LG 32LA61XX / 32LA6130 / 32LA613B (CHASSIS:LB31B) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This specification is applied to the LED TV used LB31B/
LB36B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
No.
Item
Specification
Remarks
1.
Market
(PAL/DVB Market)
2.
Broadcasting system
1) PAL/SECAM-B/G/D/K
2) PAL-I
3) NTSC-M
4) DVB-T
3.
Channel Storage
ATV - 135EA, DTV - 1000EA
4.
Receiving system
Analog : Upper Heterodyne
Digital : COFDM(DVB-T)
► DVB-T
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
5.
Video(Composite Input) PAL, SECAM, NTSC
4 System : PAL, SECAM, NTSC, PAL60
6.
Component Input
Y/Cb/Cr, Y/Pb/Pr
7.
HDMI Input
HDMI1-DTV/DVI
HDMI2-DTV/DVI
8.
SPDIF out
SPDIF out
9.
USB Input
For My Media(Movie/Photo/Music List) and SVC
10. Headphone
- 7 -
5. Component Video Input (Y, C
b
/P
b
, C
r
/P
r
)
No.
Resolution
H-freq(kHz)
V-freq(Hz)
Porposed
1
720×480
15.73
60.00
SDTV, DVD 480i
2
720×480
15.63
59.94
SDTV, DVD 480i
3
720×480
31.47
59.94
480p
4
720×480
31.50
60.00
480p
5
720×576
15.625
50.00
SDTV, DVD 625 Line
6
720×576
31.25
50.00
HDTV 576p
7
1280×720
45.00
50.00
HDTV 720p
8
1280×720
44.96
59.94
HDTV 720p
9
1280×720
45.00
60.00
HDTV 720p
10
1920×1080
31.25
50.00
HDTV 1080i
11
1920×1080
33.75
60.00
HDTV 1080i
12
1920×1080
33.72
59.94
HDTV 1080i
13
1920×1080
56.250
50
HDTV 1080p
14
1920×1080
67.5
60
HDTV 1080p
6. HDMI Input : Refer to adjust specification about EDID data.
6.1. DTV mode
No.
Resolution
H-freq(kHz)
V-freq.(kHz)
Pixel clock(MHz)
Proposed
1.
720*480
31.469 / 31.5
59.94 / 60
27.00/27.03
SDTV 480P
2.
720*576
31.25
50
54
SDTV 576P
3.
1280*720
37.500
50
74.25
HDTV 720P
4.
1280*720
44.96 / 45
59.94 / 60
74.17/74.25
HDTV 720P
5.
1920*1080
33.72 / 33.75
59.94 / 60
74.17/74.25
HDTV 1080I
6.
1920*1080
28.125
50.00
74.25
HDTV 1080I
7.
1920*1080
26.97 / 27
23.97 / 24
74.17/74.25
HDTV 1080P
8.
1920*1080
33.716/33.75
29.976/30.00
74.25
HDTV 1080P
9.
1920*1080
56.250
50
148.5
HDTV 1080P
10.
1920*1080
67.43 / 67.5
59.94 / 60
148.35/148.50
HDTV 1080P
6.2. PC mode
No.
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
Proposed
Remark
1.
640*350 @70Hz
31.468
70.09
25.17
EGA
2.
720*400 @70Hz
31.469
70.08
28.321
DOS
3.
640*480 @60Hz
31.469
59.940
25.175
VESA(VGA)
4.
800*600 @60Hz
37.879
60.31
40.000
VESA(SVGA)
5.
1024*768 @60Hz
48.363
60.00
65.000
VESA(XGA)
6
1152*864 @60Hz
54.348
60.053
80.002
VESA
7.
1280*1024 @60Hz 63.981
60.020
108
VESA(SXGA)
FHD only(Support to HDMI-PC)
8.
1360*768 @60Hz
47.712
60.015
85.5
VESA(WXGA)
9.
1920*1080 @60Hz 67.5
60.0
148.5
WUXGA
(Reduced blanking)
FHD only(Support to HDMI-PC)
- 8 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with
LB31B/LB36B chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 100-220 V~, 60 Hz
(6) Adjustment equipments
: Color Analyzer(CA-210 or CA-110), Service remote control.
(7) Push the “IN STOP" key - For memory initialization.
3. Main PCB check process
▪ APC - After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
(2) Set as below, and then click "Auto Detect" and check "OK"
message.
If "Error" is displayed, check connection between computer,
jig, and set.
(3) Click "Read" tab, and then load download file(XXXX.bin)
by clicking "Read"
(4) Click "Connect" tab. If "Can't" is displayed, check connection
between computer, jig, and set.
(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If version of update file in USB Stick is lower, it will not
work. But version of update file is higher, USB data will be
detected automatically.
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at first.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
(1)
filexxx.bin
(4)
(5)
(6)
(7)...........OK
filexxx.bin
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
Click on the first or last page to see other 32LA61XX / 32LA6130 / 32LA613B (CHASSIS:LB31B) service manuals if exist.