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- 5 -

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal
1.  Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the solder
melts.

2.  Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the
IC.

Replacement
1.  Carefully insert the replacement IC in the circuit board.
2.  Carefully bend each IC lead against the circuit foil pad and

solder it.

3.  Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement
1.  Remove the defective transistor by clipping its leads as close as

possible to the component body.

2.  Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3.  Bend into a "U" shape the replacement transistor leads.
4.  Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement
1.  Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3.  Carefully remove the transistor from the heat sink of the circuit

board.

4.  Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6.  Replace heat sink.

Diode Removal/Replacement
1.  Remove defective diode by clipping its leads as close as

possible to diode body.

2.  Bend the two remaining leads perpendicular y to the circuit

board.

3.  Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4.  Securely crimp each connection and solder it.
5.

Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement
1.  Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2.  Securely crimp the leads of replacement component around

notch at stake top.

3.  Solder the connections.

CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1.  Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2.  carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3.  Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4.  Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1.  Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2.  Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly
connected to the affected copper pattern.

3.  Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

This spec sheet is applied LED LCD TV with 22” LA01T
chassis. 

Each part is tested as below without special appointment.

1) Temperature:  25 ºC  ± 5 ºC 
2) Relative Humidity:  65  ± 10 %
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)

* Standard Voltage of each product is marked by models

4) Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

1) Performance: LGE TV test method followed 
2) Demanded other specification 

- Safety : UL, CSA, IEC specification 
- EMC: FCC, ICES, IEC specification 

- 6 -

NOTE : Specifications and others are subject to change without notice for improvement.

No

Item

Specification

Remark

1

Receivable System

1) ATSC / NTSC-M 

2

Available Channel

1) VHF : 02 ~ 13

2) UHF : 14 ~ 69

3) DTV : 02 ~ 69

4) CATV : 01 ~ 135

5) CADTV : 01 ~ 135

3

Input Voltage

1) AC 100 - 240V~  50/60Hz   

Mark : 110V, 60Hz

4

Market

5

Screen Size

22 inch Wide (1366x768) 

HD + 60Hz 

22LV2500-UA(AUO) 

6

Aspect Ratio

16:9

7

Tuning System

FS

8

LCD Module

M215HW01-VB 

AUO 

22LV2500-UA(AUO) 

9

Operating Environment

Temp  : 0 ~ 40 deg

Humidity : ~ 80 %

10

Storage Environment

Temp  : -20 ~ 60 deg

Humidity : -85 %

- 7 -

No.

Item

Min

Typ

Max

Unit

Remarks

1

Max Luminance 

240

300

cd/m

2

22LV2500-UA(AUO) 

(Center 1-point / Full White Pattern) 

2

Luminance uniformity

3

Color coordinate

RED

X

Typ.

0.635

Typ.

22LV2500-UA(AUO) 

(Default)

Y

-0.03

0.349

+0.03

GREEN

X

0.332

Y

0.619

BLUE

X

0.155

Y

0.055

WHITE

X

0.313

Y

0.329

4

Contrast ratio

Module

700

1000

22LV2500-UA(AUO) 

DCR

800,000:1

1,000,000:1

AUO 

5

Color Temperature

Cool

0.283 

0.285 

0.287 

9300K The W/B Tolerance is ±0.015

0.291 0.293

0.295

for picture quality by DQA

Medium

0.293

0.295

0.297

8000K

0.303

0.305

0.307

Warm

0.311

0.313

0.315

6500K

0.327

0.329

0.331

- 8 -

No Resolution 

H-freq(kHz) V-freq.(kHz)  Pixel 

clock 

Proposed 

1. 

720*480 

15.73 

60 

13.5135   

SDTV ,DVD 480I 

2. 

720*480 

15.73 

59.94 

13.5   

SDTV ,DVD 480I 

3. 

720*480 

31.50 

60 

27.027   

SDTV 480P

4. 

720*480 

31.47 

59.94 

27.0   

SDTV 480P

5. 

1280*720 

45.00 

60.00 

74.25   

HDTV 720P

6.

1280*720

44.96

59.94

74.176

HDTV 720P

7. 

1920*1080 

33.75 

60.00 

74.25   

HDTV 1080I

8. 

1920*1080 

33.72 

59.94 

74.176   

HDTV 1080I

9. 

1920*1080 

67.500 

60 

148.50   

HDTV 1080P

10.

1920*1080

67.432

59.94

148.352

HDTV 1080P

11.

1920*1080

27.000

24.000

74.25

HDTV 1080P

12.

1920*1080

26.97

23.976

74.176

HDTV 1080P

13.

1920*1080

33.75

30.000

74.25

HDTV 1080P

14.

1920*1080

33.71

29.97

740176

HDTV 1080P

No Resolution 

H-freq(kHz) V-freq.(kHz)  Pixel 

clock 

Proposed 

PC

DDC

1. 

640*350 

31.468 

70.09 

25.17   

EGA 

X  

2. 

720*400 

31.469 

70.08 

28.32   

DOS 

O 

3. 

640*480 

31.469 

59.94 

25.17   

VESA(VGA) 

O

4.

800*600 

37.879 

60.31 

40.00   

VESA(SVGA) 

O 

5. 

1024*768 

48.363 

60.00 

65.00   

VESA(XGA) 

O 

6.

1280*768

47.776

59.870

79.5

CVT(WXGA)

X

7. 

1360*768 

47.712 

60.015 

85.50  

VESA(WXGA)   

X