LG 37LC2RR (CHASSIS:MF-056M) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4.General Specification(TV)
1. Application range
1) This spec sheet is applied all of the 42" LCD TV with
MF056M chassis.
2) Not included spec and each product spec in this spec sheet
apply correspondingly to the following each country
standard and requirement of Buyer
standard and requirement of Buyer
2. Specification
Each part is tested as below without special appointment.
1) Temperature
: 20±5°C
2) Relative Humidity
: 65±10%
3) Power Voltage
: Standard input voltage
(100~240V@50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance : LGE TV test method followed
2) Demanded other specification
2) Demanded other specification
Safety : UL, CSA, IEC specification
EMC : FCC, ICES, IEC specification
EMC : FCC, ICES, IEC specification
No
Item
Specification
Remark
1.
Video input applicable system
PAL-D/K, B/G, I, NTSC-M, SECAM
NTSC 4.43
2.
Receivable Broadcasting System
1) PAL/SECAM BG
NTSC M(Option)
2) PAL/SECAM DK
3) PAL I/I
4) SECAM L/L'
3.
RF Input Channel
VHF : E2 ~ E12
PAL
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S47
L/L' : B, C, D
FRANCE
4.
Input Voltage
100 - 240V~ / 50Hz, 60Hz
5.
Market
Non-EU
6.
Picture Size
940.3mm (diagonal)
37.02 inch
7.
Tuning System
FVS 100 program
PAL, 200 PR.(Option)
8.
Operating Environment
1) Temp : 0 ~ 35 deg
2) Humidity : 10~80 %RH
9.
Storage Environment
3) Temp : -20 ~ 60 deg
4) Humidity : 10~80 %
10.
Display
LCD Module
LPL
11.
Aspect ratio
16:9
- 7 -
No
Item
Specification
Remark
1
Panel
37" TFT WXGA LCD
2
Frequency range
H : 31 ~ 61Khz
PC Input
V : 56 ~ 75Hz
3
Control Function
1) Contrast/Brightness
2) H-Position / V-Position
3) Tracking : Clock / Phase
4) Auto Configure
5) Reset
4
Component Jack
1 : Y
Middle east / China
3 : Pb
5 : Pr
7 : LINE1 Ready
9 : LINE2
11 : LINE3
13 : LINE3 Ready
5
H/V-Sync
Video
Power consumption
LED
Power ON
-
-
≤ 250W
White
Stand by
≤ 3.0W
Red
Rec. on Stand by
-
-
≤ 3.0W
Amber
AC Power off
-
-
-
*
6
LCD Module
Type Size
37"
877.0 x 516.8 x 55.5
(H)x(V)x(D)
Pixel Pitch
37"
0.200 x 0.600 x RGB
Pixel Format
1366 horiz. By 768 vert.
Pixels RGB strip arrangement
Coating
Hard coating(3H), Anti-glare
reatment of the front polarizer
Back Light
37"
20EEFL
5. General Specification
- 8 -
6.Optical Feature(LCD Module)
No
Item
Specification
Min.
Typ.
Max.
Remark
1
Viewing Angle <CR
≥10>
R/L, U/D
178
2
Luminance
Luminance(cd/m
2
)
400
500
Unit : cd/m
2
Condition:Maximum
Luminance of LCD Module
250
350
Condition:RF/AV,
PSM:Dynamic,Full White
250
300
Condition:PC/HDMI,
PSM:Dynamic,Full White
Variation
1.3
MAX/MIN
3
Contrast Ratio
CR
600
800
CR
D
(With AI)
1200
1600
4
CIE Color Coordinates
White
Wx
Typ
0.285
Typ
LPL(37")
Wy
-0.03
0.293
+0.03
Condition:216 Pattern
Red
Xr
0.640
(85IRE), PSM Dynamic
Yr
0.341
Green
Xg
0.287
Yg
0.610
Blue
Xb
0.146
Yb
0.069
7. Component Video Input (Y, C
B
/P
B
, CR/P
R
)
No
Resolution
H-freq(kHz)
V-freq.(kHz)
Pixel clock(MHz)
Proposed
1.
720*480
15.73
59.94
13.500
SDTV, DVD 480I(525I)
2.
720*480
15.75
60.00
13.514
SDTV, DVD 480I(525I)
3.
720*576
15.625
50.00
13.500
SDTV, DVD 576I(625I)
4.
720*480
31.47
59.94
27.000
SDTV 480P
5.
720*480
31.50
60.00
27.027
SDTV 480P
6.
720*576
31.25
50.00
27.000
SDTV 576P
7.
1280*720
44.96
59.94
74.176
HDTV 720P
8.
1280*720
45.00
60.00
74.250
HDTV 720P
9.
1280*720
37.50
50.00
74.25
HDTV 720P 50Hz
10.
1920*1080
33.72
59.94
74.176
HDTV 1080I
11.
1920*1080
33.75
60.00
74.250
HDTV 1080I
12.
1920*1080
28.125
50.00
74.250
HDTV 1080I 50Hz,
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