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- 5 -

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder
melts.

2.  Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as

possible to diode body.

2.  Bend the two remaining leads perpendicular y to the circuit

board.

3.  Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely crimp the leads of replacement component around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1.  Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly
connected to the affected copper pattern.

3.  Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

NOTE : Specifications and others are subject to change without notice for improvement.

No

Item

Specification

Remark

1.

Video input applicable system

PAL-D/K, B/G, I, NTSC-M, SECAM

NTSC 4.43

2.

Receivable Broadcasting System

1) PAL/SECAM BG

EU/Non-EU

2) PAL/SECAM DK

(PAL Market)

3) PAL I/I

4) SECAM L/L'

5) PAL-N/M

5),6) South America Market

6) NTSC M

3.

RF Input Channel

VHF   : E2 ~ E12 

PAL

UHF   : E21 ~ E69 

CATV  : S1 ~ S20

HYPER : S21~ S47 

L/L'  : B, C, D

FRANCE

VHF  : 2~13

NTSC

UHF  : 14~69

CATV : 1~125

VHF Low : 1 ~ M10

JAPAN

VHF High : 4~S22

UHF : S23~62

4.

Input Voltage

AC 100 ~ 240V/50Hz, 60Hz 

5.

Market

UK

6.

Picture Size

800.4mm

32inch

940.3mm

37inch

1067.308mm

42inch

7.

Tuning System

FVS 100 program

PAL, 200 PR.(Option)

FS

NTSC

8.

Operating Environment

1) Temp  : 0 ~ 40 deg

2) Humidity : 10~90 %

9.

Storage Environment

3) Temp  : -20 ~ 50 deg

4) Humidity : 10~90 %

10.

Display

LCD Module

LPL

- 7 -

No

Item

Specification

Remark

1

Panel

32", 37", 42" TFT WXGA LCD

2

Frequency range

H : 31 ~ 61Khz

PC Input

V : 56 ~ 75Hz

3

Control Function

1) Contrast/Brightness

2) H-Position / V-Position

3) Tracking : Clock / Phase

4) Auto Configure

5) Reset

4

Component Jack

1 : Y

Middle east / NTSC Area

3 : Pb

5 : Pr

5

H/V-Sync

Video

Power consumption 

LED 

Power ON

-

-

≤

150W(32")

Green

≤

190W(37")

Green

≤

240W(42")

Stand by

≤

3.0W

Red

Power off

-

-

-

*

6

LCD Module

Type Size

32"

760.0x450.0x48.0(mm)

(H)x(V)x(D)

37"

877.0 x 516.8 x 55.5(mm)

42"

1006 x 610 x 56(mm)

Pixel Pitch

32"

0.1702 x 0.5107 x RGB(mm)

37" 

0.200 x 0.600 x RGB

42"

0.227 x 0.681 x RGB

Pixel Format

1366 horiz. By 768 vert. 

Pixels RGB strip arrangement

Coating

Hard coating(3H), Anti-glare 

reatment of the front polarizer,

Back Light

32"

18EEFL

37"

20EEFL

42"

20CCFL

- 8 -

No

Specification

Proposed

Resolution

H-freq(kHz)

V-freq(Hz)

1.

720x480

15.73

60

SDTV, DVD 480i

2.

720x480

15.63

59.94

SDTV, DVD 480i

3.

720x480

31.47

59.94

EDTV 480p

4.

720x576

15.625

50.00

SDTV, DVD 625 Line

5.

720x576

31.25

50.00

HDTV 576p

6.

1280x720

45.00

60.00

HDTV 720p

7.

1280x720

44.96

59.94

HDTV 720p

8.

1920x1080

31.25

50.00

HDTV 1080i 

9.

1920x1080

33.75

60.00

HDTV 1080i 

10.

1920x1080

33.72

59.94

HDTV 1080i 

No

Item

Specification

Min.

Typ.

Max.

Remark

1

Viewing Angle <CR>10>

R/L, U/D

178, 178

2

Luminance

Luminance(cd/m

2

)

400

500

32/37/42

Variation

1.3

MAX/MIN

3

Contrast Ratio

CR(32", 37")

600

800

All White/All Black

CR(42")

400

550

All White/All Black

CR

D

(32", 37")

1200

1600

All White/All Black

CR

D

(42")

800

1100

4

CIE Color Coordinates

White 

Wx

Typ

0.285

Typ

LPL(32")

Wy

-0.03

0.293

+0.03

Red

Xr

0.640

Yr

0.343

Green

Xg

0.280

Yg

0.605

Blue

Xb

0.145

Yb

0.065

White Wx

Typ

0.285

Typ

LPL(37")

Wy

-0.03

0.293

+0.03

Red

Xr

0.640

Yr

0.341

Green

Xg

0.287

Yg

0.610

Blue

Xb

0.146

Yb

0.069

White Wx

Typ

0.281

Typ

LPL(42")

Wy

-0.03

0.293

+0.03

Red

Xr

0.639

Yr

0.340

Green

Xg

0.284

Yg

0.604

Blue

Xb

0.145

Yb

0.064