LG 22LG3DDH (CHASSIS:LA96E) Service Manual ▷ View online
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5.
5.
Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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1. Application range
This specification is applied to the 22” Wide LCD TV used
LA96E chassis.
LA96E chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 20±5ºC
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-120V~, 50/60Hz)
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-120V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
2) Demanded other specification
- Safety: UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
- EMC: FCC, ICES, IEC specification
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
No
Item
Specification
Remark
1
Receivable System
VSB/64& 256 QAM/NTSC-M
2
Available Channel
VHF : 02 ~ 13
UHF : 14 ~ 69
DTV : 02 ~ 69
CATV : 01 ~ 135
CADTV : 01 ~ 135
3
Input Voltage
AC 100-120V, 50/60Hz
Mark : 110V, 60Hz
4
Market
5
Screen Size
22 Inch Wide (1680 x 1050 : 21.995 inch)
6
Aspect Ratio
16:10
7
Tuning System
FS
8
LCD Module
LM220WE1-TLM1 (LGD)
9
Operating Environment
Temp : 0 ~ 40 deg
Humidity : ~ 80 %
10
Storage Environment
Temp : -20 ~ 50 deg
Humidity : 10 ~ 90 %
Model
Market
Appliance
Safety : UL1492, CSA C22.2.No.1
EMC : FCC Class B, IEC Class B
- 7 -
5. HDMI input (PC/DTV)
No
Resolution
H-freq(kHz)
V-freq.(Hz)
Pixel clock(MHz)
Proposed
PC
DDC
1.
800*600
37.879
60.31
40.00
VESA(SVGA)
O
2.
1024*768
48.363
60.00
65.00
VESA(XGA)
O
4.
1280*768
47.776
59.87
79.50
CVT(WXGA)
O
4.
1360*768
47.720
59.799
84.75
CVT(WXGA)
O
5.
1366*768
47.13
59.65
72
DTV
6.
720*480
31.469
59.94
27.00
SDTV 480P
7.
720*480
31.500
60.00
27.03
SDTV 480P
8.
1280*720
44.96
59.94
74.17
HDTV 720P
9.
1280*720
45.00
60.00
74.25
HDTV 720P
10.
1920*1080
33.72
59.94
74.17
HDTV 1080I
11.
190*1080
33.75
60.00
74.25
HDTV 1080I
12.
1920*1080
67.5
60.00
148.50
HDTV 1080P
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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied for all of the LCD TV with
LA96E chassis.
LA96E chassis.
2. Specification
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
plan which can be changed only on agreeing.
2) Power Adjustment : 100-240V~, 50/60Hz
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes
6) Adjustment equipments: Color Analyzer(CA-210 or CA-
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes
6) Adjustment equipments: Color Analyzer(CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote control
Adjustment Jig equipment, SVC remote control
3. Method of PTC MICOM Download
3.1. Connection of MICOM JIG
1) Connect port(3) with Power Code
2) Connect jack(1) with PTC Micom.
3) Connect USB Cable to the computer
4) Download Program execution (SAP Configuration)
2) Connect jack(1) with PTC Micom.
3) Connect USB Cable to the computer
4) Download Program execution (SAP Configuration)
* Notice!
Because PTC Download JIG has internal memory, it can
save download files using download program (SAP
Configuration). Push the START button (4) after file saving,
then it execute download.
save download files using download program (SAP
Configuration). Push the START button (4) after file saving,
then it execute download.
3.2. Execution of download program
(SAP Configuration)
3.2.1. Execution of SAP Configuration
(1) Select HCS12
(2) Target Frequency Settings :
(2) Target Frequency Settings :
1) Checking the factor -> Use Specified Target
Frequency…, Unsecure target….
2) Insert Target Bus Frequency -> 7372800
(3) Specify Algorithm: 9S12dt128_128k .12P
(4) Specify S Record: select download file.
(5) Checking factor: Erase Device, Blank Check Device,
(4) Specify S Record: select download file.
(5) Checking factor: Erase Device, Blank Check Device,
Program Device, Verify Device
* Notice!
Don’t check other checking boxes. You must follow fig.
(6) Push the ‘Save Image to Cyclone PRO’ button, files
transfer from PC to the Download JIG.
4. Start button
3. Power
1. Connect to Micom port of TV board.
2. Connect to computer.
3
4
1
2
5
6
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