LG 23LCD-H5 / 23L-500LT (CHASSIS:LJ71A) Service Manual ▷ View online
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
- 6 -
1. Application range
This specification sheet is applied to the 20”/ 23” Wide LCD
Digital TV for HLS used LJ71A chassis.
Digital TV for HLS used LJ71A chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Power : Standard input voltage (100V, 50/60Hz)
(2) The TV set must be operated for about 30 minutes prior to
(2) The TV set must be operated for about 30 minutes prior to
the adjustment.
3. Test method
(1) Performance : LGE TV test method followed
(2) Demanded other specification
(2) Demanded other specification
Safety : JQA Specification
EMC : JQA Specification
EMC : JQA Specification
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
No
Item
Specification
Remark
1
Video input applicable system
NTSC-M
2
Receivable Broadcasting System
NTSC-M/ISDB-T/ISDB-S
3
RF Input Channel
1) VHF
: 1 ~ 12
2) UHF
: 13 ~ 62
3) CATV
: C13 ~ C38
4) Terr. digital : 000 ~ 999
(Logical CH Number)
5) BS digital
: 000 ~ 999
(Logical CH Number)
6) CS digital
: 000 ~ 999
(Logical CH Number)
4
Input Voltage
100V, 50/60Hz
5
Picture size
20inch
20LCD-H5
23inch
23LCD-H5
6
Tuning System
FS
7
Operating Environment
Temp : 10 ~ 35 deg
Humidity : 20~85 %RH
8
Storage Environment
Temp : -20 ~ 50 deg
Humidity : 10~90 %RH
9
Display
LCD Module
1
Viewing Angle
R/L
65/65
80/80
<CR≥10>
U/D
65/55
80/60
2
Luminance
Luminance (cd/m2)
360
450
3
Contrast Ratio
CR
550
700
4
CIE Color Coordinates
WHITE
Wx
Typ.
0.280
Typ.
Wy
-0.03
0.292
+0.03
RED
Rx
0.638
Ry
0.337
GREEN
Gx
0.299
Gy
0.604
BLUE
Bx
0.145
By
0.059
5. Module Specification
5.1. 23”LCD Module (AUO T230XW01 V0)
5.1. Optical characteristic specifications
- 7 -
1
Display area
508.152 (H) x 285.696 (V)
mm
2
Outline dimension
546.0 (H) x 318.3 (V) x 46.0 (D)
mm
Max
3
Number of Pixels
1366 (H) x 768(V)
1Pixel=3RGB Cells
4
Cell pitch
327µm (H) x 327µm (V)
µm
1Pixel=3RGB Cells
5
Color arrangement
RGB vertical stripe
6
Weight(net)
3.3
Kg
Typ.
7
Operating Environment
Temperature
0 ~ 50
deg
Humidity
10 ~ 90
%
8
Storage Environment
Temperature
-20 ~ 60
deg
Humidity
10 ~ 90
%
9
Electrical Interface
LVDS
10
Back light Unit
8 CCFL (6 lamps)
11
R/T
8ms
Typ.
No.
Item
Min
Typ.
Max
Unit
Remark
No.
Item
Specification
Min
Typ.
Max
Remark
- 8 -
7. Component Video Input (Y, P
B
, P
R
)
No
Resolution
H-freq(kHz)
V-freq.(kHz)
Pixel clock(MHz)
Proposed
1
720*480
15.73
59.94
13.500
SDTV, DVD 480I
2
720*480
15.75
60.00
13.514
SDTV, DVD 480I
3
720*480
31.47
59.94
27.000
SDTV 480P
4
720*480
31.50
60.00
27.027
SDTV 480P
5 1280*720
44.96
59.94
74.176
HDTV
720P
6 1280*720
45.00
60.00
74.250
HDTV
720P
7 1920*1080
33.72
59.94
74.176
HDTV
1080I
8 1920*1080
33.75
60.00
74.250
HDTV
1080I
6. Model Specification
No.
Item
Specification
Remark
1
Analog-terrestrial
Broadcasting system
NTSC-M
RF Input Channel
VHF : 1~12
UHF : 13~62
CATV : C13~C38
2
Digital-terrestrial
Broadcasting system
ISDB-T
RF Input Channel
000~999 CH.
Logical CH Number
3
Digital-BS/SC
Broadcasting system
ISDB-S
RF Input Channel
000~999 CH.
4
Video Input
NTSC-3.58
NTSC4.43/PAL/PAL60/SECAM -> No Guarantee
5
S-Video Input
NTSC-3.58
NTSC4.43/PAL/PAL60/SECAM -> No Guarantee
6
D-terminal Input
Y/ Pb/Pr(D4: 480i/480P/720P/1080i)
576i/576p/720p(50Hz)/1080i
(50Hz) -> No Guarantee
7
HDMI Input
HDMI
8
Audio Input
L/R Input
3EA : CVBS, S-video, D-terminal
9
Digital Optical Audio output
AAC 5.1c Output
Available for Digital TV only
PCM 2ch Output
10
Modem
2400bps(max)
11
Conditional Acess System
B-CAS System
12
EPG
13
DATA Broadcasting
8. HDMI input (DTV)
No
Resolution
H-freq(kHz)
V-freq.(kHz)
Pixel clock(MHz) Proposed
1
720*480
15.73
59.94
13.500
SDTV 480I
2
1440*480
15.75
60.00
27.027
SDTV 480I
3
720*576
15.63
50.00
13.500
SDTV 576I
4
1440*576
15.63
50.00
27.000
SDTV 576I
5
720*480
31.47
59.94
27.000
SDTV 480P
6
720*480
31.50
60.00
27.027
SDTV 576P
7
720*576
31.25
50.00
27.000
SDTV 576P
8
1280*720
37.5
50.00
74.250
HDTV 720P
9
1280*720
44.96
59.94
74.176
HDTV 720P
10
1280*720
45.00
60.00
74.250
HDTV 720P
11
1920*1080
33.72
59.94
74.176
HDTV 1080I
12
1920*1080
33.75
60.00
74.250
HDTV 1080I
13
1920*1080
28.125
50.00
74.250
HDTV 1080I
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