gray)
- Picture: Vivid(Medium )
3.
Brightness uniformity
-10
0
+10
%
- 85IRE(216Gray) 100% Window
White Pattern
- Picture: Vivid(Medium)
4.
Color
Coordinate
Coordinate
White
X
0.270 0.285 0.300
- White : 85IRE(216Gray)
100% Window White Pattern
- R/G/B : 100IRE(255Gray)
100% Window White Pattern
- Picture: Vivid(Medium )
- 100% Window
- 100% Window
Y
0.278 0.293 0.308
Red
X
0.650 0.660 0.670
Y
0.318 0.328 0.338
Green
X
0.242 0.257 0.272
Y
0.657 0.672 0.687
Blue
X
0.138 0.148 0.158
Y
0.060 0.070 0.080
5.
Color Coordinate
Uniformity
Uniformity
-0.01 Average
+0.01
- 85IRE 100% Window White Pattern
- Picture: Vivid(Medium)
- Picture: Vivid(Medium)
6. Contrast ratio
at dark room
15,000:1 30,000:1
-1/100 white window pattern
(Peak mode)
-100IRE(255Gray)
-Picture: Vivid(Medium)
-Picture: Vivid(Medium)
-Input: HDMI-PC (1920*1080 60Hz)
7.
Color
Temperature
Temperature
Normal 8300 9300 10300
- 85IRE 100% Window White Pattern
- APC : Vivid(Medium)
Warm
5500
6500
7500
Cool
10000
11000
12000
* Above optical characteristics are should be measured by following condition.
Measured
Measured
Mode
Picture Mode
Vivid
Freshtone Off
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