LG 37LG7000 (CHASSIS:LD88F) Service Manual ▷ View online
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This specification is applied to LD88F chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature : 25 ± 5°C(77 ± 9°F), CST : 40 ± 5°C
(2) Humidity : 65% ± 10%
(3) Power : Standard input voltage (100-240V~, 50/60Hz)
(2) Humidity : 65% ± 10%
(3) Power : Standard input voltage (100-240V~, 50/60Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance : LGE TV test method followed
(2) Demanded other specification
(2) Demanded other specification
Safety : CE, IEC Specification
EMC
EMC
: CE, IEC
No.
Item
Specification Remark
1
Display Screen Device
37 inch Color TFT-LCD Module(LPL)
LCD
2
Aspect Ratio
16:9
3
LCD Module
Pixel Format: 1920 horiz. By 1080 vert. pixels
RGB stripe arrangement
4
Operating Environment
1) Temp. : 0 ~ 40 deg
2) Humidity : 20 ~ 80%
LGE SPEC
5
Storage Environment
3) Temp. : -20 ~ 60 deg
4) Humidity : 10 ~ 90 %
6
Input Voltage
AC100-240V, 50/60Hz
Maker LG
3 General Specification(LCD Module)
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4. Model Specification
No.
Item
Specification Remark
1
Market
Austria, Belgium, Bulgaria, Croatia, Czech, Denmark, Finland,
25 Country -> 27 country
France, Germany, Greece, Hungary, Italy, Luxembourg, UK
Morocco, Netherlands, Norway, Poland, Portugal, Romania,
Russia, Serbia,Slovenia, Spain, Sweden, Switzerland, Turkey,
2
Broadcasting system
1) PAL/SECAM BG
EU (PAL Market)
2) PAL/SECAM DK
3) PAL I/II
4) SECAM L/L’
5) DVB T
3
Receiving system
Analog : Upper Heterodyne
Digital : COFDM
4
Scart Jack (2EA)
PAL, SECAM
Scart 1 Jack is Full scart and support
RF-OUT(Analog)
Scart 2 jack is Half scart and support
MNT-OUT.
5
Video Input (1EA)
PAL, SECAM, NTSC
Side AV
6
S-Video Input (1EA)
PAL, SECAM, NTSC
Side AV
7
Component Input (1EA) Y/Cb/Cr, Y/ Pb/Pr
8
RGB Input
RGB-PC
Analog (D-Sub 15Pin)
9
HDMI Input (4EA)
HDMI-PC
HDMI1/DVI, HDMI2, HDMI3, HDMI4
HDMI-DTV
All HDMI inputs support V1.3 of HDMI
10
Audio Input (3 EA)
RGB/DVI Audio, Component, AV
L/R Input
11
SPDIF Out(1 EA)
SPDIF Out
12
USB
For SVC, S/W Download, X-Studio
Side(X-Studio Only Series)
13
Bluetooth
Bluetooth Phone(JPEG), Headset
32/37/42/47/52LG7000 models
- 8 -
No. Resolution
H-freq(kHz)
V-freq(Hz)
Pixel
clock(MHz)
Proposed
1 720*480
15.73
59.94
13.500
SDTV,
DVD
480I(525I)
2 720*480
15.75
60.00
13.514
SDTV,
DVD
480I(525I)
3
720*576
15.625
50.00
13.500
SDTV, DVD 576I(625I) 50Hz
4 720*480
31.47
59.94
27.000
SDTV
480P
5 720*480
31.50
60.00
27.027
SDTV
480P
6
720*576
31.25
50.00
27.000
SDTV 576P 50Hz
7 1280*720
44.96
59.94
74.176
HDTV
720P
8 1280*720
45.00
60.00
74.250
HDTV
720P
9
1280*720
37.50
50.00
74.25
HDTV 720P 50Hz
10 1920*1080
33.72
59.94
74.176
HDTV
1080I
11 1920*1080
33.75
60.00
74.250
HDTV
1080I
12
1920*1080
28.125
50.00
74.250
HDTV 1080I 50Hz,
13
1920*1080
56.25
50
HDTV 1080P
14
1920*1080
67.5
60
HDTV 1080P
5. Component Video Input (Y, P
B
, P
R
)
No. Resolution
H-freq(kHz)
V-freq(Hz)
Pixel
clock(MHz)
Proposed
Remark
1.
720*400
31.468
70.08
28.32
2.
640*480
31.469
59.94
25.17
VESA
3.
800*600
37.879
60.31
40.00
VESA
4.
1024*768
48.363
60.00
65.00
VESA(XGA)
5.
1280*768
47.78
59.87
80.125
VESA(WXGA)
6
1360*768
47.72
59.80
84.625
VESA(WXGA)
7
1280*1024
63.98
60.02
108.
SXGA
FULL HD only
8
1400*1050
65.317
59.979
121.75
SXGA
FULL HD only
9.
1920*1080
66.587
59.934
138.5
WUXGA
6. RGB input (Analog PC)
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