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- 5 -

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder
melts.

2.  Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as

possible to diode body.

2.  Bend the two remaining leads perpendicular y to the circuit

board.

3.  Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely crimp the leads of replacement component around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1.  Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly
connected to the affected copper pattern.

3.  Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

NOTE : Specifications and others are subject to change without notice for improvement.

This specification is applied to the LCD TV used LA92B
chassis.

Each part is tested as below without special appointment.

1) Temperature :  25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity :  65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)

* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

1) Performance: LGE TV test method followed 
2) Demanded other specification 

- Safety: UL, CSA, IEC specification, CE
- EMC: FCC, ICES, IEC specification, CE

No

Item Specification 

Remark

1

Receiving System 

ATSC/ NTSC-M

2

Available Channel

1) VHF : 02 ~ 13

2) UHF : 14 ~ 69

3) DTV : 02 ~ 69

4) CATV : 01 ~135

5) CADTV : 01 ~ 135

3

Input Voltage 

AC100-240V~, 50/60Hz

N.America Mark : 110V, 60Hz

4

Market

5

Screen Size

32 inch Wide (1920 x 1080)

FHD + 120Hz

6

Aspect Ratio

16:9

7

Tuning system

FS

8

Module 

LC320WUD-SBA1(without inverter )

FHD + 120Hz

- 7 -

No.

Item Specification 

Min.

Typ.

Max.

Unit

Remark

1.

Max Luminance

Module 

400

500

cd/m

2

(Center1-point/ Full white pattern)

2.

Luminance uniformity

Luminance 

77

%

3.  Contrast Ratio

900: 1

1300: 1

40000:1(DCR)

50000:1(DCR)

4.

Color Coordinates

RED

X

0.638

Typ

Y

0.334

±0.03

GREEN

X

0.291

Y

0.607

BLUE

X

0.145

Y

0.062

WHITE

X 0.279

Y

0.292

5.  Color Temperature

Cool

0.276 

Typ.

85% Full white pattern

0.283 

±0.015

**The W/B Tolerance is

Medium

0.285 

± 0.015 for Adjustment

0.293 

Dynamic contrast :off

Warm

0.313

Dynamic color :off

0.329

Energy saving mode :off

6.

Color Distortion, DG

10.0 

%

7.

Color Distortion,DP 

10.0 

deg

8.

Color S/N,AM/FM 

43.0 

dB

9.

Color Killer Sensitivity

-80 

dB 

* Max Luminance &Contrast measure standard specification

- Max Luminance measure specification
1) In non-impressed condition, measure peak brightness displayable as much as possible LCD module.
2) Measuring instrument: CA-210 or a sort of Color Analyzer.
3) Pattern Generator :VG- 828 or a sort of digital pattern generator (displayable Full White &1/25 White Window pattern)
4) Measure condition
• Test pattern: in center,1/5(H)*1/5(V) of Window Pattern (white pattern in non-impressed condition)
• SET condition: Contrast &Brightness Level 100%
• Environment condition : Dark room in the non outside light
• Video menu option condition

5) Measurement 
• Do heat-run LCD module at 30minutes in normal temperature (25°C)by using full white pattern of 15%signal level(38 gray level).
• Impress test pattern signal in 1/5(H)*1/5(V)White Window of 100%(255Gray Level)
• measure 3 times brightness of central white window,and mark peak brightness in max brightness degree
• measure the same condition in video signal /RGB signal.

Signal 

Picture Mode

Dynamic Contrast 

Dynamic Color

Black Level

RF

NTSC-M

Vivid

High High Low

AV NTSC-J  Vivid 

High 

High  High

Component 720P

Vivid 

High 

High 

High

RGB 1024x768

Vivid 

NA

NA 

NA

HDMI DTV 

720P 

Vivid 

High 

High 

Low

- 8 -

No

Specification

Remark

Resolution

H-freq(kHz)

V-freq(Hz)

Pixel Clock(MHz)

1.

720*480 

15.73 

60 

13.5135 

SDTV ,DVD 480I

2.

720*480 

15.73 

59.94 

13.5 

SDTV ,DVD 480I

3.

720*480 31.47 

60 

27.027 

SDTV 

480P

4.

720*480 31.47

59.94 

27.0 

DTV 

480P

5.

1280*720 45.00 

60.00 

74.25 

HDTV 

720P

6.

1280*720

44.96

59.94

74.176

HDTV 720P

7.

1920*1080 33.75

60.00 

74.25

HDTV 

1080I

8.

1920*1080

33.72

59.94

74.176

HDTV 1080I

9.

1920*1080

67.500

60

148.50

HDTV 1080P

10.

1920*1080

67.432 59.939 148.352

HDTV 

1080P

11.

1920*1080 27.000

24.000

74.25

HDTV 

1080P

12.

1920*1080

26.97

23.94

74.176 HDTV 

1080P

13.

1920*1080

33.75 30.000 

74.25

HDTV 

1080P

14.

1920*1080 33.71

29.97

74.176

HDTV 

1080P

No

Specification

Proposed

Resolution

H-freq(kHz)

V-freq(Hz)

Pixel Clock(MHz)

DDC

1.

640*350 31.468  70.09 

25.17

EGA

X

2.

720*400 31.469  70.08

28.32 

DOS 

O

3.

640*480 31.469  59.94

25.17 

VESA(VGA)

O

4.

800*600 37.879  60.31

40.00 

VESA(SVGA)

O

5.

1024*768 48.363 

60.00 

65.00 

VESA(XGA)

O

6.

1280*768

47.776

59.870 79.5

CVT(WXGA)

X

7.

1360*768 47.712 

60.015 

85.50

VESA 

(WXGA)

X

8.

1280*1024

63.981

60.020

108.00 VESA 

(SXGA)

O

9.

1600*1200

75.00

60.00 162 

VESA 

(UXGA)

O

10.

1920*1080

66.587 59.934 148.5 

HDTV 

1080P O